JPH0311545B2 - - Google Patents

Info

Publication number
JPH0311545B2
JPH0311545B2 JP58208032A JP20803283A JPH0311545B2 JP H0311545 B2 JPH0311545 B2 JP H0311545B2 JP 58208032 A JP58208032 A JP 58208032A JP 20803283 A JP20803283 A JP 20803283A JP H0311545 B2 JPH0311545 B2 JP H0311545B2
Authority
JP
Japan
Prior art keywords
aluminum
cooling
post
copper
cooling body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58208032A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60100458A (ja
Inventor
Masao Niki
Isao Goto
Hiroshi Kuriki
Kunio Tazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aichi Steel Corp
Original Assignee
Aichi Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aichi Steel Corp filed Critical Aichi Steel Corp
Priority to JP58208032A priority Critical patent/JPS60100458A/ja
Publication of JPS60100458A publication Critical patent/JPS60100458A/ja
Publication of JPH0311545B2 publication Critical patent/JPH0311545B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58208032A 1983-11-04 1983-11-04 アルミニウム製積層冷却体の製造方法 Granted JPS60100458A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58208032A JPS60100458A (ja) 1983-11-04 1983-11-04 アルミニウム製積層冷却体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58208032A JPS60100458A (ja) 1983-11-04 1983-11-04 アルミニウム製積層冷却体の製造方法

Publications (2)

Publication Number Publication Date
JPS60100458A JPS60100458A (ja) 1985-06-04
JPH0311545B2 true JPH0311545B2 (enExample) 1991-02-18

Family

ID=16549538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58208032A Granted JPS60100458A (ja) 1983-11-04 1983-11-04 アルミニウム製積層冷却体の製造方法

Country Status (1)

Country Link
JP (1) JPS60100458A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0369242U (enExample) * 1989-11-13 1991-07-09

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717151U (enExample) * 1980-07-03 1982-01-28

Also Published As

Publication number Publication date
JPS60100458A (ja) 1985-06-04

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