JPH03102746U - - Google Patents
Info
- Publication number
- JPH03102746U JPH03102746U JP1185790U JP1185790U JPH03102746U JP H03102746 U JPH03102746 U JP H03102746U JP 1185790 U JP1185790 U JP 1185790U JP 1185790 U JP1185790 U JP 1185790U JP H03102746 U JPH03102746 U JP H03102746U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- main material
- view
- magnetic permeability
- low magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による半導体装置
の部分断面斜視図、第２図は第１図の部分拡大断
面図、第３図は従来の半導体装置の部分断面斜視
図、第４図は第３図の部分拡大断面図である。図
において１ａ，１ｂ……リードフレーム、２……
半導体チツプ、３……導線、４……密封樹脂、５
……リードフレームの主材料、６……主材料５を
覆う透磁率の低い材料を示す。なお、図中、同一
符号は同一、又は相当部分を示す。
FIG. 1 is a partial cross-sectional perspective view of a semiconductor device according to an embodiment of the invention, FIG. 2 is a partial enlarged cross-sectional view of FIG. 1, FIG. 3 is a partial cross-sectional perspective view of a conventional semiconductor device, and FIG. FIG. 4 is a partially enlarged sectional view of FIG. 3; In the figure, 1a, 1b...lead frame, 2...
Semiconductor chip, 3...Conducting wire, 4...Sealing resin, 5
. . . main material of the lead frame, 6 . . . indicates a material with low magnetic permeability covering the main material 5. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
表面を覆つたことを特徴とするリードフレーム。 A lead frame characterized in that the main material of the lead frame is covered with a metal with low magnetic permeability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1185790U JPH03102746U (en) | 1990-02-07 | 1990-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1185790U JPH03102746U (en) | 1990-02-07 | 1990-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102746U true JPH03102746U (en) | 1991-10-25 |
Family
ID=31515372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1185790U Pending JPH03102746U (en) | 1990-02-07 | 1990-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102746U (en) |
-
1990
- 1990-02-07 JP JP1185790U patent/JPH03102746U/ja active Pending