JPH03110845U - - Google Patents

Info

Publication number
JPH03110845U
JPH03110845U JP2015890U JP2015890U JPH03110845U JP H03110845 U JPH03110845 U JP H03110845U JP 2015890 U JP2015890 U JP 2015890U JP 2015890 U JP2015890 U JP 2015890U JP H03110845 U JPH03110845 U JP H03110845U
Authority
JP
Japan
Prior art keywords
cavity
package
dummy
gate
lower molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015890U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2015890U priority Critical patent/JPH03110845U/ja
Publication of JPH03110845U publication Critical patent/JPH03110845U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2015890U 1990-02-27 1990-02-27 Pending JPH03110845U (pm)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015890U JPH03110845U (pm) 1990-02-27 1990-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015890U JPH03110845U (pm) 1990-02-27 1990-02-27

Publications (1)

Publication Number Publication Date
JPH03110845U true JPH03110845U (pm) 1991-11-13

Family

ID=31523254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015890U Pending JPH03110845U (pm) 1990-02-27 1990-02-27

Country Status (1)

Country Link
JP (1) JPH03110845U (pm)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974805B1 (ko) * 2010-02-01 2010-08-06 제주관광대학 산학협력단 치은 형성 조각도
CN102157398A (zh) * 2010-02-03 2011-08-17 第一精工株式会社 树脂封固金属模装置
KR101373067B1 (ko) * 2012-06-19 2014-03-11 조선대학교산학협력단 잇몸 채취기
JP2019209665A (ja) * 2018-06-08 2019-12-12 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974805B1 (ko) * 2010-02-01 2010-08-06 제주관광대학 산학협력단 치은 형성 조각도
CN102157398A (zh) * 2010-02-03 2011-08-17 第一精工株式会社 树脂封固金属模装置
JP2011159915A (ja) * 2010-02-03 2011-08-18 Daiichi Seiko Kk 樹脂封止金型装置
KR101373067B1 (ko) * 2012-06-19 2014-03-11 조선대학교산학협력단 잇몸 채취기
JP2019209665A (ja) * 2018-06-08 2019-12-12 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法

Similar Documents

Publication Publication Date Title
JPH03110845U (pm)
JPS5926244U (ja) 半導体樹脂封入成形用の成形装置
JPH032638U (pm)
JPH03124811U (pm)
JPS63125523U (pm)
JPH032639U (pm)
JPH0313737U (pm)
JPH0437313U (pm)
JPS58118736U (ja) トランスフア−成形装置
JPS642440U (pm)
JPS6034417U (ja) 多数列取り射出成形金型装置
JPS59171914U (ja) 射出成形用金型
JPS60105515A (ja) モ−ルド金型
JPS62166637U (pm)
JPS58184839U (ja) 樹脂モ−ルド装置
JPH0258919U (pm)
JPS5826525U (ja) 射出成形金型
JPS5926321U (ja) 射出成形用金型
JPS58180029U (ja) 成形用金型
JPS58181516U (ja) 樹脂成形用金型
JPS6075013U (ja) 樹脂成形用金型装置
JPH0447516U (pm)
JPS63100214U (pm)
JPS6388416U (pm)
JPS6167111U (pm)