JPH03126293A - Cooling of control panel - Google Patents
Cooling of control panelInfo
- Publication number
- JPH03126293A JPH03126293A JP1265606A JP26560689A JPH03126293A JP H03126293 A JPH03126293 A JP H03126293A JP 1265606 A JP1265606 A JP 1265606A JP 26560689 A JP26560689 A JP 26560689A JP H03126293 A JPH03126293 A JP H03126293A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat sink
- outside
- cooling
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 abstract 5
- 230000000694 effects Effects 0.000 description 5
- 230000002411 adverse Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、制御盤の冷却方法に関し、より詳しくは、電
子部品等の発熱部品が密閉構造の筐体内に収納されてい
る制御盤の冷却方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for cooling a control panel, and more specifically, to a method for cooling a control panel in which heat-generating components such as electronic components are housed in a sealed housing. Regarding the method.
従来の制御盤及びその冷却方法を第3図、第4図を参照
しながら説明すると、従来の制御盤は、第3図に示す如
く、電子部品等の発熱部品(1)を収納する筐体(2)
と、該筐体(2)の−側面に取り付けられ、該筐体内の
温度を一定に保つために上記発熱部品<1)から発生し
た熱を吸収して外部へ放熱するヒートシンク(3)とを
備えて構成されている。また、上記発熱部品(1)は、
第3図に示す如く、上記筐体(2)内において小型のヒ
ートシンク部(4)に取り付けられており、該ヒートシ
ンク部(4) によって発熱部品(1)の熱を直接吸収
して該発熱部品(1)の発熱効率を上げるべく一旦筐体
(2)内に放熱するようになされている。また、上記ヒ
ートシンク部(4)の下方にはファン(5)が配設され
ており、該ファン(5)によってヒートシンク部(4)
から放熱された熱を上記筐体(2)内において対流させ
るようにしている。また、上記ヒートシンク(3)は、
略半分が筐体(2)内にあり残り半分が筐体(2)外に
露出しており、該ヒートシンク(3)の内側上端部に取
り付けられたファン(6)によって上記筐体(2)内を
対流する空気を強制的に該ヒートシンク(3)内に送り
込み、内側下端部に形成された開口部(3A)から冷却
後の空気を送り出すようにしている。一方、該ヒートシ
ンク(3)の外側下端部にもファン(7)が取り付けら
れており、該ヒートシンク(3)内に外気を送り込み、
外側上端部に形成されたヒートシンク(3)の開口部(
3B)から熱交換して温度上昇した空気を送り出すよう
にしている。即ち、該ヒートシンク(3)は、第4図に
示す如く、上記筐体(2)内に位置する部分と筐体(2
)外に位置する部分とを遮蔽板(3C)によって画成し
、遮蔽板(3C)を境にして上記画部分に位置するヒー
トシンク体(3D)を介して上述の如く熱交換するよう
になされている。A conventional control panel and its cooling method will be explained with reference to FIGS. 3 and 4. As shown in FIG. (2)
and a heat sink (3) attached to the negative side of the housing (2), which absorbs heat generated from the heat generating components <1) and radiates the heat to the outside in order to keep the temperature inside the housing constant. Configured with the necessary features. Further, the heat generating component (1) is
As shown in Figure 3, it is attached to a small heat sink part (4) within the housing (2), and the heat sink part (4) directly absorbs the heat of the heat generating component (1). In order to increase the heat generation efficiency of (1), heat is first radiated into the housing (2). Further, a fan (5) is disposed below the heat sink portion (4), and the fan (5) causes the heat sink portion (4) to
The heat radiated from the housing (2) is caused to convect within the housing (2). Further, the heat sink (3) is
Approximately half of the heat sink (3) is inside the housing (2), and the remaining half is exposed outside the housing (2), and the fan (6) attached to the inner upper end of the heat sink (3) allows the heat sink (3) to be heated by the fan (6). The air convecting inside is forced into the heat sink (3), and the cooled air is sent out from an opening (3A) formed at the inner lower end. On the other hand, a fan (7) is also attached to the outer lower end of the heat sink (3), which sends outside air into the heat sink (3).
The opening of the heat sink (3) formed at the outer upper end (
3B), the air whose temperature has increased through heat exchange is sent out. That is, as shown in FIG. 4, the heat sink (3) has a portion located inside the housing (2) and
) is defined by a shielding plate (3C) and a portion located outside, and heat exchange is performed as described above via a heat sink body (3D) located in the above-mentioned portion with the shielding plate (3C) as a boundary. ing.
しかしながら、従来の制御盤の冷却方法は、前述の如く
、発熱部品(1)の熱によフて上昇した空気を一旦筐体
(2)内において対流させた後、上昇した空気の熱をヒ
ートシンク(3)によって筐体(2)の外部へ放熱する
という間接的な方法によって制御盤を冷却するようにし
ていた。そのため発熱から放熱に至るプロセスが長くて
放熱効率が低下し、効率の良い冷却を行うことができな
かつた。また、筐体(2)内の温度を一旦上昇させるプ
ロセスを経由するため、冷却効率の悪さと相俟って筐体
(2)内の温度上昇によフて他の部品に悪影響を及ぼす
虞れがあった。However, in the conventional control panel cooling method, as mentioned above, the air that has risen due to the heat of the heat generating component (1) is once convected within the housing (2), and then the heat of the rising air is transferred to the heat sink. According to (3), the control panel is cooled by an indirect method of radiating heat to the outside of the housing (2). As a result, the process from heat generation to heat radiation is long, reducing heat radiation efficiency and making it impossible to perform efficient cooling. In addition, since the process goes through a process of once raising the temperature inside the casing (2), there is a risk that the temperature rise inside the casing (2), along with poor cooling efficiency, will have an adverse effect on other parts. There was that.
尚、上述したものと同様の冷却技術が伊藤謹司他2名に
よる「電子機器の熱対策設計」 (昭和56年11月2
0日、日刊工業新聞社刊)の第99頁乃至第106頁の
「密閉筐体」の欄あるいはオーム電機株式会社の制御盤
用熱交換器のカタログr BOXFAN Jに記載され
ているが、これらはいずれも上述した課題を有している
。A cooling technology similar to the one described above was published in "Heat Countermeasure Design for Electronic Equipment" (November 2, 1981) by Kinji Ito and two others.
0, published by Nikkan Kogyo Shimbun), pages 99 to 106 of the "Sealed casing" section, or Ohm Electric Co., Ltd.'s catalog of heat exchangers for control panels, BOXFAN J. Both have the above-mentioned problems.
本発明は、上記課題を解決するためになされたもので、
筐体内の冷却プロセスを矩かくして発熱部品に発生する
熱を効率良く外部へ放熱することができると共に、筐体
内の温度上昇を抑制することができる制御盤の冷却方法
の提供を目的としている。The present invention was made to solve the above problems, and
The purpose of the present invention is to provide a method for cooling a control panel, which can efficiently radiate heat generated in heat-generating components to the outside by curtailing the cooling process within the housing, and can suppress a rise in temperature within the housing.
(課題を解決するための手段)
本発明の制御盤の冷却方法は、筐体内の発熱部品を筐体
の一側面に配設されたヒートシンクに直接接触させて、
発熱部品の熱を直接ヒートシンクによって吸収させた後
外部へ放熱させるようにしたものである。(Means for Solving the Problems) The method for cooling a control panel of the present invention includes bringing heat-generating components inside the housing into direct contact with a heat sink disposed on one side of the housing.
The heat from the heat generating components is directly absorbed by the heat sink and then radiated to the outside.
本発明によれば、発熱部品に発した熱は、直接ヒートシ
ンクによって吸収されて、直接筐体の外部へ放熱するこ
とができる。According to the present invention, the heat generated in the heat generating component can be directly absorbed by the heat sink and radiated directly to the outside of the casing.
以下、第1図及び第2図に示す一実施例に基づいて従来
と同一または相当部分には同一符号を付してその説明を
省略し、本発明の特徴を中心に説明する。尚、各図中、
第1図は本発明方法を実施する際に好適に用いられる制
御盤の概念を示す断面図、第2図は第1図におけるヒー
トシンクを示す断面図である。Hereinafter, based on an embodiment shown in FIGS. 1 and 2, parts that are the same as or equivalent to those of the conventional art will be given the same reference numerals, and the description thereof will be omitted, and the features of the present invention will be mainly described. In addition, in each figure,
FIG. 1 is a sectional view showing the concept of a control panel suitably used in carrying out the method of the present invention, and FIG. 2 is a sectional view showing a heat sink in FIG. 1.
まず、本発明方法を実施する際に好適に用いられる制御
盤を第1図及び第2図に基づいて説明すると、該制御盤
は、第1図に示す如く、発熱部品(1)が筐体(2)の
−側面に配設されたヒートシンク(3)に対して直接取
り付けて構成されている。First, a control panel suitably used when carrying out the method of the present invention will be explained based on FIGS. 1 and 2. As shown in FIG. (2) is constructed by being directly attached to the heat sink (3) disposed on the - side.
そして、該ヒートシンク(3)の内側下端部にファン(
6)が取り付けられて筐体(2)内の空気をヒートシン
ク(3)内に送り込み、内側上端部に形成された開口部
(3A)から筐体(2)内に送り出すと共に、外側上端
部にファン(7)が取り付けられて外部の空気をヒート
シンク(3)内に送り込み、外側下端部に形成された開
口部(3B)から外部へ送り出すように構成されている
。また、上記ヒートシンク(3)は第2図に示す如く、
内側の半分と外側の半分とを画成する遮蔽板(3C)を
備えている。A fan (
6) is attached to send the air inside the casing (2) into the heat sink (3), and send it out into the casing (2) through the opening (3A) formed at the inner upper end. A fan (7) is attached to send outside air into the heat sink (3), and is configured to send outside air through an opening (3B) formed at the outer lower end. In addition, the heat sink (3) is as shown in FIG.
A shielding plate (3C) is provided that defines an inner half and an outer half.
次に上記制御盤における本発明方法の一実施態様につい
て説明すると、発熱部品(1)に熱が発生すると、該発
熱部品(1)がヒートシンク(3)に直接接触している
ため、発生した熱が直接ヒートシンク(3)によって吸
収され、ヒートシンク(3)の内側の温度が上昇して外
側との間に温度格差が形成されて、熱は内側から外側へ
と移動して発熱部品(1)の熱を常時外部へ放熱し、筐
体(2)内の温度上昇を抑制すべく冷却する。この際、
ファン(7)によって外気を強制循環させて冷却し、冷
却効率を更に良くし、延いては、筐体(2)内の温度が
一定値以上に上昇しないように抑制することができる。Next, to explain one embodiment of the method of the present invention in the control panel, when heat is generated in the heat generating component (1), the generated heat is generated because the heat generating component (1) is in direct contact with the heat sink (3). is directly absorbed by the heat sink (3), the temperature inside the heat sink (3) rises, and a temperature difference is formed between the heat sink (3) and the outside, and the heat moves from the inside to the outside of the heat generating component (1). Heat is constantly radiated to the outside and cooled to suppress the temperature rise inside the casing (2). On this occasion,
The fan (7) is used to forcefully circulate outside air for cooling, thereby further improving the cooling efficiency and, in turn, suppressing the temperature inside the casing (2) from rising above a certain value.
以上説明した如く、本発明方法の一実施態様によれば、
発熱部品(1)に発生した熱を直接外部へ放熱するよう
にしたため、筐体(2)内の冷却効率が向上し、しかも
筐体(2)内の温度上昇を抑制することができ、他の部
品への熱的な悪影響を及ぼすことがない。As explained above, according to one embodiment of the method of the present invention,
Since the heat generated in the heat-generating component (1) is directly radiated to the outside, the cooling efficiency inside the housing (2) is improved, and the temperature rise inside the housing (2) can be suppressed. There is no adverse thermal effect on the parts.
尚、上記実施例では、発熱部品(1)の一部をヒートシ
ンク(3)に取り付ける場合についてのみ説明したが、
発熱部品(1)の全てがヒートシンク(3)に取り付け
ることができれば、第2図に示したようにヒートシンク
(3)へ筐体(2)内の空気(他の部品によって上昇す
ることがない空気)を強制循環させる必要がなく、従っ
てこのような場合にはヒートシンク(3)を遮蔽板(3
C)によって2分割する必要がなくなるため、ヒートシ
ンク(3)の内側のファン(6)等の部品を省略するこ
とができる。In the above embodiment, only the case where a part of the heat generating component (1) is attached to the heat sink (3) was explained.
If all of the heat generating components (1) can be attached to the heat sink (3), the air inside the housing (2) (air that does not rise due to other components) will be transferred to the heat sink (3) as shown in Figure 2. ), there is no need to forcefully circulate the heat sink (3) in such a case.
C) eliminates the need to divide the heat sink into two parts, so parts such as the fan (6) inside the heat sink (3) can be omitted.
(発明の効果)
以上本発明によれば筐体内の発熱部品に発生する熱を効
率良く外部へ放熱することができると共に、筺体内の温
度上昇を従来に比べて格段に抑制して他の電子部品への
熱的な悪影響を排除することができる。(Effects of the Invention) As described above, according to the present invention, it is possible to efficiently radiate the heat generated in the heat generating components inside the housing to the outside, and to suppress the temperature rise inside the housing significantly compared to the conventional It is possible to eliminate adverse thermal effects on components.
第1図は本発明方法を実施する際に好適に用いられる制
御盤の概念を示す断面図、第2図は第1図におけるヒー
トシンクを示す断面図、第3図は従来の制御盤を示す第
1図相当図、第4図は第3図におけるヒートシンクを示
す断面図である。
各図中、(1)は発熱部品、(2)は筐体、(3)はヒ
ートシンクである。
なお、図中、同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing the concept of a control panel suitably used when implementing the method of the present invention, FIG. 2 is a sectional view showing the heat sink in FIG. 1, and FIG. 3 is a sectional view showing a conventional control panel. 1, and FIG. 4 is a sectional view showing the heat sink in FIG. 3. In each figure, (1) is a heat generating component, (2) is a housing, and (3) is a heat sink. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
筐体の一側面に配設されたヒートシンクによって吸収し
外部へ放熱させる制御盤の冷却方法において、上記発熱
部品を上記ヒートシンクに直接接触させて、上記発熱部
品の熱を直接ヒートシンクによって吸収させた後外部へ
放熱させることを特徴とする制御盤の冷却方法。In a control panel cooling method in which heat generated from a heat generating component housed in a housing is absorbed by a heat sink disposed on one side of the housing and radiated to the outside, the heat generating component is brought into direct contact with the heat sink. A method for cooling a control panel, characterized in that the heat of the heat generating components is directly absorbed by a heat sink and then radiated to the outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1265606A JPH03126293A (en) | 1989-10-12 | 1989-10-12 | Cooling of control panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1265606A JPH03126293A (en) | 1989-10-12 | 1989-10-12 | Cooling of control panel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03126293A true JPH03126293A (en) | 1991-05-29 |
Family
ID=17419471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1265606A Pending JPH03126293A (en) | 1989-10-12 | 1989-10-12 | Cooling of control panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03126293A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08317517A (en) * | 1995-05-15 | 1996-11-29 | Nitto Kogyo Kk | Heat exchanger for panel |
KR100640067B1 (en) * | 2000-05-02 | 2006-10-31 | 한라공조주식회사 | Device for cooling switching circuit of control box |
US20120134114A1 (en) * | 2010-07-22 | 2012-05-31 | Nick Kamenszky | Thermal management of environmentally-sealed electronics enclosure |
EP2762796A1 (en) * | 2013-02-04 | 2014-08-06 | ABB Oy | Cooling assembly |
CN107171209A (en) * | 2017-06-27 | 2017-09-15 | 何燕坤 | A kind of electric power automation of distributive net control cabinet |
-
1989
- 1989-10-12 JP JP1265606A patent/JPH03126293A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08317517A (en) * | 1995-05-15 | 1996-11-29 | Nitto Kogyo Kk | Heat exchanger for panel |
KR100640067B1 (en) * | 2000-05-02 | 2006-10-31 | 한라공조주식회사 | Device for cooling switching circuit of control box |
US20120134114A1 (en) * | 2010-07-22 | 2012-05-31 | Nick Kamenszky | Thermal management of environmentally-sealed electronics enclosure |
EP2762796A1 (en) * | 2013-02-04 | 2014-08-06 | ABB Oy | Cooling assembly |
CN107171209A (en) * | 2017-06-27 | 2017-09-15 | 何燕坤 | A kind of electric power automation of distributive net control cabinet |
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