JPH03131047A - Tab tape - Google Patents

Abstract

PURPOSE:To improve the dimensional accuracy of leads for leading out electrodes while preventing the dispersion of the positional accuracy of the leads by forming dummy leads at positions, where spaces among the leads for leading out each electrode of the surface of an electric insulating sheet are widened, and distributing the leads for leading out the electrodes and the dummy leads approximately symmetrically up and down and left and right centering around the center of an opening. CONSTITUTION:A plurality of leads 3 for leading out electrodes, end sections 3a of which are extended into an opening 2a, and dummy leads 6, end faces of which are conformed onto the circumferential surface of the opening 2a, are laminated onto the surface of a TAB film 1. The array of the leads 3 for leading out the electrodes is determined by the various conditions of the positions of the electrodes of a semiconductor element 4, a semiconductor substrate, etc., and the zones of harrow spaces among wirings and the zones of wide spaces among the wirings are mixed. The dummy leads 6 are shaped in the zones of the wide spaces, and the dummy leads 6 and the leads 3 for leading out the electrodes are distributed vertically symmetrically to a horizontal axis (an X-X axis) and bilaterally symmetrically to a vertical shaft (a Y-Y axis) centering around the center of the opening 2a respectively.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a TAB tape, more specifically an electrically insulating thin plate (
The present invention relates to a TAB tape that further improves the dimensional accuracy and positional accuracy of electrode leads laminated on the surface of a TAB film when the spacing between the wires of the electrode leads is uneven.

(Prior art) TA B (Tape AutoAated Bon)
dlng) is an automatic bonding technology using a tape-shaped film carrier, and the TAB
Tapes have conventionally been generally constructed as shown in FIGS. 2 and 3.

That is, the TAB tape 1' is an electrically insulating thin plate 2 made of a flexible material such as a synthetic resin film such as polyimide.
An opening 2a for mounting a semiconductor element is provided inside the T.
An end portion 3a is formed on the surface of the AB film 1' within the opening 2a.
It is constructed by stacking a plurality of electrode leads 3 extending from each other.

The electrode lead 3 is generally formed by laminating a metal layer such as copper foil on the entire surface of the electrically insulating thin plate 2 by adhesion or the like, and then forming a pattern by subjecting this metal layer to processing such as etching. be.

Then, a semiconductor element 4 is arranged inside the opening 2a of such TAB tape 1', and each electrode 4 of this semiconductor element 4 is
A and the end (extending end) 2a of the electrode lead 3 are electrically connected (bonded) by thermocompression bonding or the like, and then the periphery of the semiconductor element 4 and T are bonded with a sealing resin such as epoxy resin.
A semiconductor device is manufactured by integrally sealing the AB tape 1' with resin.

Here, the arrangement of the electrode leads 3 is determined by various conditions such as the position of the electrode 4a of the semiconductor element 4 and the semiconductor substrate to be mounted, and as shown in FIG. It is uniform, and may have a mixture of narrow and wide areas.

(Problem to be Solved by the Invention) As described above, when there are multiple electrode leads 3 and the spacing between the wires is uneven and narrow, the problem is difficult to solve.

When performing processing such as etching, the width of the electrode lead may change due to differences in etching speed, and processing stress and heat generated due to differences in etching speed or differences in adhesive hardening. There has been a problem in that the positions of the electrode leads may become uneven due to stress and further contraction of the TAB tape itself, resulting in misalignment during bonding.

In view of the above, it is an object of the present invention to provide an electrode lead that improves the dimensional accuracy of the lead and prevents as much as possible variations in the positional accuracy of the lead due to processing stress and thermal stress caused by etching of copper foil, etc. With the goal.

[Structure of the invention]

(Means for Solving the Problems) In order to achieve the above object, the TAB tape according to the present invention has a surface of an electrically insulating thin plate made of a flexible material with an opening formed inside the opening. It is constructed by stacking a plurality of electrode lead-out leads each having an extended end portion, and a semiconductor element is positioned within the opening, and the electrode of the semiconductor element and the extended end of the electrode lead-out lead are electrically connected. In the TAB tape which is connected to each other to form a semiconductor device, a dummy lead is provided at a place on the surface of the electrically insulating thin plate where there is a wide interval between the electrode leads, and the electrode leads are connected to each other. The dummy leads are distributed approximately symmetrically vertically and horizontally with respect to the center of the opening.

(Function) According to the present invention configured as described above, when a lead is formed by etching a copper foil or the like laminated on the surface of an electrically insulating thin plate, a dummy lead is provided to prevent the etching at this time. In addition to making the etching speed more uniform and reducing variations in etching dimensions, it also prevents positional deviation of electrode leads due to processing stress and thermal stress after etching.
Furthermore, TAB due to thermal stress generated after resin sealing
Deformations such as warping and twisting of the tape itself can be prevented as much as possible.

(Example) An embodiment of the present invention will be described below with reference to FIG.

In this embodiment, the TAB tape 1 has an electrically insulating thin plate 2 made of a flexible material such as a synthetic resin film such as polyimide, and has an opening 2a for mounting a semiconductor element inside the TAB tape 1. It is constructed by laminating on the surface a plurality of electrode lead-out leads 3 whose ends 3a extend into the openings 2a, and dummy leads 6 whose end faces match the circumferential surface of the openings 2a. There is.

That is, the arrangement of the electrode leads 3 is similar to that of the semiconductor element 4.
The spacing between the wires is determined by various conditions such as the position of the electrode 4a and the semiconductor substrate, and this results in a mixture of narrow areas and wide areas. The dummy lead 6 and the electrode lead 3 are vertically symmetrical with respect to the horizontal axis (X-X axis) centered on the center of the opening 2a.
−Y axis), and are distributed symmetrically on the left and right sides.

The electrode lead 3 and the dummy lead 6 are pattern-formed by laminating a metal layer such as copper foil on the entire surface of the electrically insulating thin plate 2 and subjecting this metal layer to processing such as etching. be.

That is, by etching the electrode leads 3 and the dummy leads 6 at the same time, the etching speed can be made more uniform, variations in etching dimensions can be reduced, and processing stress after etching can be reduced. In addition, the positional shift of the electrode lead lead due to thermal stress etc. is prevented as much as possible, and particularly weak parts of the TAB tape 1 itself are reinforced with dummy leads 6, and the TAB tape 1 itself is prevented from warping due to thermal stress generated after resin sealing. It is designed to prevent deformations such as twisting and twisting as much as possible.

Then, as shown in FIG. 3, a semiconductor element 4 is arranged inside the opening 2a of this TAB tape l, and each electrode 4a of this semiconductor element 4 and the end (extending end) of the electrode lead 3 are arranged. ) 2a by thermocompression bonding or the like, and further seal the semiconductor element 4 with a sealing material 5 such as epoxy resin.
The semiconductor device is manufactured by integrally sealing the periphery of the TAB tape 1 with resin.

In the above embodiment, the dummy lead 6 is configured not to extend into the opening 2a as a semiconductor element portion, but the end of the dummy lead 6 is extended into the opening 2a, and this It goes without saying that the extended portion of the dummy lead may be connected to a dummy electrode provided on the semiconductor element that has no conduction with the interior.

〔Effect of the invention〕

Since the present invention has the above-described structure, it is possible to make the etching speed more uniform during the etching process, reduce variations in etching dimensions, and improve the dimensional accuracy of the electrode leads.

Moreover, through reinforcement and stress relaxation by dummy leads,
It is possible to prevent as much as possible the displacement of the electrode leads due to processing stress and thermal stress after etching, and also to prevent deformation such as warping or twisting of the TAB tape itself due to thermal stress that occurs after resin sealing. It has the effect of being possible.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the present invention in a state where it is bonded to a semiconductor element, and FIG. 2 is a plan view showing a conventional example.
FIG. 3 is a sectional view after resin molding. 1...TAB tape, 2...Electrical insulating thin plate, 2a
...Same hole, 3...Lead for electrode extraction, 3a...
Same end portion (extending portion), 4... semiconductor element, 6... dummy lead.

Claims (1)

[Claims] It is constructed by laminating a plurality of electrode lead-out leads whose ends extend into the holes on the surface of an electrically insulating thin plate made of a flexible material with holes drilled inside. In a TAB tape in which a semiconductor element is positioned inside and the electrode of the semiconductor element and the extending end of the electrode lead are electrically connected to constitute a semiconductor device, the surface of the electrically insulating thin plate is A dummy lead was provided at a location where the distance between each electrode lead-out lead was wide, so that the electrode lead-out lead and this dummy lead were almost symmetrically distributed vertically and horizontally with the center of the opening as the center. TAB tape is characterized by: