JPH03104204A - Chip type electronic component - Google Patents
Chip type electronic componentInfo
- Publication number
- JPH03104204A JPH03104204A JP1243736A JP24373689A JPH03104204A JP H03104204 A JPH03104204 A JP H03104204A JP 1243736 A JP1243736 A JP 1243736A JP 24373689 A JP24373689 A JP 24373689A JP H03104204 A JPH03104204 A JP H03104204A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrodes
- paint
- capacitor
- conductive paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003973 paint Substances 0.000 claims abstract description 22
- 239000003990 capacitor Substances 0.000 abstract description 34
- 229910000679 solder Inorganic materials 0.000 abstract description 28
- 238000007747 plating Methods 0.000 abstract description 13
- 239000006071 cream Substances 0.000 abstract description 9
- 239000007769 metal material Substances 0.000 abstract description 8
- 239000004020 conductor Substances 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000011888 foil Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 238000005507 spraying Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器などに用いるチップコンデンサ
に代表されるチップ形電子部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to chip-type electronic components, typified by chip capacitors, used in various electronic devices.
従来の技術
近年、電子機器の業界全般にわたｂ、機器の小型化，軽
量化，高密度実装化が高まシ、電子部品のチップ化，小
型化が激化し進んでいる。その中にあって、プリント配
線板の実装技術についてし、表面実装技術を中心として
変革が起って＞，６、フロ一方式からりフロ一方式に二
極分化の方向をたどシ、さらに高密度実装化は多様化へ
と変遷している。従って、微小化された電極を保有する
チップコンデンサの実装の信頼性向上が重要視されてき
た。BACKGROUND OF THE INVENTION In recent years, throughout the electronic equipment industry, there has been an increase in the miniaturization, weight reduction, and high-density packaging of equipment, and the trend toward chipping and miniaturization of electronic components has been intensifying. Under these circumstances, there has been a revolution in mounting technology for printed wiring boards, centering on surface mount technology. High-density packaging is changing to diversification. Therefore, emphasis has been placed on improving the reliability of mounting chip capacitors having miniaturized electrodes.
以下図面を参照しながら従来のチップコンデンサについ
て説明する。A conventional chip capacitor will be described below with reference to the drawings.
第６図は従来のチップコンデンサの構造を示すものであ
る。第６図に釦いて、５１は金属材料を溶射して電極引
出し部とした電極部、５２は誘電体からなるコンデンサ
素子、６４は電極部の最外層に形或されたはんだメッキ
層である。FIG. 6 shows the structure of a conventional chip capacitor. Referring to FIG. 6, reference numeral 51 denotes an electrode portion formed by spraying a metal material to form an electrode extension portion, 52 a capacitor element made of a dielectric, and 64 a solder plating layer formed on the outermost layer of the electrode portion.
以上のように構或されたチップコンデンサは、図示する
ように、まず誘電体、電極となる金属層もしくは金属箔
を有するコンデンサ素子６２の両端面に金属材料を溶射
して厚み０．１ｆｆ以上の電極引出し部を形或して電極
部６１とし、かつこの電極部６１の最外層にはんだメッ
キ層６４を形或し、チップコンデンサとしたものである
。As shown in the figure, the chip capacitor constructed as described above is manufactured by first spraying a metal material onto both end faces of a capacitor element 62 having a dielectric material, a metal layer or metal foil serving as an electrode, and then forming a capacitor with a thickness of 0.1 ff or more. The electrode lead portion is shaped into an electrode portion 61, and the outermost layer of the electrode portion 61 is formed with a solder plating layer 64 to form a chip capacitor.
発明が解決しようとする課題
しかしながら、上記のような構戒では、微小化された電
極部を保有するため、ディップ方式，フロ一方式そして
リフロ一方式の多様化された高密度実装を行った時、第
６図に示すように電極部６１の最外層に設けられたはん
だメッキ層６４がプリント基板のランド６６に塗布され
たはんだクリームとの接触面積が少ないため、はんだ付
け時に不確実な接触状態となった未融合のはんだ６８の
部分と、融合のはんだ６７の部分が発生し、プリント基
板のランドから電極部６１，コンデンサ素子６２，はん
だメッキ層６４からなるチップコンデンサの片電極が浮
くという不確実な接触状態となる状態が発生するという
問題を有していた。Problems to be Solved by the Invention However, in the above-mentioned structure, in order to have miniaturized electrode parts, when performing diversified high-density mounting using the dip method, flow method, and reflow method. As shown in FIG. 6, the contact area of the solder plating layer 64 provided on the outermost layer of the electrode section 61 with the solder cream applied to the land 66 of the printed circuit board is small, resulting in an uncertain contact state during soldering. A portion of unfused solder 68 and a portion of fused solder 67 are generated, resulting in the problem that one electrode of the chip capacitor consisting of the electrode portion 61, capacitor element 62, and solder plating layer 64 is lifted from the land of the printed circuit board. There is a problem in that a state of reliable contact occurs.
本発明は上記問題に鑑み、実装基板と接する左右両電極
のはんだ付け性を改善し、よυ確実な高密度実装を可能
とするチップ形電子部品を提供することを目的とするも
のである。SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a chip-type electronic component that improves the solderability of both left and right electrodes in contact with a mounting board and enables reliable high-density mounting.
課題を解決するための手段
この目的を達戒するために本発明のチップ形電子部品は
、実装基板と接するすくなくとも左右両電極の下面部分
に導電性ペイントを塗布し、電極の一部分を形或したも
のから構戒されている。Means for Solving the Problems In order to achieve this object, the chip-type electronic component of the present invention is provided by applying conductive paint to at least the lower surface portions of both the left and right electrodes that are in contact with the mounting board, and shaping a portion of the electrodes. It's being shunned by people.
作 用
との構戊によって、電極最外層として導電性ペイントを
塗布したことによシ、導電性ペイントは高密度実装時に
軟化し、ペイント中の導電性材料ははんだメッキ層及び
クリームはんだ中へ拡散し、相互の融合を促進する。従
って、左右の電極部に導電性ペイントを塗布することに
よう濡れ性は左右同条件となう、素子浮きによるオープ
ン、濡れ性低下による半接触状態は改善され、確実に実
装することができる。Due to the structure of the conductive paint applied as the outermost layer of the electrode, the conductive paint softens during high-density mounting, and the conductive material in the paint diffuses into the solder plating layer and cream solder. and promote mutual integration. Therefore, by applying conductive paint to the left and right electrode parts, the wettability is the same on both sides, and the open state due to element floating and the semi-contact state due to decreased wettability are improved, and reliable mounting is possible.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。第１図は本発明の一実施例に釦けるチップコン
デンサの構造を示すものである。EXAMPLE An example of the present invention will be described below with reference to the drawings. FIG. 1 shows the structure of a chip capacitor according to an embodiment of the present invention.
第１図において、１は金属材料を溶射して電極引出し部
とした電極部、２は誘電体からなるコンデンサ素子、３
はＡｇ，Ｃｕ＞よびＡｕの単体もしくは混合された導電
性材料およびバインダーとして２００１：：以下の軟化
点を有するポリエステル樹脂，アクリル樹脂からなる熱
可塑性樹脂の混合物で構或され導電性ペイント、４は電
極部の最外層に形或されたはんだメッキ層である。In Fig. 1, 1 is an electrode part formed by spraying a metal material into an electrode extension part, 2 is a capacitor element made of a dielectric material, and 3 is a capacitor element made of a dielectric material.
2001: Conductive paint consisting of a mixture of thermoplastic resins consisting of polyester resin and acrylic resin having the following softening points, 4 is a conductive material consisting of Ag, Cu> and Au alone or mixed, and a binder. This is a solder plating layer formed on the outermost layer of the electrode section.
以上のように構戒されたチップコンデンサは、図禾する
ように、まず誘電体、電極となる金属層もしくは金属箔
を有するコンデンサ素子２を設け、このコンデンサ素子
の両端面に金属材料を溶射し、厚みＱ．１１ｆｆ以上の
電極引出し部を形戊して電極部電極のすくなくとも下面
部分に導電性ペイント３を塗布し、チップコンデンサと
したものである。The chip capacitor designed as described above is manufactured by first providing a capacitor element 2 having a dielectric material, a metal layer or metal foil that will serve as an electrode, and then spraying a metal material on both end faces of this capacitor element. , thickness Q. A chip capacitor is formed by forming an electrode lead-out portion of 11 ff or more and applying conductive paint 3 to at least the lower surface of the electrode.
以上のように本実施例の高密度実装化が可能となるチッ
プコンデンサについて図面を参照しなが説明する。第２
図は、本発明の一実施例におけるはんだ付けする前のプ
リント基板に実装した状態を示すものである。第２図に
訃いて、２１は金属材料を溶射して電極引出し部を形或
した電極部、２２は誘電体からなるコンテ゜ンサ素子、
２３は導電性ペイント、２４ははんだメッキ層、２５は
プリント基板のランド２６とはんだメッキ層との融合を
可能とするクリームはんだである。図示するようにクリ
ームはんだとコンデンサ電極との間には導電性ペイント
が介在する状態になる。次に第３図は、本発明の一実施
例に釦けるはんだ付け中のはんだ溶融初期状態を示すも
のである。第３図において、３１は金属材料を溶射して
電極引出し部を形成した電極部、３２はコンデンサ素子
、３３ぱ導電性ペイント、３４ははんだメッキ層、３６
はクリームはんだ、３６はプリント基板のランド、３７
は導電性ペイント中の導電性材料がはんだメッキ層およ
びクリームはんだへ拡散する方向である。第３図に示す
ようにバインダーに熱可塑性樹脂を用いておｂ、導電性
ペイントはこの時点で軟化し、ペイント中の導電性材料
はコンデンサ電極のはんだメッキ及びクリームはんだ中
へ拡散し相互の融合を促進する。最後に第４図は、本発
明の一実施例にかけるはんだ付け終了後の状態を示すも
のである。第４図において、４１は金属材料を溶射して
電極引出し部を形或した電極部、４２はコンデンサ素子
、４６はプリント基板のランド、４７は融合したはんだ
である。図に示す様に左右の電極に導電性ペイントを塗
布することによう、濡れ性は左右同条件となり、素子浮
きによるオープン、濡れ低下による半接触状態は改善さ
れ確実なはんだ付けが可能となる。従って、上記のこと
から高密度実装化を可能とするチップコンテ゛ンサが得
られる。ここで、プリント基板への実装前に導電性ペイ
ント３は完全に固化した状態にある。As described above, the chip capacitor according to this embodiment, which enables high-density packaging, will be described with reference to the drawings. Second
The figure shows an embodiment of the present invention mounted on a printed circuit board before soldering. In FIG. 2, 21 is an electrode part formed by spraying a metal material to form an electrode extension part, 22 is a capacitor element made of a dielectric material,
23 is a conductive paint, 24 is a solder plating layer, and 25 is a cream solder that enables the solder plating layer to fuse with the land 26 of the printed circuit board. As shown in the figure, conductive paint is interposed between the cream solder and the capacitor electrode. Next, FIG. 3 shows the initial state of solder melting during button soldering according to an embodiment of the present invention. In FIG. 3, numeral 31 is an electrode part formed by spraying a metal material to form an electrode lead-out part, 32 is a capacitor element, 33 is conductive paint, 34 is a solder plating layer, and 36 is a capacitor element.
is cream solder, 36 is printed circuit board land, 37 is
is the direction in which the conductive material in the conductive paint diffuses into the solder plating layer and cream solder. As shown in Figure 3, when a thermoplastic resin is used as a binder, the conductive paint softens at this point, and the conductive material in the paint diffuses into the solder plating of the capacitor electrode and into the cream solder and fuses with each other. promote. Finally, FIG. 4 shows the state after completion of soldering in one embodiment of the present invention. In FIG. 4, reference numeral 41 indicates an electrode portion formed by spraying a metal material to form an electrode extension portion, 42 is a capacitor element, 46 is a land of a printed circuit board, and 47 is fused solder. As shown in the figure, by applying conductive paint to the left and right electrodes, the wettability becomes the same on both sides, and the open state caused by floating elements and the semi-contact state caused by reduced wetness are improved, allowing reliable soldering. Therefore, from the above, a chip capacitor that enables high-density packaging can be obtained. Here, the conductive paint 3 is in a completely solidified state before being mounted on the printed circuit board.
尚、実施例ではチップコンテ゜ンサについて説明したが
、他にチップ抵抗等でも同様に実施できることは云う１
でもない。In addition, although a chip capacitor was explained in the embodiment, it is also possible to implement the same method with other chip resistors, etc.
not.
発明の効果
以上のように本発明は、実，装基板と接する左右両電極
のすくなくとも下面部分に導電性ペイントを塗布し、電
極の一部分を形或したことにより、よシ確実な高密度実
装が可能となるチップ形電子部品を提供することができ
、その実用的効果は大なるものがある。Effects of the Invention As described above, the present invention enables more reliable high-density mounting by applying conductive paint to at least the lower surfaces of both the left and right electrodes in contact with the mounting board and shaping a portion of the electrodes. It is possible to provide a chip-type electronic component that enables the use of electronic components, which has great practical effects.
第１図は本発明の一実施例におけるチップコンデンサの
断面図、第２図は本発明の一実施例におけるチップコン
デンサのはんだ付けする前のプリント基板に実装した状
態を示す断面図、第３図は本発明の一実施例における高
密度実装中のはんだ溶融初期状態を示す断面図、第４図
は本発明の−実施例における高密度実装完了状態を示す
断面図、第５図は従来のチップコンデンサの断面図、第
６図は従来のチップコンデンサを高密度実装した後の電
極部の浮き状態を示した断面図である。
１ ，２１ ，３１ ，４１ ，５１ ．６１・・・・
・・電極部、２ ，２２ ，３２ ，４２ ，５２ ．
６２・・・・・・コンデンサ素子、３，２３．３３・・
・・・・導電性ペイント、４，２４，３４，５４．６４
・・・・・・はんだメッキ層、２６．３６・・・・・・
クリームはんだ、２６，３６．４６・・・・・・プリン
ト基板のランド、３７，４７．６７・・・・・・融合の
はんだ、６８・・・・・・未融合のはんだ。FIG. 1 is a cross-sectional view of a chip capacitor according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the state in which the chip capacitor according to an embodiment of the present invention is mounted on a printed circuit board before soldering, and FIG. is a cross-sectional view showing the initial state of solder melting during high-density mounting in an embodiment of the present invention, FIG. 4 is a cross-sectional view showing the completed state of high-density mounting in the embodiment of the present invention, and FIG. 5 is a conventional chip. FIG. 6 is a cross-sectional view of a capacitor showing a floating state of an electrode portion after a conventional chip capacitor is mounted at high density. 1 , 21 , 31 , 41 , 51 . 61...
... Electrode part, 2 , 22 , 32 , 42 , 52 .
62...Capacitor element, 3,23.33...
... Conductive paint, 4,24,34,54.64
...Solder plating layer, 26.36...
Cream solder, 26, 36.46... Printed circuit board land, 37, 47.67... Fused solder, 68... Unfused solder.
Claims (1)
に導電性ペイントを塗布し、電極の一部分を形成したこ
とを特徴とするチップ形電子部品。A chip-shaped electronic component characterized in that conductive paint is applied to at least the lower surfaces of both left and right electrodes that contact a mounting board, forming part of the electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1243736A JPH03104204A (en) | 1989-09-19 | 1989-09-19 | Chip type electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1243736A JPH03104204A (en) | 1989-09-19 | 1989-09-19 | Chip type electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104204A true JPH03104204A (en) | 1991-05-01 |
Family
ID=17108226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1243736A Pending JPH03104204A (en) | 1989-09-19 | 1989-09-19 | Chip type electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104204A (en) |
-
1989
- 1989-09-19 JP JP1243736A patent/JPH03104204A/en active Pending
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