JP3026383B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a plurality of fins extending from a base of a radiating fin, the semiconductor fin being mounted on the base of the radiating fin, and being arranged at a position in a direction in which the fin extends. The present invention relates to a semiconductor device including a heat-generating component such as a resistor.

[0002]

2. Description of the Related Art As a conventional semiconductor device, for example, there is one as shown in FIG. Base upper surface 2 of radiation fin 1
A plurality of semiconductor elements 3 are screwed with element mounting screws, and connection bars 4 are screwed into input and output terminals of the semiconductor element 3 so that a predetermined circuit configuration is obtained. A fan 8 for cooling air is arranged on the rear surface of the radiation fin 1, and a mounting stand 5 is screwed to the radiation fin 1. A board 6 is screwed to the mounting stand 5, and a heat-generating component 7 such as a resistor located below the radiating fin 1 is mounted on the board 6. There is a space between the heat radiating fin 1 and the heat generating component 7, and the radiant heat from the heat generating component 7 and the heat transfer through the substrate 6 to the mounting stand 5 affect the heat radiating fin 1.

On the other hand, when a plurality of semiconductor elements 3 of this kind are mounted on the upper surface 2 of the base of the radiating fin 1 to form a predetermined circuit, an operation of consuming electric energy to a resistor or the like for a certain period of time is performed. In this case, a large current flows through the heat-generating component 7 such as a resistor, so that a large amount of heat is generated. Therefore, a metal clad resistor or the like is used.

Although not shown, the heat generating component 7 is connected to the substrate 6.
Some are directly attached to the side surfaces of the radiation fins 1 without using the fins.

[0005]

However, in such a conventional semiconductor device, it is needless to say that the heat generating component 7, which is another heat source other than the semiconductor element 3, is directly fixed to the radiating fin 1. The heat radiating fin 1 has a problem that it is necessary to use a large radiating fin having a larger cooling capacity than originally considered as a cooling body of the semiconductor element 3 due to heat transfer and radiant heat.

If the heat radiation fins 1 and the heat-generating component 7 are separated from each other, there is a problem that the whole device is naturally large and the cost is increased.

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and is intended to cut off heat from a heat-generating component which is another heat source other than a semiconductor element which generates heat, thereby preventing a decrease in cooling efficiency. It is another object of the present invention to provide a semiconductor device in which the entire device is reduced in size.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the gist of the present invention is as follows: 1 A heat-generating component (20) such as a resistor;
0) and a heat-generating semiconductor element (40) mounted on the radiation fin (10).
The radiation fin (10) has a plurality of fins (1) on the inner surface side of the base (11) toward the heat-generating component (20).
2) is extended, and the semiconductor element (40) is mounted on an outer surface side opposite to an inner surface side of the base (11) of the heat radiation fin (10), and the semiconductor element (40) is extended from the heat generating component (20). The gap between the heat-generating component (20) and the heat-radiating fin (10) is shielded by a shielding member (30) so that the radiant heat of the heat-generating component (2) is not transmitted to the heat-generating component (2).
A semiconductor device characterized in that it is partitioned into a gap on the 0) side and a gap on the radiation fin (10) side.

2) The heat-generating component (20) or the substrate (15) on which the heat-generating component (20) is mounted is
2. The semiconductor device according to claim 1, wherein the semiconductor device is fixed to the radiating fin (10) via the first and second fins (0, 60a).

[0010]

The semiconductor element (40) is mounted on the base (11) of the radiating fin (10), and a heat-generating component (20) such as a resistor is arranged at a position in the fin extending direction of the radiating fin (10). I have.

Since the shielding member (30) is interposed between the heat-generating component (20) and the radiation fin (10), the heat-generating component (2)
The radiation heat from (0) is less likely to be transmitted to the radiation fins (10), and the radiation fins (10) need only be large enough to cool only the semiconductor element (40) that generates heat.

The heating component (20) or the heating component (2)
0) is mounted on the substrate (15) by spacers (60, 60).
a), the heat-generating component (20) is directly or directly connected to the heat-generating component (2).
Radiating fins (1) through a substrate (15) on which
The heat transfer at 0) is extremely small.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Various embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a first embodiment of the present invention. As shown in FIGS. 1 and 3, a shielding member 30 is provided between the heat radiation fin 10 and a heat generating component 20 such as a resistor. The shielding member 30 is preferably made of a heat-resistant insulating material, but may be made of a metal plate.

Three semiconductor elements 40 are mounted on the upper surface of the base 11 of the radiation fin 10. Each semiconductor element 40
A connection bar 41 is connected to the input and output terminals.
A plurality of fins 12 project downward from the base 11.

A stand member 14 is screwed to both side walls 13 of the radiation fin 10. A board 15 for mounting the heat-generating component 20 is provided on the stand member 14.
A gap 16 is formed between the heat generating component 20 and each end of the fin 12 of the heat radiation fin 10.

The shielding member 30 is screwed to the lower end of both side walls 13 of the radiating fin 10. At this time, the radiation fin 1
The gap A between each tip of the fin 12 and the shielding member 30 is 5
mm or more is preferable. Further, the shielding member 30
It is preferable that the gap B between the heat generating component 20 and the heat generating component 20 is also 5 mm or more.

As shown in FIGS. 2 and 3, a cooling fan 50 for passing air between the fins 12 is fixed to the rear surface of the radiating fins 10.

The cooling fins 10 are cooled such that air flows from the fan 50 for air cooling from right to left in the direction of the arrow shown in FIG.

Next, the operation will be described. The radiant heat from the heat generating component 20 is blocked by the shielding member 30 and transmission to the radiation fins 10 becomes extremely small. Therefore, the temperature of the radiating fins 10 hardly rises due to the radiant heat, and only the heat from the semiconductor element 40 is mainly released from the fins 12 of the radiating fins 10. Thereby, the semiconductor element 4
0 is cooled.

FIGS. 4 and 5 show a second embodiment of the present invention.

The same parts as those in the first embodiment are denoted by the same reference numerals, and duplicate description will be omitted. A shielding member 30 is provided at the lower end of both side walls 13 of the radiation fin 10 and is screwed by a screw portion (not shown) of a spacer 60 formed of a heat-resistant member or the like.

Next, the substrate 15a on which the heat generating component 20 is mounted
Are screwed to the spacer 60.

The board 15b for mounting the heat-generating component 20
As shown in FIG. 5, the spacer 6 is attached to the stand member 14.
It may be screwed via 0a.

In the second embodiment, when the substrates 15a and 15b for mounting the heat-generating component 20 are heated by the heat transfer from the heat-generating component 20, the heat is transmitted through the shielding member 30 by the spacers 60 and 60a. In order to prevent transmission to the radiating fins 10 and to the radiating fins 10 via the stand member 14, the thermal insulation between the radiating fins 10 and the heat generating component 20 can be further improved.

The heat-generating component 20 is not necessarily composed of the substrates 15a, 15
b need not be directly mounted on the spacers 60, 60a.
May be screwed through. Also, spacers 60 and 6
Oa is preferably made of a heat insulating member,
When interposed as a spacer only at the screwed portion, it may be made of metal.

Next, examples of actual temperature measurement in the first and second embodiments will be described.

In the actual measurement, the total output power of the semiconductor element 40 mounted on the upper surface of the base 11 of the radiation fin 10 is 1 kW, and the radiation fin 10 is forcibly air-cooled by a wind-cooling fan. The shielding member 30 is made of aluminum.

Temperature measurement points P1 and P2 on the contact surface (upper part of base 11) between semiconductor element 40 and radiation fin 10 (FIG. 2)
Are shown in Table 1 below.

[0029]

[Table 1]

In the above embodiment, the spacers 60 and 60a are interposed in the middle of the heat transfer path from the board for mounting the heat-generating components to the radiating fins 10. A spacer may be interposed in the middle of the heat transfer path.

[0031]

According to the semiconductor device according to the present invention, when a heat-generating component such as a resistor is mounted on a heat-radiating fin for cooling a semiconductor element incorporated in the semiconductor device, the heat-generating component between the heat-radiating fin and the heat-generating component is required. Since the shielding member for blocking the radiant heat is interposed in the gap, the semiconductor element can be effectively cooled by the small radiating fins, and as a result, the cost can be reduced.

Further, since the spacer is interposed in the middle of the heat transfer path from the heat generating component to the heat radiating fin, heat transfer to the heat radiating fin can be minimized, and the semiconductor element can be effectively reduced by the small heat radiating fin. It becomes possible to cool.

[Brief description of the drawings]

FIG. 1 is a front view of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a side view of the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a plan view of the semiconductor device according to the first embodiment of the present invention.

FIG. 4 is a front view of a semiconductor device according to a second embodiment of the present invention.

FIG. 5 is a partial front view of a semiconductor device according to a second embodiment of the present invention.

FIG. 6 is a front view of a semiconductor device showing a conventional example.

[Description of Reference Numerals] 10: heat dissipating fins 11: base 12: fins 13: side walls 14: stand members 15, 15a, 15b: substrate 20: heat generating components 30: shielding members 40: semiconductor elements 50: fans for air cooling

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 7/20 H01L 23/40

Claims (2)

(57) [Claims] 1. A semiconductor device comprising: a heat-generating component such as a resistor; a heat-radiating fin; and a heat-generating semiconductor element mounted on the heat-radiating fin, wherein the heat-radiating fin is provided on an inner surface of a base thereof. The semiconductor element is mounted on an outer surface side opposite to an inner surface side of a base of the heat radiation fin, and radiant heat from the heat generating component is not transmitted to the heat radiation fin. As described above, a gap between the heat-generating component and the radiation fin is divided into a gap on the heat-generating component side and a gap on the heat-radiation fin side by a shielding member. 2. The semiconductor device according to claim 1, wherein said heat-generating component or a substrate on which said heat-generating component is mounted is fixed to said heat-radiating fin side via a spacer.