JPH03104241A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To reduce the dead time from the treatment end to the treatment start to make the lead frame treatment more efficient by providing a first and a second lead frame transferring bases and moving the first and the second lead frame bases independently during the treating operation. CONSTITUTION:A servomotor 33 is normally rotated by a control signal from a control circuit 42, and a second transferring base 30 is moved by one pitch as shown by an arrow 54, and the third section of a lead frame 4 from the forefront thereof reaches a treating part 22 to carry out imprinting treatment. While this operation is repeated, a motor 24 is driven and normally rotated by a control signal from the control circuit 42 to move a first transferring base 20 as shown by an arrow 50 to the position nearly the treating part 22. When the treatment for the last section is completed, the motor 33 is normally rotated by a motor driving circuit 41, and the second transferring base 30 is moved to an ejecting position 31 as shown by an arrow 55, and a lead frame 4A is ejected from the second transferring base 30. Therefore, the dead time from the treatment end for one frame to the next treatment start can be eliminated.

Description

[Detailed Description of the Invention] [Summary] The purpose of this invention is to provide a lead frame mounting position where a lead frame is mounted and a process for processing the lead frame, with the purpose of improving the efficiency of lead frame processing regarding semiconductor manufacturing equipment. a first lead frame transport table capable of moving the bolts between the processing section and the processing section, and a lead frame ejection position located on the opposite side of the processing section from the lead frame mounting position where the lead frame is ejected. a second lead frame that is movable between said first lead frame carrier and that has a hanging configuration in which the lead frame is moved from said first lead frame carrier when facing oppositely to said first lead frame carrier in said processing section; a conveyance table; a first moving means for moving the first lead frame conveyance table; and a second moving means for moving the second lead frame conveyance table.
When the transfer means and the first lead frame conveyance table reach the processing section, the second lead frame conveyance table is moved to the processing section, and then the divided section of the lead frame is transferred to the processing section. The second lead frame carrier is moved one lead frame pitch at a time, and the first lead frame carrier is moved to the lead frame mounting position to mount the lead frame to be processed next. When the processing of all the compartments of the lead frame is completed, the second lead frame conveyance table is moved to the lead frame discharge position, and at this time, the first lead frame conveyance table is moved to the processing section. The above 1st
．． The second moving means consists of a means for moving (ilJIl).

[Industrial application field]

The present invention relates to semiconductor manufacturing equipment.

Semiconductor manufacturing is carried out by sequentially processing each section of the lead frame, and when the processing of one lead frame of seven frames is completed, the next unprocessed lead frame is sent to the processing section.

In order to increase the productivity of semiconductor manufacturing, it is necessary to transport lead frames for 9 hours* with less wasted time.

[Conventional technology]

FIG. 5 shows an example of a conventional semiconductor manufacturing apparatus.

This VIT equipment is equipped with one lead frame transport platform 1,
This is a structure that moves back and forth between a mounting position 2 where a lead frame is mounted and a lead frame processing section 3 where a seal is stamped on each section of the lead frame.

The above apparatus is constructed as shown in FIG.

In FIG. 6, ■~0 correspond to ■~ below.

First, (1) the carrier 1 on which the lead frame is mounted is moved from the lead frame mounting position 2 to the processing position 3 as shown by the arrow 10;

(2) Processing is performed on the leading section 4-1 of the lead frame 4.

■ As shown by the arrow 11, the conveyance table 1 moves by one pitch p of the lead frame 4, and transfers the next section 4-2 to the processing section 3.
to face.

■ Perform processing on the partition section 4-2.

■ Above ■. Repeating the hard work of ■, the final section 4-
Process n.

■ Eject the processed lead frame 4A.

(2) The empty conveyance table 1 is moved to the lead frame mounting position 2 as shown by the arrow 12.

■ Load the next lead frame 4' onto the carrier 1.

(2) The conveyance table 1 moves to the processing section 3 again as shown by the arrow 10.

(2) Processing is performed on the leading section 4'-1 of the lead frame 4'.

(VL Problem to be Solved by the Invention) As can be seen from the above, from the completion of the processing of one lead frame 4 until the processing of the next lead frame 4' starts at the same time, four operations are performed. (2) to (2) were performed, and the time r+ required for this operation was wasted time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor device that enables efficient lead frame processing.

[Means to solve the problem]

The present invention provides a first lead frame transport table that is movable between a lead frame mounting position where a lead frame is mounted and a processing section that processes the lead frame; and a lead frame discharging position, which is located on the opposite side of the lead frame mounting position and where the lead frame is discharged, and when facing the first lead frame transport table in the processing section. a second lead frame carrier configured to allow the lead frame to be moved from the first lead frame carrier; a first moving means for moving the first lead frame carrier; a second moving means for moving the lead frame carrier; when the first lead frame carrier reaches the processing section, the second lead frame carrier is moved to the processing section; The second lead frame carrier is moved one lead frame pitch at a time in order to bring the partitioned portion of the frame to the processing section, and the first lead frame carrier is moved to load the lead frame to be processed next. is moved to the lead frame turret position, and when all the compartments of the lead frame have been processed, the second lead frame conveyor is moved directly to the lead frame discharge position, and at this time, the first lead frame The first frame transport table is moved to the first processing section. This configuration includes means for moving the second moving means.

[Effect]

Two lead frame conveyors, a first and a second, are provided, and the first
Since the lead frame transport stand and the second lead frame transport stand are configured to move independently during processing, processing of the next lead frame cannot be started immediately after the processing of the first lead frame is completed. This makes it possible to reduce wasted time between the completion of processing of one lead frame and the start of processing of the next lead frame.

〔Example〕

In FIGS. 1 and 2, 20 is a first lead frame transport platform, and a guide 23 is used to move between the lead frame mounting position 21 where the lead frame is mounted and the processing section 22 where processing such as stamping is performed. can be moved along.

24 is a pulse motor, and 25 is a lead screw shaft rotated by the pulse motor 24. A pole nut 26 integrated with the first conveyance table 20 is screwed onto the lead screw shaft 25. The first conveyance table 20 is moved by rotating the lead screw shaft 25 by the pulse motor 24 .

30 is a second lead frame conveyance platform, and the processing section 22
and a lead frame ejection position 31 where the lead frame is ejected along a guide 32.

33 is a servo motor, and 34 is a lead screw rotated by this motor 33. A pole nut 34 integrated with the second conveyance table 30 is screwed onto the lead screw shaft 34. The lead screw shaft 34 is rotated by the motor 33, and the second conveyance table 3o is moved.

The second conveyance platform 30 is U-shaped as shown in FIG.
The first conveyance table 20 can be accommodated in the central part (Fig. 3 (
See B).

The first conveyance table 20 fixes the lead frame 4 by vacuum suction, with the side edges 4a and 4b on both sides extending in the longitudinal direction protruding.

When the first conveyance table 20 relatively enters the center portion of the second conveyance table 30, the side edges 4a. 4b and has a hanging structure.

The second conveyance table 30 is provided with a lead frame clamping mechanism (not shown) including a clamp plate 36 for clamping the lead frame.

40 is a motor drive circuit for the pulse motor 24, and 41 is a motor drive circuit for the servo motor 33. 42 is f/
JW circuit, which drives the motor drive circuit 40.41 with υ
I'mL, the first and second transport tables 20.30 are operated as shown in FIG.

Next, the operation of the above-mentioned component device will be explained with reference to FIGS. 3 and 4. Φ˜O in FIG. 4 corresponds to the following lead roto O.

ΦHatsumei is in the state shown in FIG. 3 (A>).

The second conveyance table 30 is located at the discharge position 31, and the first
The transport table 20 is located at a loading position 21.

A lead frame 4 is mounted on a first carrier 20.

■ From t,lltil1 circuit 42! The pulse motor 24 is activated by the motor driving circuit 40 based on the +l1rs signal.
is driven and rotates in the normal direction, the first conveyance table 20 is moved as shown by the arrow 50, and as shown in FIG. reach.

Φ Stamp processing is performed on the section 4-1.

■ When the first conveyance table 20 finishes conveying the lead frame, the motor drive circuit 41 drives the servo motor 33 in the reverse direction based on the υl signal from the $111 circuit 42, and the second conveyance table 30 moves toward the direction indicated by the arrow. It moves to the processing section 22 as shown at 51.

The second conveyance table 30 has the positional relationship shown in FIG. 3(C) with respect to the first conveyance table 20, and the clamp mechanism (not shown) of the second conveyance table 30 operates, Vacuum suction is released for the conveyance table 20, and the lead frame 4 is clamped at both edges 4a and 4b, and moved to the first conveyance table 2.
0 to the second conveyance table 30.

The above-mentioned transfer of the lead frame 4 is performed during the above-mentioned stamping process Φ.

Based on the $111 signal from the OIIIw circuit 42, the servo motor 33 is driven by the motor driving circuit 41 and rotates forward, and the second conveyance table 30 is moved by a distance as shown by the arrow 52, and as shown in FIG. As shown in D), the second section 4 - 2 from the top of the lead frame 4 reaches the processing section 22 .

[F] Stamp processing is performed on the range section 4-2.

Φ At the same time as the above-mentioned heavy thread Φg, the pulse motor 24 is activated by the motor drive circuit 42 based on the signal from the control circuit 42.
is driven and reversed, and the first conveyance table 20 is moved as shown by the arrow 53 and returned to the mounting position 21 as shown in FIG. 3 (D>).

■ The servo motor 33 is driven by the motor drive circuit 41 based on the control signal from the control circuit 42 and rotates in the forward direction.
The second conveyance table 30 is moved by -pitch as shown by the arrow 54, and the lead frame 4 is moved as shown in FIG. 3(E).
The third partition section 4-3 from the beginning reaches the processing section 22.

[F] Stamp processing is performed on the small section 4-3.

Kubo》O above. In the case of @, the lead frame 4' to be processed next is mounted on the first conveyance table 20, as shown in FIG. 3(E).

■ Above ■. 0 is repeated, and as shown in FIG. 3(F), processing is performed on the section 4-o after @.

O Above Φ. While the @XD operation is repeated, II
Based on the υJwJ signal from the Jw circuit 42, the motor 24 is driven by the motor driving circuit 40 and rotates in the normal direction, and the first conveyance table 20 is moved as shown by the arrow 50, as shown in FIG.
As shown in F), it is moved to the immediate vicinity of the processing section 22.

[F] When the processing of praiI to the section 4-, is completed, the motor 33 is driven by the motor drive circuit 41 based on the control signal from the υ1tl@path 42 and rotates in the forward direction.
As shown by the arrow 55, the second conveyance table 30
1, the clamp is released, and the processed lead frame 4A is discharged from the second conveyance table 30 as shown in FIG. 3(G).

○I1. 6. During the operation, the motor 24 is driven by the motor drive circuit 40 based on the signal from the lq control circuit 42 to rotate forward, and the first conveyance table 30 is moved as shown in FIG. 3(G), Head section 4' of lead frame 4'
-, reaches the processing section 22.

(2) Stamp processing is performed on the partition section 4'-1.

1) During the above period O, the motor 33 is driven by the motor drive circuit 41 based on the signal from the control circuit 42 and rotates in reverse, and the second carriage 30 moves in the direction of the arrow 51, and the second As shown in FIG. 3 (H), the process reaches process v522, and as shown in FIG.
The state is the same as in C), and the same operation as above is repeated thereafter.

Therefore, after processing the last section of the lead frame currently being processed and before starting processing of the first section of the next lead frame, wRT z processes the - section in the same lead frame. After that, the time until processing of the next section is started becomes approximately equal to 3, and the wasted time becomes substantially zero.

Note that the lead frame 4.4' may be a molded one or a pre-molded one. In the case of a product before molding, the processing includes die bonding and wire bonding, for example.

〔Effect of the invention〕

As explained above, according to the present invention, when the processing of one lead frame is completed, the next unprocessed lead frame is subsequently conveyed to the processing section, so that the processing of the first lead frame is completed. It is possible to substantially eliminate wasted time between the start of the processing of the next lead and the next lead, and the productivity of semiconductors can be improved.

[Brief explanation of drawings]

Fig. 1 is a diagram showing the principle configuration of the present invention, Fig. 2 is a diagram showing an embodiment of the semiconductor manufacturing apparatus of the invention, Fig. 3 is a diagram showing the operation of the inventive apparatus, and Fig. 4 is similar to Fig. 3. FIG. 5 is a diagram showing a conventional example, and FIG. 6 is a diagram explaining the operation of the conventional example. In the figure, 4.4' is a lead frame, 4-, to 4-n. 4'-t is a partition, 4a. 4b is a side edge, 20 is a first lead frame conveyance platform, 21 is a lead frame mounting position, 22 is a processing section, 23. 32 is a guide, 24 is a pulse motor, 25. 34 is a lead screw shaft, 26. Reference numeral 35 indicates a pole nut, 30&i second lead frame conveyor, 31 a lead frame discharge position, 36 a clamp plate, 40 and 41 a motor drive circuit, and 42 an IjIt1 circuit. *1 Figure 5

Claims (1)

[Scope of Claims] A first lead frame transport stand ( 20), and is movable between the processing section (22) and a lead frame ejection position (31), which is located on the opposite side of the processing section from the lead frame mounting position and where the lead frame is ejected. A second lead frame is configured such that the lead frame can be transferred from the first lead frame carrier when the lead frame faces the first lead frame carrier in the processing section.
a lead frame carrier (30), a first moving means (24, 25, 26, 40) for moving the first lead frame carrier, and a second moving means for moving the second lead frame carrier. transportation means (33,
34, 35, 41), when the first lead frame conveyance table reaches the processing section, the second lead frame conveyance table is moved to the processing section, and then the divided section of the lead frame is moved to the processing section. The second lead frame carrier is moved one lead frame pitch at a time in order to reach the processing section, and the first lead frame carrier is moved to the lead frame mounting position in order to mount the lead frame to be processed next. When processing of all the compartments of the lead frame is completed, the second lead frame conveyor is moved to the lead frame discharge position, and at this time, the second lead frame conveyor is moved to the lead frame discharge position.
A semiconductor manufacturing apparatus comprising: means (42) for controlling the first and second moving means so as to move the lead frame carrier to the processing section.