JPH03109374U - - Google Patents
Info
- Publication number
- JPH03109374U JPH03109374U JP1654790U JP1654790U JPH03109374U JP H03109374 U JPH03109374 U JP H03109374U JP 1654790 U JP1654790 U JP 1654790U JP 1654790 U JP1654790 U JP 1654790U JP H03109374 U JPH03109374 U JP H03109374U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- glaze layer
- wiring board
- printed wiring
- silver palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016547U JPH0751810Y2 (ja) | 1990-02-21 | 1990-02-21 | サーマルヘッド用印刷配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016547U JPH0751810Y2 (ja) | 1990-02-21 | 1990-02-21 | サーマルヘッド用印刷配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03109374U true JPH03109374U (US20030199744A1-20031023-C00003.png) | 1991-11-11 |
| JPH0751810Y2 JPH0751810Y2 (ja) | 1995-11-22 |
Family
ID=31519808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990016547U Expired - Fee Related JPH0751810Y2 (ja) | 1990-02-21 | 1990-02-21 | サーマルヘッド用印刷配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751810Y2 (US20030199744A1-20031023-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124744A (ja) * | 2000-10-12 | 2002-04-26 | Eastern Co Ltd | 回路基板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5035665A (US20030199744A1-20031023-C00003.png) * | 1973-07-23 | 1975-04-04 | ||
| JPS62216983A (ja) * | 1986-03-15 | 1987-09-24 | 住友電気工業株式会社 | 金属化層を有する窒化アルミニウム焼結体並びにその製造方法 |
-
1990
- 1990-02-21 JP JP1990016547U patent/JPH0751810Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5035665A (US20030199744A1-20031023-C00003.png) * | 1973-07-23 | 1975-04-04 | ||
| JPS62216983A (ja) * | 1986-03-15 | 1987-09-24 | 住友電気工業株式会社 | 金属化層を有する窒化アルミニウム焼結体並びにその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124744A (ja) * | 2000-10-12 | 2002-04-26 | Eastern Co Ltd | 回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0751810Y2 (ja) | 1995-11-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |