JPH03108683U - - Google Patents

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Publication number
JPH03108683U
JPH03108683U JP1783090U JP1783090U JPH03108683U JP H03108683 U JPH03108683 U JP H03108683U JP 1783090 U JP1783090 U JP 1783090U JP 1783090 U JP1783090 U JP 1783090U JP H03108683 U JPH03108683 U JP H03108683U
Authority
JP
Japan
Prior art keywords
stake case
view
mini
mold
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1783090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1783090U priority Critical patent/JPH03108683U/ja
Publication of JPH03108683U publication Critical patent/JPH03108683U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の第1の実施例の平面図、第2
図はワーク収納状態の平面図、第3図はプロービ
ング時の断面図、第4図は第2の実施例のプロー
ビング時の断面図、第5図は従来の半導体装置用
ステイツクケースの平面図、第6図は従来のミニ
モールドトランジスタの斜視図である。 1…ステイツクケース、2…モールド保持部、
3…リード保持部、4…ミニモールドトランジス
タ、5…モールド、6…リード、7…貫通孔、8
…第1プローブ、9…第2プローブ、10…埋込
電極。
Figure 1 is a plan view of the first embodiment of the present invention;
The figure is a plan view of the workpiece storage state, FIG. 3 is a sectional view during probing, FIG. 4 is a sectional view of the second embodiment during probing, and FIG. 5 is a plan view of a conventional stake case for semiconductor devices. , FIG. 6 is a perspective view of a conventional mini-mold transistor. 1... Stake case, 2... Mold holding part,
3...Lead holding part, 4...Mini mold transistor, 5...Mold, 6...Lead, 7...Through hole, 8
...first probe, 9...second probe, 10...embedded electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ミニモールドトランジスタを収納する半導体装
置用ステイツクケースにおいて、リードが前記ス
テイツクケースと接する位置に貫通孔または埋込
電極を設けたことを特徴とする半導体装置用ステ
イツクケース。
A stake case for a semiconductor device that houses a mini-mold transistor, characterized in that a through hole or a buried electrode is provided at a position where a lead contacts the stake case.
JP1783090U 1990-02-22 1990-02-22 Pending JPH03108683U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1783090U JPH03108683U (en) 1990-02-22 1990-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1783090U JPH03108683U (en) 1990-02-22 1990-02-22

Publications (1)

Publication Number Publication Date
JPH03108683U true JPH03108683U (en) 1991-11-08

Family

ID=31521008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1783090U Pending JPH03108683U (en) 1990-02-22 1990-02-22

Country Status (1)

Country Link
JP (1) JPH03108683U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009185423A (en) * 2008-02-08 2009-08-20 Yasuhiro Fujimoto Collar cover

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009185423A (en) * 2008-02-08 2009-08-20 Yasuhiro Fujimoto Collar cover

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