JPH0298154A - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- JPH0298154A JPH0298154A JP25109088A JP25109088A JPH0298154A JP H0298154 A JPH0298154 A JP H0298154A JP 25109088 A JP25109088 A JP 25109088A JP 25109088 A JP25109088 A JP 25109088A JP H0298154 A JPH0298154 A JP H0298154A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- adhesive
- carrier tape
- base material
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 claims abstract description 38
- 239000000853 adhesive Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 13
- 229920001721 polyimide Polymers 0.000 claims abstract description 10
- 239000004642 Polyimide Substances 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims abstract 2
- 230000009477 glass transition Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 239000010949 copper Substances 0.000 abstract description 12
- 239000011810 insulating material Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 7
- 239000012050 conventional carrier Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000008642 heat stress Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000010062 adhesion mechanism Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この珀明は銅箔パターンを表面に有するポリイミド等可
′＠性絶縁フィルムの、いわゆるキャリアテープに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a so-called carrier tape made of a flexible insulating film such as polyimide having a copper foil pattern on its surface.
集積回路素子（半導体素子）の電極接合技術として、従
来から多く用いられているワイヤポンディング法に代っ
てキャリアテープを用い次、いわゆる’ｌ’ Ａ Ｂ
（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）法
が採用されようとしている。このＴＡＢ法を第４図（ａ
） 、 （ｂ）を用いて簡単に説明する。As an electrode bonding technology for integrated circuit elements (semiconductor elements), carrier tape is used instead of the wire bonding method, which has been widely used in the past.
(Tape Automated Bonding) method is about to be adopted. This TAB method is shown in Figure 4 (a
), (b) will be briefly explained.
図において、（１）はキャリアテープの基材となるテー
プで、ポリイミド等の可撓性を有する絶縁材料によシ長
尺フィルム状に形成されている。このテープ（１）には
以下に示すような穴が形成されている。（２）はテープ
（１）の幅方向中央部に穿設され、後述する半導体素子
（３）が設置される部位に相当するセンタデバイス孔、
（４）はテープ（１）の幅方向側縁部分に所定間隔をお
いて穿設式れ、テープ（１）と半導体素子（３）との接
合時に粗い位置決めを行うためのスプロケットホール、
（５）はセンタデバイス孔（２）の周囲を取シ囲むよう
に穿設され後述するアクタ−リードボンディング時にお
いて使用される複数のアウターリード孔で、このアウタ
ーリード孔（５）はセンタデバイス孔（２）の四隅部に
該当する部分に形成芒れでいる架橋部（６）を介して連
設されている。In the figure, (1) is a tape serving as the base material of the carrier tape, which is formed into a long film shape from a flexible insulating material such as polyimide. This tape (1) has holes as shown below. (2) is a center device hole that is bored in the center of the tape (1) in the width direction and corresponds to a portion where a semiconductor element (3) to be described later is installed;
(4) is a sprocket hole which is formed at a predetermined interval on the side edge portion of the tape (1) in the width direction, and is used for rough positioning when bonding the tape (1) and the semiconductor element (3);
(5) is a plurality of outer lead holes that are bored so as to surround the center device hole (2) and are used during actor-lead bonding, which will be described later. It is connected to the four corner portions of (2) via bridging portions (6) formed by forming awns.
（７）はテープ（１）表面の所定箇所に形成された絹等
の導電性材料から在る複数本のリードで、前記センタデ
バイス孔（２）内に内方端が臨むインナーリード（７ａ
）とアウターリード孔（５）を介して外方に延設芒れた
アウターリード（７ｂ）とから構成式ｔ″Ｌる。また（
・ｉｃ）はインナーリード（”７ａ）と半導体素子（３
）との接続不良、半導体崇子の不良等を、インナーリー
ドボンディング後に論べるためのテストパッド部、（８
）１リード（７）のリードサポート部である。なお、図
中（３ａ）ｉ４半導体素子（３）とインナーリード（’
７ａ）の間に存在する突起電極（バンプ）で、通常半導
体素子（３）の表面に形成さね、ている。(7) is a plurality of leads made of a conductive material such as silk formed at a predetermined location on the surface of the tape (1), and an inner lead (7a) whose inner end faces into the center device hole (2).
) and an outer lead (7b) extending outward through the outer lead hole (5).
・ic) is an inner lead ("7a) and a semiconductor element (3)
), the test pad section (8
) 1 lead (7) lead support part. In addition, in the figure (3a) the i4 semiconductor element (3) and the inner lead ('
A protruding electrode (bump) existing between 7a) and usually formed on the surface of the semiconductor element (3).
以上述べたＴＡＢ法で用いられるテープの材料構成を第
５図に示す。第５図は通常３層テープと呼ばれている断
面図で、図において、（９）はテープ基材で、例えばポ
リイミドフィルム、曲はテープ基材（９）に鋼箔の層を
接着するための接着剤、０υは接着剤ｃＩりでテープ基
材（９）に接着されている銅箔層である。銅箔層０υの
接着剤（１０に接する面は接着強度を向上させるために
表面が粗らされている場合が多い。従って、断着剤Ｑ１
の層も表向が銅箔層０υに相当するように粗らされる。FIG. 5 shows the material composition of the tape used in the TAB method described above. Figure 5 is a cross-sectional view of what is usually called a three-layer tape. In the figure, (9) is the tape base material, for example, a polyimide film, and the curve is for adhering a layer of steel foil to the tape base material (9). 0υ is the copper foil layer adhered to the tape substrate (9) with adhesive cI. The surface in contact with the copper foil layer 0υ adhesive (10 is often roughened to improve adhesive strength. Therefore, the adhesive Q1
The surface of the layer is also roughened to correspond to the copper foil layer 0υ.
第５図（ａ）のように、テープ基材（９）上に接着剤Ｑ
Ｑで鋼箔層０υを接着したテープを、光リングラフイー
法とエツチング等でリード（７）のパターンを形成する
。リード（７）パターンを形成した後のテープの一部断
面は第５図（ｂ）のようになる。あるテープでは第５図
（ｂ）のテープ上に、ツルダレジス） Ｃ１３をコーテ
ィングし、リード間での絶縁性を向上きせている場合も
ある。第６図にこのソルダーレジスト０３ヲコーテイン
グしたテープの一部断面図を示も第７図には通常２層テ
ープと呼ばれているテープの断面図を示す。２層テープ
は第７図（ａ）に示すようにテープ基材（９）上に、直
接銅の暦を設けたもので、テープ基材（９）の表面にス
パッタ蒸着法等により銅の層を設け、次にめっき法等に
より銅の層（６）を成侵させて導体層としたものである
。このようにして作製８れたテープを光リソグラフィー
法。As shown in FIG. 5(a), apply adhesive Q on the tape base material (9).
A pattern of leads (7) is formed on the tape to which the steel foil layer 0υ is adhered using optical phosphorography and etching. A partial cross section of the tape after forming the lead (7) pattern is shown in FIG. 5(b). In some cases, the tape shown in FIG. 5(b) is coated with Tsurudaregis (C13) to improve the insulation between the leads. FIG. 6 shows a partial cross-sectional view of a tape coated with this solder resist 03, and FIG. 7 shows a cross-sectional view of a tape commonly called a two-layer tape. As shown in Fig. 7(a), the two-layer tape has a copper calendar formed directly on the tape base material (9), and a copper layer is formed on the surface of the tape base material (9) by sputter deposition or the like. A copper layer (6) is then formed by plating or the like to form a conductor layer. The tape thus produced was subjected to optical lithography.
エツチング法等でリード０■のパターンを形成する。A lead 0 pattern is formed using an etching method or the like.
リードα２を形成した後のテープの一部断面は第１図（
ｂ）のように々る。A partial cross section of the tape after forming lead α2 is shown in Figure 1 (
b).
以上のようにして作成されたキャリアテープを封止樹脂
を用いて封止するＩＣが最近増加しつつある。Recently, the number of ICs in which the carrier tape produced as described above is sealed using a sealing resin has been increasing.
従来のキャリアテープは以上のように構成されていたの
で、例えば第８図に示すような方法でポリイミドをテー
プ基材としたサンプルの基材と封止樹脂の接着強度を測
定すると、接着強度は１００数１０ｋｇ７ｃｍ２程度し
かなく、また、必ずポリイミドと封止樹脂の界面で剥れ
てしまう。一方、通常の工ＣではＩＣの封止樹脂とリー
ド間の接着強度はＩＣの信頼性に大きな影響を与え、従
ってキャリアテープを使用した工Ｃにおいても可能な限
多接清強度を向上させ、パッケージ作成時の熱ストレス
等で接着力の弱い部分にすき間ができる等を防ぐ必要が
あった。Conventional carrier tapes were constructed as described above, so when the adhesive strength of a sample made of polyimide as a tape base material and the sealing resin was measured using the method shown in Figure 8, the adhesive strength was found to be It weighs only about 100 kg and 7 cm2, and it always peels off at the interface between the polyimide and the sealing resin. On the other hand, in conventional process C, the adhesive strength between the IC sealing resin and the leads has a great effect on the reliability of the IC, so even in process C using carrier tape, the adhesive strength is improved as much as possible. It was necessary to prevent gaps from forming in areas with weak adhesive strength due to heat stress and other factors during package creation.
この発明は上記のような問題を解消するためになされた
もので、ポリイミド基材と餉止樹脂との接着強度を向上
させるとともに樹脂封止した際に信頼性の高い工Ｃを得
ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to improve the adhesive strength between the polyimide base material and the sealing resin, and to obtain a highly reliable process C when sealed with the resin. shall be.
この発明に係るキャリアテープはキャリアテープ上のテ
ープ基材と封止樹脂とが接着する部分よシ広い部分、特
に、従来、片面にしかリード（７）のパターンが設けら
れていないテープでは、テープ基材が現われていた部分
にも、テープ基材及び封止樹脂との接着性の良い材料、
例えば従来から銅箔をテープ基材に接着する際に用いら
れていた接着剤などをコーティングしたものである。The carrier tape according to the present invention can be applied to a wider part of the carrier tape than the part where the tape base material and the sealing resin are bonded, especially in a tape where the pattern of leads (7) is conventionally provided only on one side. A material with good adhesion to the tape base material and sealing resin is also applied to the area where the base material was exposed.
For example, it is coated with an adhesive that has traditionally been used to bond copper foil to a tape base material.
この発明におけるテープ基材上に設けた封止樹脂と接着
性の良い材料、例えば従来から銅箔をテープ基材に接着
する際に用いられていた接着剤は封止樹脂との接着性を
向上し、製造時の熱ストレスに起因するテープ基材と封
止樹脂の剥離等を無くシ、パッケージの耐湿性を向上さ
せる。In this invention, materials that have good adhesion to the sealing resin provided on the tape base material, such as the adhesive conventionally used to bond copper foil to the tape base material, improve the adhesiveness with the sealing resin. This eliminates peeling of the tape base material and sealing resin due to heat stress during manufacturing, and improves the moisture resistance of the package.
以下、この発明の一実施例を図について説明する。第１
図において、符号（１）からＱＩは前記従来のものと同
一につき説明は省略する。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, QI from reference numeral (1) are the same as those of the prior art, and therefore their explanation will be omitted.
次に動作について説明する。第１図（、）はこの発明の
一実施例であるテープ材のうち、前記従来の第５図（ｂ
）に示したようなテープ材にこの発明を適用したもので
、第５図（ｂ）に示したテープ材の銅パターンα時を配
置していない側に接着剤ａ０を塗布したものである。ま
た、第１図（ｂ）はこの発明の一実施例であるテープ材
のうち、前記従来の第６図に示したテープ材にこの発明
を適用したもので、同じく第６図に示した銅パターン（
ロ）を配置していない側に接着剤（１１０を塗布したも
のである。Next, the operation will be explained. FIG. 1(,) shows the tape material according to an embodiment of the present invention, and FIG. 5(b) shows the conventional tape material.
This invention is applied to the tape material shown in FIG. 5(b), in which adhesive a0 is applied to the side of the tape material shown in FIG. 5(b) where the copper pattern α is not placed. FIG. 1(b) shows a tape material according to an embodiment of the present invention, in which the present invention is applied to the conventional tape material shown in FIG. pattern(
Adhesive (110) is applied to the side where B) is not placed.
上記のようなテープ材の接着強度、特に銅パターンαυ
を配置していない側の強度は非常に強くなる０
例えば、第２図に示すような試験片を用いて接着強度を
測定すると、従来のテープ材の場合、先に述べたように
１００数１０ｋｇ／ａｍ Ｌかなかったポリイミドテ
ープ基材と封止樹脂間の接着強度が、３〜４倍にも強く
なｔ） ４００ｋｇ／ａｍ 以上にもなる。Adhesive strength of tape material as above, especially copper pattern αυ
For example, when measuring the adhesive strength using a test piece like the one shown in Figure 2, in the case of conventional tape material, the strength on the side where no tape is placed is very strong. /am L The adhesive strength between the polyimide tape base material and the sealing resin is 3 to 4 times stronger, and reaches more than 400 kg/am.
なお、上記実施例では通常３層テープと呼ばれているキ
ャリアテープの銅パターンを配置していない面に新たに
接着剤層を設けた場合を示したが、この発明は通常２層
テープと呼ばれているテープにも実施ができる。この２
層テープにこの発明を実施した例を第３図に示す。この
発明を２層テープに実施する場合、接着剤のＮ１図は銅
パターン（財）を配置している側にも設けた方が良い。In addition, although the above example shows the case where a new adhesive layer is provided on the side where the copper pattern is not placed on the carrier tape, which is usually called a three-layer tape, this invention applies to a carrier tape, which is usually called a two-layer tape. It can also be applied to tapes that are This 2
An example in which the invention is applied to a layered tape is shown in FIG. When applying this invention to a two-layer tape, it is better to provide the N1 diagram of the adhesive on the side where the copper pattern is also placed.
また、この発明に用いる接着剤のガラス転移温度がキャ
リアテープを低圧トランスファー法によシ封止する際の
封止金型の温度や液状樹脂のキュアー温度よシ低い場合
、接着剤と封止樹脂は接着のメカニズムの１つである自
Ｎ（分子どうしの混ざシ合い効果）が起こシ得る。従っ
て、接着力の一層の強化が望まれる。In addition, if the glass transition temperature of the adhesive used in this invention is lower than the temperature of the sealing mold or the curing temperature of the liquid resin when sealing the carrier tape by the low-pressure transfer method, the adhesive and the sealing resin This can occur due to self-N (mixture effect of molecules), which is one of the adhesion mechanisms. Therefore, further strengthening of the adhesive strength is desired.
以上のようにこの発明によれば、キャリアテープの基材
で封止樹脂との接着力の弱い材質に封止樹脂との接着強
度の強い物質、例えば接着剤を塗布し九ので、キャリア
テープと封止樹脂の接着強度が向上し、パッケージ内の
すき間をなくすことができ、また、不純物等の少ない耐
湿性の良い接着剤を用いることによシその信頼性も向上
する。As described above, according to the present invention, a material having strong adhesive strength with the sealing resin, such as an adhesive, is applied to the base material of the carrier tape, which has a weak adhesive strength with the sealing resin. The adhesive strength of the sealing resin is improved, making it possible to eliminate gaps within the package, and by using an adhesive with low impurities and good moisture resistance, its reliability is also improved.
第１図（ａ）はこの発明の一実施例を示すキャリアテー
プの部分断面図、第１図（ｂ）はこの発明の他の一実施
例を示すキャリアテープの部分断面図、第２図はキャリ
アテープの接着強度を測定する際のサンプルの模式図、
第３図はこの発明の他の実施例金示すテープの部分断面
図である。第４図はキャリアテープを説明する図で、第
４図（ａ）は平面図、第４図（ｂ）は正面断面図、第５
図は従来のキャリアテープ、特に従来３層テープと呼ば
れて込たテープの断面図で、第５図（ａ）は銅パターン
を形成する前の断面図、第５図（ｂ）は銅パターンを形
成した後のテープの断面図、第６図は従来のキャリアテ
ープのうち、ソルダレジストをコーティングしたテープ
の断面図、第９図は従来のキャリアテープのうち、従来
２層テープと呼ばれていたテープの断面図で、第７図（
、）は銅パターンを形成する前の断面図、第７図ら）は
銅パターンを形成した後のテープの断面図、第８図は従
来のキャリアテープの接着強度を測定する際のサンプル
の模式図である。
図中、（１）はテープ、（２）はセンタデバイス孔、（
３）は半導体素子、（３＆）はバンプ、（４）はスズロ
ケットホール、（５）はアウタリード孔、（６）は架橋
部、（７）はリード、（７ａ）はインナリード、（７ｂ
）はアウタリード、（’／ａ）はテストパッド、（８）
はリードサポート、（９）はテープ基材、（１０は接着
剤、αηは銅箔、（６）は銅めっき層、（１３はソルダ
ーレジスト、α→は構造接着剤、０υは接着強度測定用
治具、αＧは封止樹脂である。
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1(a) is a partial cross-sectional view of a carrier tape showing one embodiment of the present invention, FIG. 1(b) is a partial cross-sectional view of a carrier tape showing another embodiment of the present invention, and FIG. Schematic diagram of sample when measuring adhesive strength of carrier tape,
FIG. 3 is a partial sectional view of a tape showing another embodiment of the present invention. Figure 4 is a diagram explaining the carrier tape, where Figure 4 (a) is a plan view, Figure 4 (b) is a front sectional view, and Figure 5
The figure shows a cross-sectional view of a conventional carrier tape, particularly a conventional three-layer tape, in which FIG. 5(a) is a cross-sectional view before forming a copper pattern, and FIG. Figure 6 is a cross-sectional view of a tape coated with solder resist among conventional carrier tapes, and Figure 9 is a cross-sectional view of a conventional carrier tape coated with solder resist. Figure 7 (
,) are cross-sectional views of the tape before forming the copper pattern, Figures 7 and 7) are cross-sectional views of the tape after forming the copper patterns, and Figure 8 is a schematic diagram of a sample used to measure the adhesive strength of conventional carrier tapes. It is. In the figure, (1) is the tape, (2) is the center device hole, (
3) is a semiconductor element, (3&) is a bump, (4) is a tin rocket hole, (5) is an outer lead hole, (6) is a bridge, (7) is a lead, (7a) is an inner lead, (7b)
) is outer lead, ('/a) is test pad, (8)
is the lead support, (9) is the tape base material, (10 is the adhesive, αη is the copper foil, (6) is the copper plating layer, (13 is the solder resist, α→ is the structural adhesive, and 0υ is for measuring adhesive strength. The jig and αG are sealing resins. In the figures, the same reference numerals indicate the same or equivalent parts.
Claims (2)
ャリアテープにおいて、片面に銅箔等でパターンを設け
ている反対側の面で、従来、キャリアテープの基材であ
るポリイミド等の材質の面であつた部分の一部に基材と
接着性の良い物質、例えば接着剤を塗布したことを特徴
とするキャリアテープ。(1) In carrier tapes used in IC assemblies using the TAB method, one side is patterned with copper foil, etc., and the other side is made of polyimide or other material that is the base material of the carrier tape. A carrier tape characterized by coating a part of the hot part with a substance that has good adhesion to the base material, such as an adhesive.
ープを用いて低圧トランスファー法により樹脂封止する
際の封止金型の温度や液状樹脂のキユアー温度より低い
ことを特徴とする 請求項１記載のキャリアテープ。(2) Claim 1 characterized in that the glass transition temperature of the adhesive is lower than the temperature of the sealing mold or the curing temperature of the liquid resin when resin sealing is performed using the carrier tape by a low-pressure transfer method. Carrier tape as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25109088A JPH0298154A (en) | 1988-10-04 | 1988-10-04 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25109088A JPH0298154A (en) | 1988-10-04 | 1988-10-04 | Carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298154A true JPH0298154A (en) | 1990-04-10 |
Family
ID=17217491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25109088A Pending JPH0298154A (en) | 1988-10-04 | 1988-10-04 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298154A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955444A (en) * | 1995-08-11 | 1997-02-25 | Hitachi Chem Co Ltd | Semiconductor package |
| US7223639B2 (en) | 2002-03-25 | 2007-05-29 | Infineon Technologies Ag | Method of producing an electronic component and a panel with a plurality of electronic components |
| JP2008115592A (en) * | 2006-11-02 | 2008-05-22 | Total Kankyo:Kk | Sheet material and scaffolding covering method |
-
1988
- 1988-10-04 JP JP25109088A patent/JPH0298154A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955444A (en) * | 1995-08-11 | 1997-02-25 | Hitachi Chem Co Ltd | Semiconductor package |
| US7223639B2 (en) | 2002-03-25 | 2007-05-29 | Infineon Technologies Ag | Method of producing an electronic component and a panel with a plurality of electronic components |
| JP2008115592A (en) * | 2006-11-02 | 2008-05-22 | Total Kankyo:Kk | Sheet material and scaffolding covering method |
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