JPH03127854A - Sealed type electronic parts - Google Patents
Sealed type electronic partsInfo
- Publication number
- JPH03127854A JPH03127854A JP26722889A JP26722889A JPH03127854A JP H03127854 A JPH03127854 A JP H03127854A JP 26722889 A JP26722889 A JP 26722889A JP 26722889 A JP26722889 A JP 26722889A JP H03127854 A JPH03127854 A JP H03127854A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- cover
- substrate
- film conductor
- conductor paths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000007772 electroless plating Methods 0.000 abstract description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- 238000007740 vapor deposition Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、コンデンサや共振子等の電子素子を内部に封
止した電子部品に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component in which an electronic element such as a capacitor or a resonator is sealed.
従来の技術と課題
従来、電子素子を内部に封止する態様としては、リード
フレーム上に搭載した素子を金型内にインサートして樹
脂モールドするポストモールド、リードフレームをイン
サートして樹脂ケースを製作し、素子をリードフレーム
にワイヤポンディングしたのちケースに蓋を被せるプレ
モールド、あるいは素子を収容したケースへ樹脂を滴下
して充填するボッティングが知られている。Conventional Technologies and Issues Conventionally, the methods for encapsulating electronic devices internally include post molding, in which the device mounted on a lead frame is inserted into a mold and resin molded, and resin cases are made by inserting the lead frame. However, pre-molding, in which the device is wire bonded to a lead frame and then a lid is placed on the case, or botting, in which the case housing the device is dripped with resin and filled, is known.
しかし、前記従来の封止態様ではリード端子と樹脂との
界面での密着性に限界があり、界面からの水分の浸透と
いった問題点を有していた。However, in the conventional sealing mode, there is a limit to the adhesion at the interface between the lead terminal and the resin, and there is a problem in that moisture permeates through the interface.
そこで、本発明の課題は、封止型電子部品において、外
部引出し用の導体とハウジングとの界面での密封性の向
上を図ることにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to improve the sealing performance at the interface between an external lead-out conductor and a housing in a sealed electronic component.
課題を解決するための手段と作用
以上の課題を解決するため、本発明に係る封止型電子部
品は、絶縁性基板の表面にその上面から側面を通じて下
面にわたって薄膜の導体路を形成し、該基板上に封止用
絶縁性カバーを接着又は溶着にて固定した。導体路は基
板に無電解メツキ、スパッタ、蒸着等の薄膜形成方法に
より所定の形状に形成される。カバーは薄膜導体路を跨
いで接着剤、超音波による溶着等で固定される。薄膜導
体路とカバーとの間には接着剤層又は溶融樹脂層が介在
し、両者の界面での密着性が向上する。Means and Function for Solving the Problems In order to solve the above problems, the sealed electronic component according to the present invention forms a thin film conductor path on the surface of an insulating substrate from the top surface to the side surface and the bottom surface. A sealing insulating cover was fixed on the substrate by adhesive or welding. The conductor path is formed into a predetermined shape on the substrate by a thin film forming method such as electroless plating, sputtering, or vapor deposition. The cover straddles the thin film conductor path and is fixed by adhesive, ultrasonic welding, or the like. An adhesive layer or a molten resin layer is interposed between the thin film conductor path and the cover to improve adhesion at the interface between the two.
実施例
以下、本発明に係る封止型電子部品の一実施例を添付図
面に従って説明する。EXAMPLE Hereinafter, an example of a sealed electronic component according to the present invention will be described with reference to the accompanying drawings.
第１図において、１は樹脂製の基板、８はコンデンサや
共振子等の電子素子、１０は樹脂製のカバーである。基
板１の表面には複数本の薄膜導体路２．３，４．５が、
上面から側面を通じて下面にわたって無電解メツキ法に
て所定の電極形状に形成されている。電子素子８は薄膜
導体路２の一端に電気的に接続された状態で固定され、
かつ他の薄膜導体路３，４．５の一端にワイヤボンディ
ングにて電気的に接続される。In FIG. 1, 1 is a resin substrate, 8 is an electronic element such as a capacitor or a resonator, and 10 is a resin cover. A plurality of thin film conductor paths 2.3, 4.5 are provided on the surface of the substrate 1.
A predetermined electrode shape is formed by electroless plating from the top surface through the side surfaces to the bottom surface. The electronic element 8 is fixed and electrically connected to one end of the thin film conductor path 2;
It is also electrically connected to one end of the other thin film conductor paths 3, 4.5 by wire bonding.
一方、カバー１０は略箱形状をなし、基板１０表面形状
と一致する下端開口縁部１０ａを有し、該縁部１０ａを
基板１の周部に接着剤を介して固定される。これにて基
板１とカバー１０とが一体化され、内部の電子素子８が
封止されたこととなる。薄膜導体路２〜５はカバー１０
の縁部１０ａから外部に露出し、表面実装用の外部電極
端子として機能する。On the other hand, the cover 10 is approximately box-shaped and has a lower opening edge 10a that matches the surface shape of the substrate 10, and the edge 10a is fixed to the periphery of the substrate 1 with an adhesive. In this way, the substrate 1 and the cover 10 are integrated, and the electronic element 8 inside is sealed. The thin film conductor tracks 2 to 5 are covered by a cover 10
It is exposed to the outside from the edge 10a and functions as an external electrode terminal for surface mounting.
また、第２図に示す如く、基板１とカバー１０の縁部１
０ａとの間には接着剤層１５が介在され、該接着剤層１
５が薄膜導体路２〜５の周囲に密着し、界面での気密性
が良好に確保される。Further, as shown in FIG. 2, the edge 1 of the substrate 1 and the cover 10
An adhesive layer 15 is interposed between the adhesive layer 1
5 is in close contact with the periphery of the thin film conductor paths 2 to 5, ensuring good airtightness at the interface.
なお、前記薄膜導体路２〜５を形成するにはＡｇ等の導
電性材料によるメツキ法以外に、スパッタ法、蒸着法等
を採用できる。また、カバー１０の基板１への固定は熱
可塑性樹脂であれば超音波による溶着法でも可能であり
、密封効果も接着剤層１５と同様である。In addition to the plating method using a conductive material such as Ag, sputtering method, vapor deposition method, etc. can be used to form the thin film conductor paths 2 to 5. Further, the cover 10 can be fixed to the substrate 1 by ultrasonic welding if it is made of thermoplastic resin, and the sealing effect is similar to that of the adhesive layer 15.
また、前記カバー１０の縁部１０ａを基板１の外形より
も大きく形成し、縁部１０ａがスカート様に基板１の側
面を覆った状態で固定してもよい。あるいは、基板１の
中央部を凹所とし、該凹所に素子８を設けて樹脂をポツ
ティングし、固めてもよい。Alternatively, the edge 10a of the cover 10 may be formed larger than the outer shape of the substrate 1, and the edge 10a may be fixed in a state covering the side surface of the substrate 1 like a skirt. Alternatively, the center of the substrate 1 may be made into a recess, the element 8 may be provided in the recess, and the resin may be potted and hardened.
発明の効果
以上の説明で明らかな様に、本発明によれば、従来のリ
ードフレームに代えて基板表面に薄膜の導体路を形成し
、該基板上にカバーを接着又は溶着したため、薄膜導体
路とカバーとの界面の密着性が向上し、水分の浸透等の
不具合が確実に除去される。Effects of the Invention As is clear from the above explanation, according to the present invention, a thin film conductor path is formed on the surface of the substrate in place of the conventional lead frame, and a cover is adhered or welded on the substrate. The adhesion between the cover and the cover is improved, and defects such as moisture penetration are reliably eliminated.
第１図は本発明に係る封止型電子部品の一実施例を示す
分解斜視図、第２図は第１図のものを組み立てた状態で
の要部の拡大断面図である。
１・・・基板、２〜５・・・薄膜導体路、８・・・電子
素子、１０・・・カバー、１５・・・接着剤層。FIG. 1 is an exploded perspective view showing an embodiment of the sealed electronic component according to the present invention, and FIG. 2 is an enlarged sectional view of the main parts of the electronic component shown in FIG. 1 in an assembled state. DESCRIPTION OF SYMBOLS 1... Substrate, 2-5... Thin film conductor path, 8... Electronic element, 10... Cover, 15... Adhesive layer.
Claims (1)
面にわたって形成された薄膜の導体路と、前記絶縁性基
板上に設置され、前記導体路の一端に接続された電子素
子と、 前記絶縁性基板上に接着又は溶着にて固定された封止用
絶縁性カバーと、 を備えたことを特徴とする封止型電子部品。1. an insulating substrate; a thin film conductor path formed on the surface of the insulating substrate from the top surface to the side surface and the bottom surface; and an electronic element installed on the insulating substrate and connected to one end of the conductor path. A sealed electronic component comprising: a sealing insulating cover fixed to the insulating substrate by adhesion or welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26722889A JPH03127854A (en) | 1989-10-13 | 1989-10-13 | Sealed type electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26722889A JPH03127854A (en) | 1989-10-13 | 1989-10-13 | Sealed type electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03127854A true JPH03127854A (en) | 1991-05-30 |
Family
ID=17441922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26722889A Pending JPH03127854A (en) | 1989-10-13 | 1989-10-13 | Sealed type electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03127854A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09237901A (en) * | 1996-02-28 | 1997-09-09 | S I I R D Center:Kk | Semiconductor device |
-
1989
- 1989-10-13 JP JP26722889A patent/JPH03127854A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09237901A (en) * | 1996-02-28 | 1997-09-09 | S I I R D Center:Kk | Semiconductor device |
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