JP2762418B2 - Semiconductor package and manufacturing method thereof - Google Patents

Semiconductor package and manufacturing method thereof

Info

Publication number
JP2762418B2
JP2762418B2 JP63221672A JP22167288A JP2762418B2 JP 2762418 B2 JP2762418 B2 JP 2762418B2 JP 63221672 A JP63221672 A JP 63221672A JP 22167288 A JP22167288 A JP 22167288A JP 2762418 B2 JP2762418 B2 JP 2762418B2
Authority
JP
Japan
Prior art keywords
package
inner shell
lid
housing
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63221672A
Other languages
Japanese (ja)
Other versions
JPH0269965A (en
Inventor
英裕 岩瀬
圭一 幅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP63221672A priority Critical patent/JP2762418B2/en
Publication of JPH0269965A publication Critical patent/JPH0269965A/en
Application granted granted Critical
Publication of JP2762418B2 publication Critical patent/JP2762418B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、耐湿性、加工性に優れ、また高集積化大型
素子の搭載に好適な中空の熱可塑性樹脂製半導体パッケ
ージに関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention is a semiconductor package made of a hollow thermoplastic resin, which is excellent in moisture resistance and workability, and is suitable for mounting a highly integrated large element. About.

（従来の技術） 近年、半導体装置の素子密度が高くなり、今後もメモ
リーの記憶容量でみると16メガビット、64メガビットと
集積度がますます高くなり、ペレットは大型化する傾向
にある。現在多用されているエポキシ樹脂封止材による
半導体の封止方法は、第５図に示したように、半導体素
子20とリード端子21とをワイヤボンディングし、それを
封止材22で封止したり、第６図に示したように、予じめ
熱可塑性樹脂でリードフレーム21を一体に成形したプリ
モールドパッケージ23をつくり、半導体素子20を実装
後、封止材22で封止して蓋24をしたものであるが、いず
れも限界に近づきつつある。従って今後は、高集積度素
子の搭載に好適であり、また撮像素子用にも利用できる
ものにするため、素子を直接樹脂封止しない中空型ある
いはガス封止型の半導体パッケージになると思われる。
この形式のものは、従来から種々なものが開発されてい
るが、満足すべきものがない。(Prior Art) In recent years, the element density of semiconductor devices has increased, and the memory density of memory has been increasing to 16 and 64 megabits, and the size of pellets has tended to increase. As shown in FIG. 5, a method of sealing a semiconductor with an epoxy resin sealing material which is frequently used at present is to bond a semiconductor element 20 and a lead terminal 21 by wire bonding and seal it with a sealing material 22. As shown in FIG. 6, a pre-molded package 23 in which a lead frame 21 is integrally molded with a thermoplastic resin is made in advance, and after the semiconductor element 20 is mounted, it is sealed with a sealing material 22 and a lid is formed. 24, all of which are approaching their limits. Therefore, in the future, a hollow or gas-sealed semiconductor package in which the element is not directly resin-sealed is considered to be suitable for mounting a high-integration element and can also be used for an imaging element.
Various types of this type have been developed in the past, but none have been satisfactory.

（発明が解決しようとする課題） 従来、中空型パッケージとしてセラミックパッケージ
があるが、非常に高価であり、多量に生産されるメモリ
ー等には経済的でない。これに対して合成樹脂によるプ
リモールドパッケージもあるが、それぞれ欠点をもって
いる。すなわち、熱硬化性樹脂製のものは、パッケージ
成形の際にバリが発生して、リードの樹脂かぶりが起こ
る等の欠点がある。また、熱可塑性樹脂製のものは、生
産性が高く優れているものの、リードフレームと熱可塑
性樹脂との密着性が悪く、水分等の湿気の浸入により半
導体素子が損傷する等の欠点がある。(Problems to be Solved by the Invention) Conventionally, there is a ceramic package as a hollow package, but it is very expensive and is not economical for a memory or the like produced in large quantities. On the other hand, there is a pre-mold package made of a synthetic resin, but each has a disadvantage. That is, those made of thermosetting resin have disadvantages such as burrs occurring during package molding and resin fogging of the leads. Although those made of thermoplastic resin have high productivity and are excellent, they have disadvantages such as poor adhesion between the lead frame and the thermoplastic resin, and damage of the semiconductor element due to penetration of moisture such as moisture.

本発明は、これらの事情に鑑みてなされたもので、リ
ードフレームとパッケージとの密着が良くて耐湿性に優
れ、従ってまた半導体素子の損傷がなくて信頼性の高
い、かつ加工性、生産性が良くて安価な半導体パッケー
ジ及びその製造方法を提供しようとするものである。The present invention has been made in view of these circumstances, and has good adhesion between a lead frame and a package and excellent in moisture resistance. Therefore, there is no damage to a semiconductor element, high reliability, workability, and productivity. It is an object of the present invention to provide a good and inexpensive semiconductor package and a method for manufacturing the same.

［発明の構成］ （課題を解決するための手段） 本発明者らは、上記の目的を達成しようと鋭意研究を
重ねた結果、熱可塑性樹脂のもつ良好な加工性と高い生
産性、熱可塑性樹脂のもつ優れた密着性を組み合わせ、
かつパッケージとしての優れた構造の採用から、上記目
的を達成できることを見いだし本発明を完成したもので
ある。[Constitution of the Invention] (Means for Solving the Problems) As a result of intensive studies to achieve the above object, the present inventors have found that the good processability, high productivity, and thermoplasticity of thermoplastic resins have Combining the excellent adhesion of resin,
The inventors have found that the above object can be achieved by adopting an excellent structure as a package, and have completed the present invention.

すなわち、本発明の半導体パッケージは、半導体素子
ペレットを内部に搭載するパッケージであって、リード
フレームと一体にするとともに、内郭、該内郭の外周に
内郭より高く設けた外郭、及び内外郭間に該リードフレ
ームのリードが横断露出する外溝を有する熱可塑性樹脂
製プリモールド筐体と、外縁が筐体外溝側にはみ出すこ
となく筐体内郭に接してパッケージ内部を中空に形成す
る蓋と、少くとも筐体外溝内をモールド充填するととも
に蓋を筐体に固着してパッケージ内部を気密に封止する
熱硬化性樹脂製モールド封止部とを具備することを特徴
とする。さらの半導体パッケージの製造方法は、熱可塑
性樹脂製プリモールド筐体の内部中央に半導体素子ペレ
ットを搭載した後、筐体の内郭上部に蓋を配し、次いで
蓋を配した筐体を金型キャビティ内に装入して、筐体外
溝内及び該外溝上部を熱硬化性封止材でモールド封止部
を形成することを特徴とする。That is, the semiconductor package of the present invention is a package in which a semiconductor element pellet is mounted inside, and is integrated with a lead frame, and has an inner shell, an outer shell provided at an outer periphery of the inner shell, and an inner and outer shell. A thermoplastic resin pre-molded housing having an outer groove through which the lead of the lead frame is transversely exposed, and a lid forming a hollow inside of the package in contact with the housing inner shell without an outer edge protruding into the housing outer groove side. And a mold sealing portion made of a thermosetting resin for sealing at least the inside of the package by filling at least the inside of the outer groove of the housing with the mold and fixing the lid to the housing. A further method of manufacturing a semiconductor package is to mount a semiconductor element pellet at the center of the inside of a thermoplastic resin pre-molded housing, place a lid on the upper inner side of the housing, and then mount the lid-mounted housing on a metal. It is characterized in that the mold sealing portion is formed by inserting a thermosetting sealing material in the outer groove of the housing and the upper portion of the outer groove after being inserted into the mold cavity.

本発明に用いるリードフレームとしては、42アロイ、
銅合金、又は銅張積層板を素材として用いたものを挙げ
ることができる。As a lead frame used in the present invention, 42 alloy,
Examples using a copper alloy or a copper-clad laminate as a material can be given.

本発明に用いる熱可塑性樹脂としては、ポリブチレン
テレフタレート、ポリフェニレンサルファイド、液晶ポ
リマー、ポリエーテルイミド、ポリアミド等が挙げら
れ、これらは単独もしくは２種混合して使用することが
できる。この熱可塑性樹脂は筐体の樹脂部を形成するも
ので、通常射出成形によって形成する。Examples of the thermoplastic resin used in the present invention include polybutylene terephthalate, polyphenylene sulfide, liquid crystal polymer, polyetherimide, polyamide and the like, and these can be used alone or as a mixture of two kinds. This thermoplastic resin forms the resin portion of the housing, and is usually formed by injection molding.

本発明の外溝に封入する熱硬化性封止材としては、エ
ポキシ樹脂、ポリイミド樹脂等が挙げられ、これらは単
独もしくは２種以上混合して用いる。Examples of the thermosetting sealing material sealed in the outer groove of the present invention include an epoxy resin and a polyimide resin, and these may be used alone or in combination of two or more.

本発明に用いる内郭上の蓋としては、熱可塑性樹脂或
いは金属板、また透明なガラス板でもよく特に限定され
ない。透明なガラス板等を用いる場合は撮像素子用の半
導体パッケージとして使用することができる。The lid on the inner shell used in the present invention may be a thermoplastic resin, a metal plate, or a transparent glass plate, and is not particularly limited. When a transparent glass plate or the like is used, it can be used as a semiconductor package for an image sensor.

熱硬化性封止材で成形する場合に、パッケージの中空
内部に熱硬化性封止材が浸入するのを防止するために、
蓋と内郭との間を接着剤で固着させたり、弾性パッキン
グを設けてもよい。また熱硬化性樹脂封止材の成形は、
半導体素子を搭載し内郭上部に蓋をした後、パッケージ
を金型に挿入して射出成形、トランスファー成形、圧縮
成形等を行って成形する。When molding with a thermosetting sealing material, to prevent the thermosetting sealing material from entering the hollow interior of the package,
The lid and the inner shell may be fixed with an adhesive, or an elastic packing may be provided. Molding of thermosetting resin encapsulant
After mounting the semiconductor element and covering the upper part of the inner casing, the package is inserted into a mold and molded by injection molding, transfer molding, compression molding or the like.

（作用） 内郭と外郭間に外溝を設け、熱硬化性封止材を封入し
たことによって、リードフレームと熱可塑性樹脂パッケ
ージとの密着性を向上させると共にリード端子側、内郭
上部蓋側からの湿気の浸入を防止し、半導体素子を保護
することができる。また内溝と流止郭を設けたことによ
って、熱硬化性封止材が流出しても流止郭で流出が防止
されて内溝に留り、半導体素子に悪影響を及ぼすことが
ない。(Function) By providing an outer groove between the inner shell and the outer shell and enclosing a thermosetting sealing material, the adhesion between the lead frame and the thermoplastic resin package is improved, and the lead terminal side, the inner shell upper lid side. Moisture can be prevented from entering the semiconductor device, and the semiconductor element can be protected. Moreover, even if the thermosetting sealing material flows out, the outflow is prevented by the flow stop, and the inner groove and the flow stop are provided.

（実施例） 次に本発明を図面を用いて説明する。(Example) Next, the present invention will be described with reference to the drawings.

第１図（ａ）は実施例のプリモールド筐体の正面図、
第１図（ｂ）は第１図（ａ）のＸ−Ｘ線に沿う断面図、
第１図（ｃ）は第１図（ａ）のＹ−Ｙ線に沿う断面図で
ある。FIG. 1A is a front view of a pre-molded housing of the embodiment,
FIG. 1 (b) is a cross-sectional view taken along line XX of FIG. 1 (a),
FIG. 1 (c) is a cross-sectional view taken along line YY of FIG. 1 (a).

第１図において、筐体１は内郭２の外周に、内郭２よ
り高い外郭３と、内郭２の内周に内郭２より低い流止郭
４が設けてある。内郭２と外郭３との間には外溝６があ
り、正面図でリードフレーム５の直角方向における外溝
６は底部に開口してリードフレーム５が横断露出する部
分6aであり（第１図（ｂ））、正面図でリードフレーム
５の平行方向の外溝６は底部にまで開口させる必要のな
い部分6bである（第１図（ｃ））。また内郭２と流止郭
４との間には、内溝７が形成されている。また筐体１の
中央はリードフレーム面まで凹状となって、素子搭載部
とリードのボンディング部が露出している。この筐体１
は熱可塑性樹脂によってリードフレーム５が一体に形成
されている。In FIG. 1, the housing 1 is provided with an outer shell 3 higher than the inner shell 2 on the outer circumference of the inner shell 2 and a flow stop 4 lower than the inner shell 2 on the inner circumference of the inner shell 2. There is an outer groove 6 between the inner shell 2 and the outer shell 3, and the outer groove 6 in a direction perpendicular to the lead frame 5 in the front view is a portion 6a which is opened at the bottom and the lead frame 5 is crosswise exposed (first). In FIG. 1B, in the front view, the outer groove 6 in the parallel direction of the lead frame 5 is a portion 6b that does not need to be opened to the bottom (FIG. 1C). In addition, an inner groove 7 is formed between the inner shell 2 and the flow stop 4. Further, the center of the housing 1 is concave to the lead frame surface, and the bonding portion between the element mounting portion and the lead is exposed. This case 1
The lead frame 5 is integrally formed of a thermoplastic resin.

次に第２図乃至第４図を用いて本発明の半導体パッケ
ージの製造工程を説明する。Next, a manufacturing process of the semiconductor package of the present invention will be described with reference to FIGS.

第２図（ａ）は構成体の１つである筐体に半導体素子
を搭載しワイヤーボンディングした状態を示した正面
図、第２図（ｂ）は、第２図（ａ）のＸ−Ｘ線に沿う断
面図、第２図（ｃ）は第２図（ａ）のＹ−Ｙ線に沿う断
面図である。第２図（ａ）ないし第２図（ｃ）に示した
ように筐体に半導体素子10を搭載し、リードフレーム５
とボンディングワイヤー11によって接続する。FIG. 2 (a) is a front view showing a state where a semiconductor element is mounted on a housing which is one of the components and wire-bonded, and FIG. 2 (b) is an XX of FIG. 2 (a). FIG. 2C is a cross-sectional view taken along line YY in FIG. 2A. As shown in FIGS. 2 (a) to 2 (c), the semiconductor element 10 is mounted on the housing and the lead frame 5 is mounted.
And a bonding wire 11.

その後、第３図（ａ）ないし第３図（ｃ）に示したよ
うに内郭２の上部に蓋13を設ける。この蓋は、プラスチ
ック板や金属板、透明なガラス板でも良く、特に限定さ
れるものではない。ガラス板やアクリル板等の透明な蓋
をすることによって撮像素子用の半導体パッケージとす
ることができる。内郭２と蓋13との間に接着剤や弾性パ
ッキングを用いて仮着し、外溝等に封入成形される熱硬
化性封止材の浸入を防止させることができる。また、万
一熱硬化性封止材が浸入したとしても内溝７と流止郭４
によって浸入がとめられる。内郭２に蓋13をし、筐体を
装入する金型14の断面図を第３図（ｂ）に一点鎖線で示
した。なお、15はスプルーである。第４図（ａ）ないし
第４図（ｃ）は本発明の半導体パッケージを示した正面
図および断面図である。第３図（ｂ）の状態で熱硬化性
封止材12をスプルー15からトランスファー成形して外溝
を封入すると同時に外溝上部を熱硬化性封止材12で成形
して蓋13を完全に密封して、パッケージ内部を中空にし
た半導体パッケージを製造することができる。Thereafter, as shown in FIGS. 3 (a) to 3 (c), a lid 13 is provided on the upper part of the inner shell 2. This lid may be a plastic plate, a metal plate, or a transparent glass plate, and is not particularly limited. A semiconductor package for an image sensor can be obtained by providing a transparent cover such as a glass plate or an acrylic plate. A temporary attachment is made between the inner shell 2 and the lid 13 using an adhesive or an elastic packing to prevent the penetration of the thermosetting sealing material sealed and molded in the outer groove or the like. Also, even if the thermosetting sealing material enters, the inner groove 7 and the flow stop 4
Stops infiltration. A cross-sectional view of the mold 14 in which the inner casing 2 is covered with the lid 13 and the casing is inserted is shown by a dashed line in FIG. 3 (b). 15 is a sprue. 4 (a) to 4 (c) are a front view and a sectional view showing a semiconductor package of the present invention. In the state of FIG. 3B, the thermosetting sealing material 12 is transfer-molded from the sprue 15 to enclose the outer groove, and at the same time, the upper portion of the outer groove is formed by the thermosetting sealing material 12 to completely cover the lid 13. It is possible to manufacture a semiconductor package in which the inside of the package is hollow by sealing.

［発明の効果］ 以上の説明から明らかなように、本発明の半導体パッ
ケージは、熱可塑性樹脂の射出成形によって容易に成形
加工した特定構造のプリモード筐体をつくり、その外溝
を熱硬化性樹脂封止材で封止することによって、熱可塑
性樹脂およびリードフレームとの密着性を向上させたの
で、耐湿性に優れ湿気等の浸入を防止して、半導体素子
の損傷をなくすことができ、また加工性、生産性に優れ
ているので、安価な信頼性の高い半導体パッケージを得
ることができた。[Effects of the Invention] As is clear from the above description, the semiconductor package of the present invention forms a pre-mode casing having a specific structure easily formed by injection molding of a thermoplastic resin, and forms an outer groove of the thermo-setting resin. By sealing with a sealing material, the adhesiveness between the thermoplastic resin and the lead frame is improved, so that it is excellent in moisture resistance, prevents invasion of moisture and the like, and can prevent damage to the semiconductor element. Because of its excellent workability and productivity, an inexpensive and highly reliable semiconductor package could be obtained.

【図面の簡単な説明】[Brief description of the drawings]

第１図（ａ）は本発明実施例における筐体の正面図、第
１図（ｂ）は第１図（ａ）のＸ−Ｘ線に沿う断面図、第
１図（ｃ）は第１図（ａ）のＹ−Ｙ線に沿う断面図、第
２図ないし第４図は本発明の一実施例である半導体パッ
ケージの製造工程を示すもので各図の分図（ａ）は正面
図、分図（ｂ）及び（ｃ）はそれぞれ分図（ａ）のＸ−
Ｘ線、Ｙ−Ｙ線に沿う断面図、第５図及び第６図は従来
パッケージの断面図である。１ .23……筐体、２……内郭、３……外郭、４……流止
郭、5,21……リードフレーム、６……外溝、７……内
溝、10,20……半導体素子、11……ボンディングワイヤ
ー、12,22……熱硬化性封止材、13……蓋、14……金
型、15……スプルー。FIG. 1A is a front view of a housing according to an embodiment of the present invention, FIG. 1B is a sectional view taken along line XX of FIG. 1A, and FIG. 2A to 4 are cross-sectional views taken along the line YY of FIG. 1A, showing a manufacturing process of a semiconductor package according to one embodiment of the present invention. , The distribution diagrams (b) and (c) correspond to the X-
FIGS. 5 and 6 are cross-sectional views of the conventional package along the X-ray and the Y-Y line. 1.23 ...... casing, 2 ...... inner contour, 3 ...... shell, 4 ...... Nagaretomekuruwa, 5,21 ...... leadframe, 6 ...... outside groove, 7 ...... groove, 10, 20 ... ... semiconductor element, 11 bonding wire, 12,22 thermosetting sealing material, 13 lid, 14 mold, 15 sprue.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/28 - 23/31 H01L 23/02──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 23/28-23/31 H01L 23/02

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】半導体素子ペレットを内部に搭載するパッ
ケージであって、リードフレームと一体にするととも
に、内郭、該内郭の外周に内郭より高く設けた外郭、及
び内外郭間に該リードフレームのリードが横断露出する
外溝を有する熱可塑性樹脂製プリモールド筐体と、外縁
が筐体外溝側にはみ出すことなく筐体内郭に接してパッ
ケージ内部を中空に形成する蓋と、少くとも筐体外溝内
をモールド充填するとともに蓋を筐体に固着してパッケ
ージ内部を気密に封止する熱硬化性樹脂製モールド封止
部とを具備する半導体パッケージ。1. A package for mounting a semiconductor element pellet therein, wherein said package is integrated with a lead frame, and wherein said lead is provided between an inner shell, an outer shell provided at an outer periphery of said inner shell higher than the inner shell, and an inner shell. A pre-molded casing made of a thermoplastic resin having an outer groove through which the lead of the frame is exposed, a lid that forms a hollow inside of the package by contacting the inner periphery of the casing without an outer edge protruding into the outer groove side of the casing, and at least a casing. A semiconductor package comprising: a thermosetting resin mold sealing portion that fills the inside of an external body groove with a mold and fixes a lid to a housing to hermetically seal the inside of the package. 【請求項２】請求項１の半導体パッケージを製造するに
あたり、熱可塑性樹脂製プリモールド筐体の内部中央に
半導体素子ペレットを搭載した後、筐体の内郭上部に蓋
を配し、次いで蓋を配した筐体を金型キャビティ内に装
入して、筐体外溝内及び該外溝上部を熱硬化性封止材で
モールド封止部を形成することを特徴とする半導体パッ
ケージの製造方法。2. The method of manufacturing a semiconductor package according to claim 1, wherein a semiconductor element pellet is mounted in the center of a pre-molded casing made of a thermoplastic resin, and then a lid is disposed on an upper portion of the inside of the casing. A method of manufacturing a semiconductor package, comprising: inserting a housing provided with a mold into a mold cavity, and forming a mold sealing portion in a housing outer groove and an upper portion of the outer groove with a thermosetting sealing material. .
JP63221672A 1988-09-05 1988-09-05 Semiconductor package and manufacturing method thereof Expired - Lifetime JP2762418B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63221672A JP2762418B2 (en) 1988-09-05 1988-09-05 Semiconductor package and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63221672A JP2762418B2 (en) 1988-09-05 1988-09-05 Semiconductor package and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH0269965A JPH0269965A (en) 1990-03-08
JP2762418B2 true JP2762418B2 (en) 1998-06-04

Family

ID=16770461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63221672A Expired - Lifetime JP2762418B2 (en) 1988-09-05 1988-09-05 Semiconductor package and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2762418B2 (en)

Also Published As

Publication number Publication date
JPH0269965A (en) 1990-03-08

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