KR100196290B1 - Tab carrier with molding dam and tab package using it - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a tab carrier having a sealing dam and a tab package using the tab dam, Since the protective layer is formed in a wavy pattern along the lead, it is impossible to maintain a constant thickness and distribution when the liquid resin is applied or cured after coating.

That is, according to the present invention, a separate sealing dam is formed to have a predetermined height on the upper surface of the protective layer by using a mechanism such as a potting needle as a material such as a protective layer or a liquid resin, thereby preventing the liquid resin from overflowing out of the protective layer It is possible to control the distribution of the sealing region evenly with a constant thickness, thereby improving the reliability of the sealing process.

Description

(TAB) carrier having a sealing dam and a tab package using the same

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a TAB (Tab) carrier having a sealing dam and a tab package using the same, and more particularly, And a tab package using the tab carrier.

BACKGROUND ART TAB (Tape Automated Bonding) is a type of electrical connection between a semiconductor chip and a printed circuit board (PCB), and is comparable to conventional wire bonding. That is, the wire bonding is a method in which the chip electrode pads and the leads of the lead frame are individually connected to each other by metal wires via a lead frame, whereas the tabs are formed by patterning leads Patterned carriers can be used to gang bond the chip electrode pads and leads.

Such a TAB method is particularly notable for use in the field of liquid crystal displays (LCDs) that require light weight and shortening, and is widely used in a notebook computer, a clock, and a meter equipped with a liquid crystal display (LCD) It is applied to various products.

Hereinafter, a general TAB method will be described with reference to the drawings.

1 is a perspective view showing a state in which a tab carrier and a semiconductor chip according to the prior art are internal lead-bonded.

2 is a sectional view taken along the line 2-2 in Fig.

Referring to FIGS. 1 and 2, a conventional TAB carrier 10 will be described in which a pair of leads 12 are patterned on a TAB tape 11 A first opening 13a is formed at the center of the tap tape 11 in order to realize electrical connection between the leads 12 and the semiconductor chip 20. [ Four or two second openings 13b are formed around the first openings 13a and the leads 12 extend to extend into the first openings 13a across the second openings 13b. The portion of the lead 12 that extends to the inner region of the first opening 13a and is electrically connected to the semiconductor chip 20 is called an'inner lead 'in the second opening 13b region, A portion of the lead 12 connected to the outer lead is referred to as an outer lead.

A plurality of sprocket holes are formed on both side surfaces of the tab carrier 10 so that the tap carrier 10 can be automatically supplied in a reel shape. The tap tape 11 is typically of the plastic resin type such as polyimide and the lead 12 patterned on the tap tape 11 is a kind of copper alloy such as a conventional lead frame. As described above, the tab carrier 10 having the structure in which the leads 12 are patterned is electrically connected to the semiconductor chip 20 through the first opening 13a. A plurality of chip electrode pads 21 are formed and arranged on the upper surface of the semiconductor chip 20, and bumps 22 are formed on the chip electrode pads 21. The semiconductor chip 20 is positioned under the lead 12, that is, the inner lead extending and formed inside the first opening 13a, the lead 12 and the bump 21 are aligned with each other, They are simultaneously connected in the same manner. This is called Inner Lead Bonding (ILB).

Then, in a similar manner, the outer lead portion of the lead 12 is physically and electrically connected and connected to the external substrate (not shown) through the second opening portion 13b. This is called Outer Lead Bonding (OLB). Fig. 1 shows a shape before internal lead connection is completed and external lead connection is made.

An encapsulation process is performed between the inner lead connection and the outer lead connection process in order to protect the electrical connection portion between the semiconductor chip 20 and the tab carrier 10 from the external environment. The encapsulation is performed by applying a liquid encapsulating resin. Such sealing process is becoming more important because it has a close relationship with the reliability of determining the lifetime of a semiconductor device. Therefore, uniformity in the thickness and distribution of the applied liquid resin is required in the sealing process of the tap package, and defects such as voids or run-off should be prevented in the resin. In FIG. 1, reference numeral 30 denotes an area sealed after the internal lead connecting process.

Hereinafter, the structure of the inner lead portion of the conventional tap carrier and the relationship of the sealing process will be described in more detail with reference to the drawings.

3 is a fragmentary plan view detailing an inner lead portion of a tab carrier according to a prior art embodiment;

4 is a cross-sectional view taken along line 4-4 of Fig.

Referring to FIGS. 3 and 4, the lid 12 is patterned on the tap tape 11 as described above. The portion shown in the figure is an inner lead portion, which is connected to the semiconductor chip (20 in Fig. 1) and then sealed. A thin copper layer 12a (copper foil) is bonded to the tap tape 11 by the adhesive layer 14, and on the opposite side of the copper layer 12a, A protective layer 15 is formed. A plating layer 12b is formed on the upper and lower surfaces of the copper layer 12a in the region of the first opening 13a.

The copper layer 12a is a transmission path of an electric signal and the plating layer 12b is formed so as to be easily connected to a metal bump (22 in Fig. 2) formed on a chip electrode pad (21 in Fig. 2). The material of the plating layer 12b may be gold (Au), tin (Sn), or an alloy of tin / lead (Sn / Pb). The copper layer 12a on which the plating layer 12b is formed has been referred to as a 'lead 12' in the front, and will be referred to as "copper layer 12a" for the sake of convenience. The protective layer 15 serves to prevent the liquid resin from escaping from the sealing region during the sealing step and to protect the tap tape and the lead surface. Such a protective layer 15 is a kind of solder resist, and thermosetting epoxy or ultraviolet cured acrylic is a typical example thereof.

However, since the protective layer 15 formed for the purpose of controlling the sealing resin is formed like a waving pattern along the lead 12 by the capillary phenomenon as shown in FIG. 3, There is a problem that it is difficult to keep the thickness of the sealing resin constant when the coated liquid resin is cured. As described above, the uniformity of the thickness and the distribution of the liquid resin is one of the important factors in the sealing process. Thus, the reliability of the sealing process is problematic due to the unevenness of the protective layer.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a tap carrier capable of preventing the overflow of the liquid resin during the sealing process of the tab package and controlling the distribution of the sealing area evenly with a constant thickness, and a tab package using the tab carrier.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a state in which a tab carrier and a semiconductor chip are internally lead-bonded according to a conventional technology. FIG.

2 is a sectional view taken along the line 2-2 in Fig.

Figure 3 is a fragmentary plan view detailing an inner lead portion of a tab carrier according to a prior art embodiment;

4 is a sectional view taken along line 4-4 of Fig.

5 is a fragmentary plan view detailing an inner lead portion of a tab carrier according to an embodiment of the present invention;

6 is a sectional view taken along the line 6-6 of Fig.

DESCRIPTION OF THE REFERENCE NUMERALS

10, 40: TAB CARRIER, 11: TAB TAPE,

12: Lead 12a: Copper layer

12b: Plating layer 13a, 13b: Window (window)

14: adhesive layer 15: protective layer

16: sealing dam 20: semiconductor chip

21: chip electrode pad 22: bump

According to an aspect of the present invention, there is provided a tape cassette comprising: a tap tape having an opening formed at a central portion thereof; A plurality of leads adhered on the tap tapes and extending to the inside of the openings; And a protective layer formed on the tap tape and a part of the upper portion of the lead, wherein a sealing dam is formed on a part of the upper surface of the protective layer.

According to another aspect of the present invention, there is provided a semiconductor device comprising: a semiconductor chip having a plurality of chip electrode pads; A plurality of leads formed on the tab tapes and extending to the inside of the openings; and a protective layer formed on a part of the tab tapes and the upper portions of the leads, Tab carrier; A metal bump which is an electrical connection means between the chip electrode pad and the lead; And an encapsulation region formed on the inner side of the protection layer to protect an electrical connection portion between the semiconductor chip and the chip electrode pad and the lead from the outside, And a sealing dam is formed in the TAB package.

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

5 is a fragmentary plan view showing in detail the inner lead portion of a tab carrier according to an embodiment of the present invention.

6 is a sectional view taken along the line 6-6 in Fig.

5 and 6, the structure of the tab carrier 40 according to the present invention is largely the same as the structure of the above-described conventional tab carrier (10 in FIGS. 3 and 4) The structure of the protective layer 15 which serves to protect the tab tape 11 and the surface of the lead 12 is different. That is, since the conventional protective layer 15 does not properly perform the predetermined role of controlling the liquid resin or determining the sealing region because its inner boundary is formed like a wavy pattern along the lead 12, as described above, In the present invention, a separate encapsulation dam 16 is formed on the upper surface of the protective layer 15.

The sealing dam 16 may be made of the same material as the protective layer 15 or a material such as liquid resin. The forming method is formed to have a constant height on the upper surface of the protective layer 15 by using a mechanism such as a potting needle. Therefore, the sealing dam 16 prevents the liquid resin from overflowing out of the protective layer 15 and gives easiness and stability of the sealing process.

As described above, according to the structure of the present invention, it is possible to prevent the overflow of the liquid resin during the sealing process of the tab package and to control the sealing area to be evenly distributed with a constant thickness. There is an advantage to be improved.

Claims (5)

A tap tape having an opening formed at a central portion thereof; A plurality of leads adhered on the tap tapes and extending to the inside of the openings; A protective layer formed on the tap tape and a part of the upper portion of the lead; Wherein the tab carrier comprises: And a sealing dam is formed on a part of the upper surface of the protective layer. The TAB carrier according to claim 1, wherein the sealing dam is made of an epoxy resin. The TAB carrier of claim 1, wherein the lead comprises a thin copper layer, and the lead formed in the opening includes a plating layer. A semiconductor chip having a plurality of chip electrode pads; A plurality of leads formed on the tab tapes and extending to the inside of the openings; and a protective layer formed on a part of the tab tapes and the upper portions of the leads, Tab carrier; A metal bump which is an electrical connection means between the chip electrode pad and the lead; An encapsulation region formed on the inner side of the protection layer to protect an electrical connection portion between the semiconductor chip and the chip electrode pad and the lead from the outside; (TAB) package, And a sealing dam is formed on a part of the upper surface of the protective layer. The TAB package according to claim 4, wherein the sealing dam is made of an epoxy resin.