JPH05235571A - Heat radiative structure of electronic module - Google Patents

Abstract

PURPOSE:To improve the capability of cooling a high temperature heating part housed in a metal case by providing a metal tube having opposite ends penetrating through the opposing side panels of the metal case and fixing the panels in place and a heat transfer plate having one end in contact with the high temperature heating part and the other end in contact with the outer peripheral surface of the metal tube. CONSTITUTION:A metal tube 20 penetrates through a metal case 2 in parallel with the bottom panel 2-1 of the case and the side rim of a printed board 4. Both ends of the metal tube 20 penetrate through the opposing side panels 2-2 of the metal case 2, respectively, and the outer peripheral surface at each end is bonded to each side panel 2-2 by brazing or the like. The bottom face at one end of a heat transfer plate 21 made of steel or the like, is brought into tight contact with the upper end face of a high temperature heating part 5 and secured by screws or conductive adhesive; the other end of the heat transfer plate 21 is brought into tight contact with the outside surface of the metal tube 20 and secured by brazing or the like. Heat generated from the high temperature heating part 5 is transferred to the metal tube 20 through the heat transfer plate 21, and then to the air in the metal tube 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for electronic modules. In recent years, a high heat generating component and other circuit components are mounted on a printed board, the printed board is housed and sealed in a metal case to form an electronic module, and an electronic device in which such an electronic module is mounted on a mother printed board. There is.

In an electronic module containing such a high heat generating component, attention must be paid to the cooling of the high heat generating component.

[0003]

2. Description of the Related Art FIGS. 4A and 4B are views showing a heat dissipation structure of a conventional electronic module, wherein FIG. 4A is a perspective view and FIG. 4B is a sectional view.

In FIG. 4, reference numeral 4 is a printed board on which a high heat generating component 5 such as a semiconductor device and other circuit components are mounted. Reference numeral 2 denotes a shallow box-shaped metal case having an opening on one side, which accommodates the printed board 4 in parallel with the bottom plate 2-1 and then closes the opening with a cover 3. Then, the electronic module is configured by accommodating and incorporating another printed board or the like in the metal case 2.

By inserting and soldering the input / output terminals (for example, glass terminals) of the printed board 4 penetrating the bottom plate 2-1 into the through holes of the mother printed board 1, the above-mentioned electronic module is mounted on the mother printed board 1. It is installed in.

Conventionally, the rectangular metal plate 10 is replaced by the printed board 4
Insert it vertically into the metal case 2 so that it is parallel to the side edges, and weld the lower edges to the bottom plate 2-1 of the metal case 2 and the left and right side edges to the opposite side plates 2-2 of the metal case 2. ing.

Then, one end of the strip-shaped heat transfer plate 11 is closely fixed to the upper end surface of the high heat-generating component 5, and the other end is fixed to the vertical surface of the metal plate 10 by welding or the like. There is. With such a heat dissipation structure, the heat of the high heat generating component 5 is transferred to the heat transfer plate 11,
It is transmitted to the metal case 2 through the metal plate 10 and diverges from the metal case 2 to the outside.

[0008]

By the way, in the conventional heat dissipation structure, the heat transfer path of the high heat-generating component is the heat transfer plate-metal plate-metal case, so that the heat conduction resistance up to the metal case is large.
Therefore, there is a problem that the high heat-generating component is not sufficiently cooled.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a heat dissipation structure for an electronic module, which is excellent in cooling of a high heat-generating component housed in a metal case.

[0010]

In order to achieve the above object, the present invention, as shown in FIG. 1, includes a printed board 4 having a high heat generating component 5 mounted therein and housed in a metal case 2, and a metal. A metal tube 20 penetrating the case 2 and having both ends penetrating the opposite side plates 2-2 of the metal case 2 and fixed to the side plate 2-2, one end of which is in close contact with the high heat generating component 5, and the other end is A heat transfer plate (21) in close contact with the outer peripheral surface of the metal tube (20) is provided.

Alternatively, as shown in FIG. 2, the above-mentioned metal tube 20 is provided with a radiation fin 25 which runs in the axial direction. Alternatively, as illustrated in FIG. 3, the printed circuit board 40 having the metal core 2 mounted with the high heat generating component 5 and housed in the metal case 2 penetrates the metal case 2, and both ends of the printed board 40 face each other. A metal tube 20 (or a metal tube having a heat radiation fin on the inner wall) that penetrates each of the side plates 2-2 and is fixed to the side plate 2-2 is provided. The configuration is such that it is in close contact with the outer peripheral surface of the tube 20.

Furthermore, a fan is installed in an electronic device equipped with an electronic module so that the inside of the metal tube is forcedly ventilated.

[0013]

According to the first and second aspects of the present invention, the metal tube penetrates the inside of the metal case, and the metal tube and the high heat generating component are thermally connected via the heat transfer plate.

Therefore, the heat of the high heat generating component is transmitted to the metal tube through the heat transfer plate, is transmitted from the inner wall of the metal tube to the air in the metal tube, and is radiated outside the metal case by using the air as a medium.

Further, a part of the heat transferred to the metal tube is transferred to the metal case through the metal tube and is discharged from the metal case to the outside. Therefore, the cooling property of the high heat generating component is improved.

By providing a radiation fin in the metal tube or by forcibly ventilating the metal tube, the cooling performance is further improved. On the other hand, according to the invention of claim 3,
The heat of the high heat generating component is transferred to the metal core of the printed circuit board with the metal core, and is transferred to the metal tube via the metal core. At this time, since the area of the metal core is large and the contact area between the metal core and the metal tube is also large, the heat transfer resistance is small.
Therefore, the cooling property is further improved as compared with the case of using the heat transfer plate.

[0017]

The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.

FIG. 1 is a diagram of an embodiment of the present invention, (A) is a perspective view, (B) is a sectional view, and FIG. 2 is a sectional view of another embodiment of the present invention.
FIG. 3 is a sectional view of still another embodiment of the present invention. Figure 1
In FIG. 2, a high heat-generating component 5 such as a semiconductor device and other circuit components are mounted on the printed board 4, and the printed board 4 is accommodated in parallel with the bottom plate 2-1 of a shallow box-shaped metal case having an opening on one side. After mounting, the opening is covered with the cover 3.

An electronic module is constructed by accommodating and mounting another printed board or the like in the metal case 2. 20 is a metal tube 20 made of steel, aluminum, copper-based metal, or the like.

The metal tube 20 penetrates the metal case 2 in parallel with the side edges of the bottom plate 2-1 and the printed board 4, and both ends thereof penetrate the opposite side plates 2-2 of the metal case 2, respectively. The outer peripheral surfaces of both ends are fixed to the side plates 2-2 by brazing or the like.

Reference numeral 21 is a strip-shaped heat transfer plate made of steel, aluminum, copper-based metal or the like. The lower surface of one end of the heat transfer plate 21 is brought into close contact with the upper end surface of the high heat-generating component 5 and fixed by screws or a conductive adhesive. Further, the other end of the heat transfer plate 21 is brought into close contact with the outer peripheral surface of the metal tube 20 and fixed by brazing or the like.

On the other hand, the electronic module is mounted on the mother printed board 1 by inserting and soldering the input / output terminals (eg, glass terminals) of the printed board 4 penetrating the bottom plate 2-1 into the through holes of the mother printed board 1. Has been done.

The mother printed board 1 is mounted vertically in a shelf (not shown). Since the present invention is configured as described above, the heat of the high heat generating component 5 is transferred to the metal tube 20 via the heat transfer plate 21, and further transferred from the inner wall of the metal tube 20 to the air in the metal tube, Make the air hot. The high-temperature air rises in the metal tube 20 and is discharged above the metal case 2, so that the cool air below the metal case 2 enters the metal tube 20.

On the other hand, a part of the heat transferred to the metal tube 20 is transferred to the metal case 2 through the metal tube 20,
It is discharged from the outer wall of the metal case 2 to the outside. By installing a fan so that the inside of the metal tube 20 is forcibly ventilated in the electronic device equipped with the electronic module, the cooling performance of the high heat generating component is further improved.

In the embodiment shown in FIG. 1, the mother printed board 1 is vertically mounted on the shelf or the like, and the metal tube is running in the vertical direction. Therefore, the cooling performance is improved without forced ventilation. However, if the electronic module is mounted such that the metal tube is horizontal, forced ventilation is especially desirable.

The electronic module shown in FIG. 2 is different from the brush shown in FIG. 1 only in that a radiation fin is provided in the metal tube. The metal tube 20 shown in FIG. 2 is provided with a plurality of heat radiation fins 25 that run in the axial direction inside the metal tube. The radiating fins 25 running in the axial direction of FIG.
A radiating fin smaller than the radius is provided so that the base is fixed to the inner wall and the tip is directed to the center,
The heat radiation fin according to the present invention is not limited to the illustrated example. That is, a structure may be employed in which radiation fins are formed radially on the outer peripheral surface of the shaft running along the axis, and the tips of each radiation fin are connected to the inner wall of the metal tube.

By providing the heat radiation fins in the metal tube, the heat radiation area in contact with the air in the metal tube is increased, so that the heat radiation property is further improved as compared with that in FIG.
In FIG. 3, reference numeral 40 is a printed board with a metal core having a plate-shaped metal core 41 such as aluminum. A printed circuit board 40 with a metal core is mounted with a high heat generating component 5 such as a semiconductor device and other circuit components.

The printed circuit board 40 with a metal core is housed and attached in parallel to the bottom plate 2-1 of a shallow box-shaped metal case having an opening on one side, and then the opening is closed by the cover 3. In addition, the metal tube 20 penetrates the metal case 2 in parallel with the side edges of the bottom plate 2-1 and the printed board 4, and both ends thereof penetrate the opposite side plates 2-2 of the metal case 2, respectively. The outer peripheral surfaces of the parts are fixed to the side plates 2-2 by brazing or the like.

Then, the metal tube 20 of the metal core 41 is exposed, and the exposed side edges are fixed to the outer peripheral surface of the metal tube 20 by brazing or the like. Therefore, the heat of the high heat-generating component 5 is transferred to the metal core 41 of the printed circuit board 40 with a metal core and is transferred to the metal tube 20 via the metal core 41, and the air inside the metal tube 20 is discharged as a medium to the outside. To be done.

The printed board on which the high heat generating component 5 is mounted is the printed board 40 with a metal core, so that the high heat generating component 5 is
There is no need to attach a heat transfer plate directly to. Therefore, the invention of claim 3 has an advantage that cooling can be performed regardless of the shape of the high heat-generating component 5.

[0031]

As described above, according to the present invention, the metal tube penetrating the metal case is provided, and the air in the metal tube is used as a medium to radiate the heat of the high heat generating component to the outside. This has the effect of improving the cooling performance of the high heat generating component housed in the metal case.

Further, by providing the radiation fins in the metal tube or installing the fan in the electronic device having the electronic module mounted therein, the cooling performance is further improved. On the other hand, when the printed board on which the high heat generating component is mounted is the printed board with the metal core, there is an advantage that the cooling property is improved regardless of the shape of the high heat generating component.

[Brief description of drawings]

FIG. 1 is a diagram of an embodiment of the present invention (A) is a perspective view (B) is a sectional view

FIG. 2 is a sectional view of another embodiment of the present invention.

FIG. 3 is a sectional view of still another embodiment of the present invention.

FIG. 4 is a perspective view of a conventional example, and FIG.

[Explanation of symbols]

1 Mother Printed Board 2 Metal Case 2-1 Bottom Plate 2-2 Side Plate 3 Cover 4 Printed Board 5 High Heat-generating Components 10 Metal Plate 11,21 Heat Transfer Plate 20 Metal Tube 25 Radiating Fin 40 Printed Board with Metal Core 41 Metal Core

Claims (4)

[Claims] 1. A printed board 4 having a high heat-generating component 5 mounted therein and housed in a metal case 2, and penetrates the metal case 2, and both ends penetrate side plates 2-2 of the metal case 2 facing each other. And a metal tube 20 fixed to the side plate 2-2, one end of which is in close contact with the high heat generating component 5 and the other end of which is the metal tube.
A heat dissipation structure for an electronic module, comprising: a heat transfer plate 21 closely attached to the outer peripheral surface of 20. 2. The heat dissipation structure for an electronic module according to claim 1, wherein heat dissipation fins 25 that run in the axial direction are provided in the metal tube 20. 3. A printed board 40 with a metal core, in which a high heat-generating component 5 is mounted and which is housed in a metal case 2, and side plates 2-2 which penetrate the metal case 2 and whose both ends are opposed to the metal case 2. A metal tube 20 penetrating each of the metal tubes 20 and fixed to the side plate 2-2, or a metal tube having a heat radiation fin on the inner wall thereof, wherein the side edge of the metal core 41 of the metal core-printed printed board 40 is A heat dissipation structure for an electronic module, which is in close contact with the outer peripheral surface of the metal tube 20. 4. An electronic device equipped with an electronic module,
The heat dissipating structure for an electronic module according to claim 1, wherein a fan is installed so as to forcibly ventilate the inside of the metal tube.