JPH03116766A - Lead frame for resin sealed semiconductor device - Google Patents
Lead frame for resin sealed semiconductor deviceInfo
- Publication number
- JPH03116766A JPH03116766A JP25418689A JP25418689A JPH03116766A JP H03116766 A JPH03116766 A JP H03116766A JP 25418689 A JP25418689 A JP 25418689A JP 25418689 A JP25418689 A JP 25418689A JP H03116766 A JPH03116766 A JP H03116766A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- resin
- semiconductor device
- outer lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 239000011347 resin Substances 0.000 title abstract description 16
- 229920005989 resin Polymers 0.000 title abstract description 16
- 238000007665 sagging Methods 0.000 abstract description 4
- 239000012141 concentrate Substances 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止半導体装置用リードフレームに関し、
特にモールド付根に樹脂残りが発生しない樹脂封止半導
体装置用リードフレームに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lead frame for a resin-sealed semiconductor device,
In particular, the present invention relates to a lead frame for a resin-sealed semiconductor device in which no resin remains at the base of the mold.
従来、樹脂封止半導体装置は、リードフレームに組立て
られた半導体素子が樹脂封止されタイバ一部およびダム
樹脂が除去され第２図の構成となっている１図において
、１１はモールドパッケージ、１２はタイバ一部、１３
はアウターリードである。Conventionally, a resin-sealed semiconductor device has the configuration shown in FIG. 2, in which a semiconductor element assembled on a lead frame is resin-sealed and a portion of the tie bar and dam resin are removed, in which 11 is a molded package, 12 is part of Taiba, 13
is the outer lead.
上述した従来の半導体装置用リードフレームは、モール
ドパッケージとタイバー闇のダム樹脂を樹脂抜きポンチ
で抜く際にモールド付根に樹脂残りが発生しやすいとい
う欠点がある。The conventional lead frame for a semiconductor device described above has a drawback in that when the dam resin between the mold package and the tie bar is removed using a resin punch, resin remains are likely to be left at the base of the mold.
また、製作又は取扱時に肩ダレ、横方向曲りが発生する
という欠点もあった。In addition, there was also the drawback that shoulder sagging and lateral bending occurred during manufacturing and handling.
本発明の目的は、ダム樹脂が抜き易く、かつリードの肩
ダレ、横方向曲りを低減できる樹脂封止半導体装置用リ
ードフレームを提供することにある。An object of the present invention is to provide a lead frame for a resin-sealed semiconductor device in which the dam resin can be easily removed and shoulder sagging and lateral bending of the leads can be reduced.
本発明の樹脂封止半導体装置用リードフレームは、リー
ドフレームのアウターリードがモールドパッケージの付
根部分に両側にのびる突起を有することを特徴として構
成される。The lead frame for a resin-sealed semiconductor device of the present invention is characterized in that the outer lead of the lead frame has protrusions extending on both sides at the base of the molded package.
次に、本発明について図面を参照して説明する。第１図
は本発明の一実施例のリードフレームを使用した樹脂封
止半導体装置の要部の模式的平面図である。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a schematic plan view of a main part of a resin-sealed semiconductor device using a lead frame according to an embodiment of the present invention.
第１図に示すように、本発明の一実施例のリードフレー
ムは、モールドパッケージ１とアウターリード４の境に
アウターリードの突起部２がアウターリードの両側に突
出して設けられている。図において３はタイバ一部であ
り、５はタイバー切断前におけるダム樹脂を示している
。図示されているようにモールドパッケージとの境にア
ウターリードの突起部２があるためパッケージとダム樹
脂との接触面積は小さくなり、応力を集中させることに
より、ダム樹脂が抜きやすくなる。また突起がストッパ
ーとなってリードの肩ダレ、横方向曲りを低減させるこ
とができる。As shown in FIG. 1, in a lead frame according to an embodiment of the present invention, projections 2 of the outer lead are provided at the boundary between a molded package 1 and an outer lead 4 so as to protrude from both sides of the outer lead. In the figure, 3 is a part of the tie bar, and 5 is the dam resin before the tie bar is cut. As shown in the figure, since there is a protrusion 2 of the outer lead at the border with the molded package, the contact area between the package and the dam resin becomes small, and by concentrating stress, the dam resin can be easily removed. In addition, the protrusions act as stoppers to reduce shoulder sag and lateral bending of the reed.
以上説明したように本発明は、モールドパッケージとダ
ム樹脂の境にアウターリードの突起を設けることにより
樹脂抜きを容易にし、リードの肩ダレ、横方向曲りを低
減する効果がある。As described above, the present invention has the effect of facilitating resin removal by providing a protrusion of the outer lead at the boundary between the molded package and the dam resin, and reducing shoulder sag and lateral bending of the lead.
第１図は本発明の一実施例のリードフレームを用いて形
成した半導体装置の要部の模式的平面図、第２図は従来
のリードフレームを用いて形成した半導体装置の要部の
模式的平面図である。
１．１１・・・モールドパッケージ、２・・・突起部、
３．１２・・・ダイパ一部、４，１３・・・アウターリ
ード、５・・・ダム樹脂。FIG. 1 is a schematic plan view of the main parts of a semiconductor device formed using a lead frame according to an embodiment of the present invention, and FIG. 2 is a schematic plan view of the main parts of a semiconductor device formed using a conventional lead frame. FIG. 1.11...Mold package, 2...Protrusion,
3.12...Part of the dieper, 4,13...Outer lead, 5...Dam resin.
Claims (1)
の付根部分に両側にのびる突起を有することを特徴とす
る樹脂封止半導体装置用リードフレーム。A lead frame for a resin-sealed semiconductor device, characterized in that an outer lead of the lead frame has protrusions extending on both sides at the base of a molded package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25418689A JPH03116766A (en) | 1989-09-28 | 1989-09-28 | Lead frame for resin sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25418689A JPH03116766A (en) | 1989-09-28 | 1989-09-28 | Lead frame for resin sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116766A true JPH03116766A (en) | 1991-05-17 |
Family
ID=17261431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25418689A Pending JPH03116766A (en) | 1989-09-28 | 1989-09-28 | Lead frame for resin sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116766A (en) |
-
1989
- 1989-09-28 JP JP25418689A patent/JPH03116766A/en active Pending
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