JPH03115829U - - Google Patents
Info
- Publication number
- JPH03115829U JPH03115829U JP8920290U JP8920290U JPH03115829U JP H03115829 U JPH03115829 U JP H03115829U JP 8920290 U JP8920290 U JP 8920290U JP 8920290 U JP8920290 U JP 8920290U JP H03115829 U JPH03115829 U JP H03115829U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sensitive element
- lead
- resistant
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Radiation Pyrometers (AREA)
- Fixing For Electrophotography (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990089202U JP2506241Y2 (ja) | 1989-09-26 | 1990-08-28 | 非接触形温度検出器 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11162189 | 1989-09-26 | ||
JP1-111621 | 1990-01-17 | ||
JP237990 | 1990-01-17 | ||
JP2-2379 | 1990-01-17 | ||
JP1990089202U JP2506241Y2 (ja) | 1989-09-26 | 1990-08-28 | 非接触形温度検出器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03115829U true JPH03115829U (US06818201-20041116-C00086.png) | 1991-12-02 |
JP2506241Y2 JP2506241Y2 (ja) | 1996-08-07 |
Family
ID=31891825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990089202U Expired - Fee Related JP2506241Y2 (ja) | 1989-09-26 | 1990-08-28 | 非接触形温度検出器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2506241Y2 (US06818201-20041116-C00086.png) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006192779A (ja) * | 2005-01-14 | 2006-07-27 | Noritsu Koki Co Ltd | 記録媒体処理装置 |
JP2010281578A (ja) * | 2009-06-02 | 2010-12-16 | Mitsubishi Materials Corp | 温度センサ |
JP2012098088A (ja) * | 2010-10-29 | 2012-05-24 | Tdk Corp | 温度センサ |
JP2014145655A (ja) * | 2013-01-29 | 2014-08-14 | Mitsubishi Materials Corp | 温度センサ |
JP2018036283A (ja) * | 2017-12-06 | 2018-03-08 | 三菱マテリアル株式会社 | 非接触温度センサ |
WO2021100312A1 (ja) * | 2019-11-21 | 2021-05-27 | 株式会社芝浦電子 | 赤外線温度センサ、温度検出装置、および画像形成装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5644257B2 (ja) * | 2010-08-20 | 2014-12-24 | Tdk株式会社 | 温度センサ |
JP5866881B2 (ja) * | 2011-08-31 | 2016-02-24 | Tdk株式会社 | 赤外線温度センサ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56103832U (US06818201-20041116-C00086.png) * | 1980-01-14 | 1981-08-14 | ||
JPS5882637U (ja) * | 1981-11-30 | 1983-06-04 | 松下電工株式会社 | 温度センサ |
JPS61116631A (ja) * | 1984-11-12 | 1986-06-04 | Nok Corp | 薄膜サ−ミスタおよびその製造法 |
JPS61147125A (ja) * | 1984-12-20 | 1986-07-04 | Omron Tateisi Electronics Co | シ−ト形感温プロ−ブ |
JPS61256601A (ja) * | 1985-05-09 | 1986-11-14 | エヌオーケー株式会社 | 高分子薄膜感温素子 |
-
1990
- 1990-08-28 JP JP1990089202U patent/JP2506241Y2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56103832U (US06818201-20041116-C00086.png) * | 1980-01-14 | 1981-08-14 | ||
JPS5882637U (ja) * | 1981-11-30 | 1983-06-04 | 松下電工株式会社 | 温度センサ |
JPS61116631A (ja) * | 1984-11-12 | 1986-06-04 | Nok Corp | 薄膜サ−ミスタおよびその製造法 |
JPS61147125A (ja) * | 1984-12-20 | 1986-07-04 | Omron Tateisi Electronics Co | シ−ト形感温プロ−ブ |
JPS61256601A (ja) * | 1985-05-09 | 1986-11-14 | エヌオーケー株式会社 | 高分子薄膜感温素子 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006192779A (ja) * | 2005-01-14 | 2006-07-27 | Noritsu Koki Co Ltd | 記録媒体処理装置 |
JP2010281578A (ja) * | 2009-06-02 | 2010-12-16 | Mitsubishi Materials Corp | 温度センサ |
JP2012098088A (ja) * | 2010-10-29 | 2012-05-24 | Tdk Corp | 温度センサ |
JP2014145655A (ja) * | 2013-01-29 | 2014-08-14 | Mitsubishi Materials Corp | 温度センサ |
JP2018036283A (ja) * | 2017-12-06 | 2018-03-08 | 三菱マテリアル株式会社 | 非接触温度センサ |
WO2021100312A1 (ja) * | 2019-11-21 | 2021-05-27 | 株式会社芝浦電子 | 赤外線温度センサ、温度検出装置、および画像形成装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2506241Y2 (ja) | 1996-08-07 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |