JPH0310228B2 - - Google Patents

Info

Publication number
JPH0310228B2
JPH0310228B2 JP15927883A JP15927883A JPH0310228B2 JP H0310228 B2 JPH0310228 B2 JP H0310228B2 JP 15927883 A JP15927883 A JP 15927883A JP 15927883 A JP15927883 A JP 15927883A JP H0310228 B2 JPH0310228 B2 JP H0310228B2
Authority
JP
Japan
Prior art keywords
wire
bonding
tension
tube body
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15927883A
Other languages
Japanese (ja)
Other versions
JPS6052030A (en
Inventor
Masayoshi Yamaguchi
Nobushi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58159278A priority Critical patent/JPS6052030A/en
Publication of JPS6052030A publication Critical patent/JPS6052030A/en
Publication of JPH0310228B2 publication Critical patent/JPH0310228B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は半導体部品の組立工程に用いられる
ワイヤボンデイング装置の改善に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to improvements in wire bonding equipment used in the assembly process of semiconductor components.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

半導体部品の組立工程においては、ワイヤボン
デイング装置を用いて、ペレツトのパツトとリー
ドフレームのリードとをボンデイングワイヤで接
続するようにしている。
In the process of assembling semiconductor components, a wire bonding device is used to connect the pellet parts and the leads of the lead frame with bonding wires.

従来、この種のワイヤボンデイング装置として
は、第1図で示すように、上方側からワイヤ繰出
部a、テンシヨン機構としての上クランプb、ク
ランパー機構としての下クランパーc、ボンデイ
ングツールdを順に配したものが用いられてい
て、ワイヤ繰出部aから繰り出されるボンデイン
グワイヤeの先端部を上クランパー、下クランパ
ーc、ボンデイングツールdの順に導入してい
る。そして、ボンデイングするにあたつては、下
クランパーcでボンデイングワイヤeをクランプ
した状態、ならびに張力をかけない状態で、ボン
デイングツールdを下クランパーcと共に下降し
てボンデイングワイヤeの先端をペレツトfのパ
ツドへ導出して圧着し、ここでペレツトf側のボ
ンデイングをまず行なう。ついで、下クランパー
cのクランプを解除、さらに上クランパーにてボ
ンデイングワイヤeに張力をかけて、ペレツトf
を搭載したワークステージ(図示しない)を移動
して、今度はワークステージ上のリードフレーム
gのリード(図示しない)をボンデイングツール
dの先端に導き、この位置で張力を与えつつ同様
にボンデイングツールdならびに下クランパーc
の動作にてボンデイングワイヤeを圧着し、その
後そのボンデイングワイヤeを下クランパーcの
クランプならびに上昇によつて引き切れば、ペレ
ツトfおよびリードフレームg間における接続が
ワイヤループを通じて、行なわれるようになつて
いる。しかるに、ボンデイングツールdの上下
動、下クランパーcのクランプ動、上クランパー
による張力にもとづきペレツトfおよびリードフ
レームg間をボンデイングすることができるよう
になつている。
Conventionally, as shown in FIG. 1, this type of wire bonding apparatus has a wire feeding section a, an upper clamp b as a tension mechanism, a lower clamper c as a clamper mechanism, and a bonding tool d arranged in this order from the upper side. The tip of a bonding wire e fed out from a wire feeding part a is introduced into an upper clamper, a lower clamper c, and a bonding tool d in this order. When bonding, the bonding wire e is clamped by the lower clamper c, and with no tension applied, the bonding tool d is lowered together with the lower clamper c to clamp the tip of the bonding wire e onto the pellet f. The pellet is led out to a pad and crimped, and here bonding is first performed on the pellet f side. Next, the lower clamper c is released from the clamp, and the upper clamper applies tension to the bonding wire e to release the pellet f.
The work stage (not shown) on which the lead frame g is mounted is moved, and the lead (not shown) of the lead frame g on the work stage is guided to the tip of the bonding tool d, and while applying tension at this position, the lead of the bonding tool d is moved in the same way. and lower clamper c
If the bonding wire e is crimped by the operation of , and then the bonding wire e is pulled off by the clamping and lifting of the lower clamper c, the connection between the pellet f and the lead frame g is made through the wire loop. ing. However, it is possible to bond between the pellet f and the lead frame g based on the vertical movement of the bonding tool d, the clamping movement of the lower clamper c, and the tension applied by the upper clamper.

ところで、ペレツトfおよびリードフレームg
におけるボンデイングにあたつて、常に良好なワ
イヤループを形成することが品質において重要と
される。このためにはボンデイングワイヤeに対
する張力を常に一定にかけることが必要とされ
る。特にこの張力には1g程度の力が最もよいと
される。
By the way, pellet f and lead frame g
When bonding, it is important for quality to always form a good wire loop. For this purpose, it is necessary to always apply a constant tension to the bonding wire e. In particular, it is said that a force of about 1 g is best for this tension.

しかるに、張力を与える下クランパーcは、従
来からソレノイドを用いてクランプ力をコントロ
ールするようにしているが、このようなソレノイ
ドを使つて常時、1g程度のクランプ力をかけて
一定の張力をボンデイングワイヤeに与えること
は非常に難しいといつた問題があり、張力が不安
定であるといつた点がある。特にボンデイングス
ピードが上がる程、その欠点が一層大きくなるも
のである。このため、ボンデイングにあたつて
は、ループ長が長くなつてワイヤループがたれ下
る、いわゆるアンダループやワイヤループがカー
ルするループカール、逆にループ長が短かくなる
ことを要因に生じるエツジタツチなどのワイヤル
ープの高さのばらつきによる不良を誘発する問題
が多く生じやすく、歩留りが著しく低下してしま
うもので、これらを解決できるものが要望されて
いる。
However, the lower clamper c that applies tension has conventionally used a solenoid to control the clamping force, but such a solenoid is used to constantly apply a clamping force of about 1 g to maintain a constant tension on the bonding wire. There is a problem that it is very difficult to give a tension e, and that the tension is unstable. In particular, the higher the bonding speed, the greater the drawbacks. For this reason, when bonding, it is important to avoid such problems as under-loops and loop curls, where the wire loop hangs down due to the long loop length, and edge-touching, which occurs when the loop length becomes short. There is a need for something that can solve these problems, which tend to cause many defects due to variations in the height of the wire loops, resulting in a significant drop in yield.

〔発明の目的〕[Purpose of the invention]

この発明は上記事情に着目してなされたもの
で、その目的とするところは、安定、かつ良好な
ワイヤループを形成することができるワイヤボン
デイング装置を提供することにある。
The present invention has been made in view of the above circumstances, and its object is to provide a wire bonding device that can form stable and good wire loops.

〔発明の概要〕[Summary of the invention]

すなわち、この発明はテンシヨン機構を、ワイ
ヤを挿通可能に挿通する管体と、この管体に設け
られ当該内腔側周壁面に前記ワイヤの周方向から
上記管体のワイヤ挿入側に向けて気体を吹出し可
能な環状の出口部を形成した気体導入用のガイド
路とを有して構成することにより、ワイヤに吹出
流にて一様に張力を与え、困難とされるワイヤの
張力コントロールを安定して行うとするものであ
る。
That is, the present invention provides a tension mechanism that includes a tube body through which a wire can be inserted, and a tube body provided on the tube body to which gas is applied from the circumferential direction of the wire toward the wire insertion side of the tube body. By having a gas introduction guide path with an annular outlet that can blow out, uniform tension is applied to the wire with the blowout flow, making it possible to stably control the wire tension, which is considered difficult. This will be carried out as follows.

〔発明の実施例〕 以下、この発明を第2図および第3図に示す一
実施例にもとづいて説明する。第2図はワイヤボ
ンデイング装置を示し、図中1はワイヤ繰出部、
2はテンシヨン機構、3はガイド板、4はクラン
パー機構を構成する下クランパー、5は超音波振
動子(図示しない)を配備したボンデイングツー
ルである。そして、これら各機器はボンデイング
ヘツド本体6に対して上方側から順に取付けられ
ている。また下クランパー4ならびにボンデイン
グツール5は図示しない昇降機構を介して取付け
られ、相方共互いに同期して昇降することができ
るようになつている。そして、ワイヤ繰出部1か
ら繰り出される金線、アルミ線などのボンデイン
グワイヤ7の先端部が、テンシヨン機構2、ガイ
ド板3、下クランパー4、ボンデイングツール5
に順次導入されていて、ボンデイングツール5の
上下動、下クランパー4のクランプ動、さらにテ
ンシヨン機構2での張力にもとづき、図示しない
ワークステージに搭載されたペレツト8のパツト
およびリードフレーム9のリード間をボンデイン
グワイヤ7で摩擦熱を利用してボンデイングする
ことができるようになつている。
[Embodiment of the Invention] The present invention will be described below based on an embodiment shown in FIGS. 2 and 3. Figure 2 shows a wire bonding device, in which 1 is a wire feeding section;
2 is a tension mechanism, 3 is a guide plate, 4 is a lower clamper constituting a clamper mechanism, and 5 is a bonding tool equipped with an ultrasonic vibrator (not shown). Each of these devices is attached to the bonding head main body 6 in order from the upper side. The lower clamper 4 and the bonding tool 5 are attached via a lifting mechanism (not shown), so that they can be moved up and down in synchronization with each other. The tip of the bonding wire 7 such as gold wire or aluminum wire fed out from the wire feeding section 1 is connected to the tension mechanism 2, the guide plate 3, the lower clamper 4, and the bonding tool 5.
Based on the vertical movement of the bonding tool 5, the clamping movement of the lower clamper 4, and the tension of the tension mechanism 2, the parts of the pellet 8 mounted on the work stage (not shown) and the leads of the lead frame 9 are can be bonded using the bonding wire 7 using frictional heat.

一方、この発明の要部となるテンシヨン機構2
としてはつぎのようになつている。
On the other hand, the tension mechanism 2 which is the main part of this invention
It is as follows.

すなわち、図中11は管体である。この管体1
1は第3図で詳図するように、ボンデイングワイ
ヤ7の径より大きい内径を有すとともに、外周部
の下段側に入口口体12を設けたたとえばガラス
製の管本体11aから構成される。そして、この
管体11はボンデイングワイヤ10に対し入口口
体12を下位に配した状態で挿通自在に介装され
ている。また管体11の周壁内には、管体11の
周方向に沿う環状の出口部13aが管体11の内
腔に対し、ワイヤ繰出部1側に向つて開口すると
ともに、入口部13bが上記入口口体12に連通
する空気ガイド路13が形成されている。そし
て、入口口体12には風速コントローラ14を介
してフアン等の空気供給源15が連結されてい
て、空気供給源15から風速コントローラ14、
入口口体12、空気ガイド路13、管体11の内
腔を通じてボンデイングワイヤ7の周囲へ空気
(気体)を環状に吹き出すことができるようにな
つている。しかるに、ボンデイングワイヤ7の周
囲において、ワイヤ繰出部1側へ向つて導入され
る空気の流れににてボンデイングワイヤ7に一様
な張力を与えることができるようになつている。
すなわち、空気ガイド路13、風速コントローラ
14、空気供給源15にて空気導入手段を構成し
ていて、風速コントローラ14ならびに空気供給
源15での風速、風量のコントロールにより安定
した1g程度の張力を与えることができるように
なつている。なお、管体11の両端は、吹き出さ
れる空気にてボンデイングワイヤ7が不用意にに
きずつくことがないよう周囲に曲げて曲面部を形
成している。
That is, 11 in the figure is a tube body. This tube 1
As shown in detail in FIG. 3, the tube body 1 is made of, for example, a glass tube body 11a having an inner diameter larger than the diameter of the bonding wire 7 and having an inlet port 12 on the lower side of the outer periphery. This tubular body 11 is inserted into the bonding wire 10 so that it can be freely inserted into the bonding wire 10, with the inlet mouth body 12 disposed below the bonding wire 10. Further, within the circumferential wall of the tube body 11, an annular outlet portion 13a extending in the circumferential direction of the tube body 11 opens toward the wire feeding portion 1 side with respect to the inner cavity of the tube body 11, and an inlet portion 13b opens toward the wire feeding portion 1 side. An air guide path 13 communicating with the inlet port body 12 is formed. An air supply source 15 such as a fan is connected to the inlet port body 12 via a wind speed controller 14 .
Air (gas) can be blown out in an annular manner around the bonding wire 7 through the inlet port body 12, the air guide path 13, and the inner cavity of the tube body 11. However, around the bonding wire 7, a uniform tension can be applied to the bonding wire 7 by the flow of air introduced toward the wire feeding portion 1 side.
That is, the air guide path 13, the wind speed controller 14, and the air supply source 15 constitute an air introduction means, and the wind speed controller 14 and the air supply source 15 control the wind speed and air volume to provide a stable tension of about 1 g. It is now possible to do so. Note that both ends of the tubular body 11 are bent to form curved surfaces so that the bonding wire 7 is not inadvertently damaged by the blown air.

つぎにこのように構成されたワイヤボンデイン
グ装置の作用について説明する。
Next, the operation of the wire bonding apparatus configured as described above will be explained.

下クランパー4でボンデイングワイヤ7をクラ
ンプした状態、ならびに張力をかけない状態で、
ボンデイングツール5を下クランパー4と共に下
降してボンデイングワイヤ7の先端をペレツト8
のパツトへ導出して圧着する。これにより、ボン
デイングツール5側の超音波振動による摩擦熱で
ボンデイングワイヤ7がペレツト8に接合され
る。ついで、下クランパー4のクランプを解除、
さらにテンシヨン機構2にてボンデイングワイヤ
7に張力をかける。ここで、張力は、あらかじめ
風速、風量が設定された風速コントローラ14、
空気供給源15を機能させることにより行なわれ
る。すなわち、クランプ解除と同時に空気供給源
15から風速コントローラ14を通じ、まず入口
口体12から空気ガイド路13内へ吹き出され
る。ついで、風は、空気ガイド路13の入口部1
3bから管体11の内腔へボンデイングワイヤ1
0の周囲にワイヤ繰出部1に向つてその大部分が
吹き出される。このとき、ボンデイングワイヤ7
に一様な張力が与えられる。なお、管体11のボ
ンデイングツール5側の開口からも微風が吹き出
され、静電気によるボンデイングワイヤ7の管体
11に対する付着を防止している。
When the bonding wire 7 is clamped by the lower clamper 4 and when no tension is applied,
The bonding tool 5 is lowered together with the lower clamper 4 to crush the tip of the bonding wire 7 into a pellet 8.
Lead it out to the part and crimp it. As a result, the bonding wire 7 is bonded to the pellet 8 by the frictional heat generated by the ultrasonic vibration on the bonding tool 5 side. Next, release the clamp of lower clamper 4,
Further, the tension mechanism 2 applies tension to the bonding wire 7. Here, the tension is determined by the wind speed controller 14 in which the wind speed and air volume are set in advance.
This is done by activating the air supply source 15. That is, at the same time as the clamp is released, the air is first blown from the air supply source 15 through the air speed controller 14 and into the air guide path 13 from the inlet port body 12. Then, the wind flows through the entrance section 1 of the air guide path 13.
Bonding wire 1 from 3b to the inner cavity of tube body 11
Most of the wire is blown out toward the wire feeding section 1 around the wire 0. At this time, bonding wire 7
A uniform tension is applied to the Note that a breeze is also blown out from the opening of the tube 11 on the bonding tool 5 side to prevent the bonding wire 7 from adhering to the tube 11 due to static electricity.

しかるのち、図示しないワークステージを移動
して、今度はリードフレーム9のリードをボンデ
イングツール5の先端に導き、この位置で張力を
与えつつ同様にボンデイングツール5ならびに下
クランパー4の下降動作にてボンデイングワイヤ
7を圧着すれば、超音波振動による摩擦熱にてボ
ンデイングワイヤ7がリードフレーム9に接合さ
れる。そして、その後、張力を解除して下クラン
パー4、ボンデイングツール5を上昇させてボン
デイングワイヤ7を引き切ることにより、ペレツ
ト8およびリードフレーム9間における接続が行
なわれる。
After that, the work stage (not shown) is moved, and the lead of the lead frame 9 is guided to the tip of the bonding tool 5, and while tension is applied at this position, the bonding is performed by lowering the bonding tool 5 and the lower clamper 4 in the same manner. When the wire 7 is crimped, the bonding wire 7 is bonded to the lead frame 9 by frictional heat caused by ultrasonic vibration. Thereafter, the tension is released, the lower clamper 4 and the bonding tool 5 are raised, and the bonding wire 7 is cut off, thereby establishing a connection between the pellet 8 and the lead frame 9.

かくして、ボンデイングワイヤ7の張力コント
ロールは、不安定な要素となるボンデイングワイ
ヤ7に対する接触が全くない空気の流れにてボン
デイングワイヤ7に一様な張力を与えることか
ら、ばらつきなく行なわれることになり、常に安
定した張力を与えることができるのである。
In this way, the tension of the bonding wire 7 can be controlled without variation because a uniform tension is applied to the bonding wire 7 by the air flow without any contact with the bonding wire 7, which would be an unstable element. It is possible to always provide stable tension.

したがつて、ペレツト8およびリードフレーム
9間に形成されるワイヤループ高さは、アンダル
ープ、ループカール、エツジタツチなどが発生し
ない、安定した高さを得ることができるもので、
安定、かつ良好なワイプループを形成することが
でき、品質に優れた組立を約束することができ
る。特に、ボンデイングスピードが上がるものに
有効である。しかも、空気の流れが主体なので、
精密性は要求されず、コストの点においても優れ
る利点をもつ。そのうえ、ボンデイングワイヤ7
の周囲に環状に空気が吹き出されるので、静電気
によつてボンデイングワイヤ7が管体11に付着
ならびに擦れるのを防ぎ、同付着による張力の影
響、さらには擦れによつてボンデイングワイヤ7
が切れるのを防ぐことができる。
Therefore, the height of the wire loop formed between the pellet 8 and the lead frame 9 can be a stable height that does not cause under-loops, loop curls, edge-touching, etc.
It is possible to form a stable and good wipe loop, and it is possible to guarantee an assembly with excellent quality. It is particularly effective for increasing bonding speed. Moreover, since air flow is the main
Precision is not required, and it has the advantage of being superior in terms of cost. Moreover, bonding wire 7
Since air is blown out in an annular shape around the tube body 11, the bonding wire 7 is prevented from adhering to and rubbing against the tube body 11 due to static electricity, and the bonding wire 7 is prevented from being affected by the tension caused by the adhesion and further due to the friction.
can be prevented from breaking.

〔発明の効果〕〔Effect of the invention〕

以上説明したようにこの発明によれば、ボンデ
イングワイヤに直接ワイヤに影響を与えることな
く、吹出流でばらつきのない一様な張力を与える
ことができるようになり、常に安定した張力を与
えることができるようになる。
As explained above, according to the present invention, it is possible to apply uniform tension to the bonding wire through the blowout flow without directly affecting the wire, and it is possible to always apply stable tension. become able to.

したがつて、困難とされるボンデイングワイヤ
の張力コントロールを安定して行なうことがで
き、安定、かつ良好なワイヤループを常に形成す
ることができる。特に、ボンデイングスピードが
上がるものについて有効である。しかも、気体の
流れが主体なので精密性は要求されず、コストの
点においても優れる利点をもつ。そのうえ、ボン
デイングワイヤの周囲に吹き出される環状の吹出
流により、静電気によつて同ワイヤが管体に付着
ならびに擦れるのを防止して、付着による張力の
影響、さらには擦れによつてワイヤが切れるのを
防ぐことができる。
Therefore, it is possible to stably control the tension of the bonding wire, which is difficult, and to form a stable and good wire loop at all times. It is particularly effective for increasing bonding speed. Moreover, since the main component is gas flow, precision is not required, and it has the advantage of being superior in terms of cost. Furthermore, the annular air flow blown out around the bonding wire prevents the wire from adhering to and rubbing against the pipe body due to static electricity, and prevents the wire from being cut due to the effects of tension due to adhesion and furthermore due to friction. can be prevented.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のワイヤボンデイング装置を示す
概略構成図、第2図および第3図はこの発明の一
実施例を示し、第2図はワイヤボンデイング装置
を示す概略構成図、第3図は管体を示す断面図で
ある。 1……ワイヤ繰出部、2……テンシヨン機構、
4……下クランパー(クランパー機構)、7……
ボンデイングワイヤ、8……ペレツト、9……リ
ードフレーム、11……管体、13,14,15
……空気ガイド路、風速コントローラ、空気供給
源(空気導入手段)。
FIG. 1 is a schematic configuration diagram showing a conventional wire bonding device, FIGS. 2 and 3 show an embodiment of the present invention, FIG. 2 is a schematic configuration diagram showing a wire bonding device, and FIG. 3 is a tube diagram. It is a sectional view showing a body. 1... Wire feeding section, 2... Tension mechanism,
4... lower clamper (clamper mechanism), 7...
Bonding wire, 8... Pellet, 9... Lead frame, 11... Tube, 13, 14, 15
...Air guide path, wind speed controller, air supply source (air introduction means).

Claims (1)

【特許請求の範囲】[Claims] 1 ワイヤに張力を与えるテンシヨン機構を有
し、ペレツトのパツトとリードフレームのリード
とをワイヤで接続するワイヤボンデイング装置に
おいて、上記テンシヨン機構は、上記ワイヤを挿
通可能に挿通する管体と、上記管体に設けられ当
該内腔側周壁面に前記ワイヤの周方向から上記管
体のワイヤ挿入側に向けて気体を吹出し可能な環
状の出口部を形成した気体導入用のガイド路とを
有してなることを特徴とするワイヤボンデイング
装置。
1. A wire bonding device that has a tension mechanism that applies tension to a wire and connects a part of a pellet and a lead of a lead frame with a wire, and the tension mechanism has a tube body through which the wire can be inserted, and a tube body that allows the wire to be inserted therethrough. a guide path for introducing gas, which is provided in the body and has an annular outlet portion formed on the peripheral wall surface on the lumen side of the body and capable of blowing out gas from the circumferential direction of the wire toward the wire insertion side of the tube body; A wire bonding device characterized by:
JP58159278A 1983-08-31 1983-08-31 Wire bonding device Granted JPS6052030A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58159278A JPS6052030A (en) 1983-08-31 1983-08-31 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159278A JPS6052030A (en) 1983-08-31 1983-08-31 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS6052030A JPS6052030A (en) 1985-03-23
JPH0310228B2 true JPH0310228B2 (en) 1991-02-13

Family

ID=15690290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159278A Granted JPS6052030A (en) 1983-08-31 1983-08-31 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS6052030A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04214644A (en) * 1990-12-12 1992-08-05 Nec Kyushu Ltd Wire bonding device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694757A (en) * 1979-12-28 1981-07-31 Tokyo Sokuhan Kk Wire bonding device
JPS5890284A (en) * 1981-11-25 1983-05-28 神鋼電機株式会社 Vending machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694757A (en) * 1979-12-28 1981-07-31 Tokyo Sokuhan Kk Wire bonding device
JPS5890284A (en) * 1981-11-25 1983-05-28 神鋼電機株式会社 Vending machine

Also Published As

Publication number Publication date
JPS6052030A (en) 1985-03-23

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