JPH03110847U - - Google Patents
Info
- Publication number
- JPH03110847U JPH03110847U JP2030390U JP2030390U JPH03110847U JP H03110847 U JPH03110847 U JP H03110847U JP 2030390 U JP2030390 U JP 2030390U JP 2030390 U JP2030390 U JP 2030390U JP H03110847 U JPH03110847 U JP H03110847U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead pins
- integrated circuit
- exposed portion
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2030390U JPH03110847U (de) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2030390U JPH03110847U (de) | 1990-02-28 | 1990-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110847U true JPH03110847U (de) | 1991-11-13 |
Family
ID=31523399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2030390U Pending JPH03110847U (de) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110847U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998008251A1 (fr) * | 1996-08-20 | 1998-02-26 | Hitachi, Ltd. | Semi-conducteur et procede de fabrication correspondant |
| JP2003007966A (ja) * | 2001-06-19 | 2003-01-10 | Mitsubishi Electric Corp | 半導体装置 |
-
1990
- 1990-02-28 JP JP2030390U patent/JPH03110847U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998008251A1 (fr) * | 1996-08-20 | 1998-02-26 | Hitachi, Ltd. | Semi-conducteur et procede de fabrication correspondant |
| JP2003007966A (ja) * | 2001-06-19 | 2003-01-10 | Mitsubishi Electric Corp | 半導体装置 |
| JP4540884B2 (ja) * | 2001-06-19 | 2010-09-08 | 三菱電機株式会社 | 半導体装置 |
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