JPH03112822U - - Google Patents

Info

Publication number
JPH03112822U
JPH03112822U JP2049290U JP2049290U JPH03112822U JP H03112822 U JPH03112822 U JP H03112822U JP 2049290 U JP2049290 U JP 2049290U JP 2049290 U JP2049290 U JP 2049290U JP H03112822 U JPH03112822 U JP H03112822U
Authority
JP
Japan
Prior art keywords
case
power element
particles
control board
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2049290U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2049290U priority Critical patent/JPH03112822U/ja
Publication of JPH03112822U publication Critical patent/JPH03112822U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示す半導体接触器
の断面図、第2図および第3図は従来の半導体接
触器の断面図である。 1…ケース、2…ベース板、5,6…パワー素
子、15…制御回路部、25…シリコーン系樹脂
、26…空気層、30…ガラスビーズ、31…プ
リント基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. ケースと、このケース内に設けられ負荷を通断
    電制御するためのパワー素子と、このパワー素子
    を制御する制御基板部と、前記パワー素子および
    制御基板部を覆うように前記ケース内に上部に所
    定の空気層を存して収納された絶縁用樹脂層とか
    らなる半導体接触器において、前記絶縁用樹脂層
    は無機質絶縁物の粒子と、この粒子を混入したシ
    リコーン系樹脂とからなることを特徴とする半導
    体接触器。
JP2049290U 1990-03-02 1990-03-02 Pending JPH03112822U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2049290U JPH03112822U (ja) 1990-03-02 1990-03-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2049290U JPH03112822U (ja) 1990-03-02 1990-03-02

Publications (1)

Publication Number Publication Date
JPH03112822U true JPH03112822U (ja) 1991-11-19

Family

ID=31523586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2049290U Pending JPH03112822U (ja) 1990-03-02 1990-03-02

Country Status (1)

Country Link
JP (1) JPH03112822U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112428A (ja) * 2006-10-02 2008-05-15 Shinko Electric Co Ltd 水処理施設における流入水水質の統計的予測方法及びその装置
KR101354483B1 (ko) * 2012-03-26 2014-01-27 (주)백년기술 Bod 측정장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112428A (ja) * 2006-10-02 2008-05-15 Shinko Electric Co Ltd 水処理施設における流入水水質の統計的予測方法及びその装置
KR101354483B1 (ko) * 2012-03-26 2014-01-27 (주)백년기술 Bod 측정장치

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