JPH0311666Y2 - - Google Patents
Info
- Publication number
- JPH0311666Y2 JPH0311666Y2 JP7114385U JP7114385U JPH0311666Y2 JP H0311666 Y2 JPH0311666 Y2 JP H0311666Y2 JP 7114385 U JP7114385 U JP 7114385U JP 7114385 U JP7114385 U JP 7114385U JP H0311666 Y2 JPH0311666 Y2 JP H0311666Y2
- Authority
- JP
- Japan
- Prior art keywords
- valve
- passage
- valve body
- valve seat
- liquid refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003507 refrigerant Substances 0.000 claims description 38
- 239000007788 liquid Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 17
- 239000012530 fluid Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Temperature-Responsive Valves (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7114385U JPH0311666Y2 (el) | 1985-05-13 | 1985-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7114385U JPH0311666Y2 (el) | 1985-05-13 | 1985-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61186073U JPS61186073U (el) | 1986-11-20 |
| JPH0311666Y2 true JPH0311666Y2 (el) | 1991-03-20 |
Family
ID=30608369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7114385U Expired JPH0311666Y2 (el) | 1985-05-13 | 1985-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311666Y2 (el) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9390974B2 (en) | 2012-12-21 | 2016-07-12 | Qualcomm Incorporated | Back-to-back stacked integrated circuit assembly and method of making |
| US9412644B2 (en) | 2009-07-15 | 2016-08-09 | Qualcomm Incorporated | Integrated circuit assembly and method of making |
| US9466719B2 (en) | 2009-07-15 | 2016-10-11 | Qualcomm Incorporated | Semiconductor-on-insulator with back side strain topology |
| US9496227B2 (en) | 2009-07-15 | 2016-11-15 | Qualcomm Incorporated | Semiconductor-on-insulator with back side support layer |
| US9515181B2 (en) | 2014-08-06 | 2016-12-06 | Qualcomm Incorporated | Semiconductor device with self-aligned back side features |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5083107B2 (ja) * | 2008-08-05 | 2012-11-28 | 株式会社デンソー | 膨張弁及びそれを備えた蒸気圧縮式冷凍サイクル |
-
1985
- 1985-05-13 JP JP7114385U patent/JPH0311666Y2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9412644B2 (en) | 2009-07-15 | 2016-08-09 | Qualcomm Incorporated | Integrated circuit assembly and method of making |
| US9466719B2 (en) | 2009-07-15 | 2016-10-11 | Qualcomm Incorporated | Semiconductor-on-insulator with back side strain topology |
| US9496227B2 (en) | 2009-07-15 | 2016-11-15 | Qualcomm Incorporated | Semiconductor-on-insulator with back side support layer |
| US9390974B2 (en) | 2012-12-21 | 2016-07-12 | Qualcomm Incorporated | Back-to-back stacked integrated circuit assembly and method of making |
| US9515181B2 (en) | 2014-08-06 | 2016-12-06 | Qualcomm Incorporated | Semiconductor device with self-aligned back side features |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61186073U (el) | 1986-11-20 |
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