JPH0295246U - - Google Patents
Info
- Publication number
- JPH0295246U JPH0295246U JP305589U JP305589U JPH0295246U JP H0295246 U JPH0295246 U JP H0295246U JP 305589 U JP305589 U JP 305589U JP 305589 U JP305589 U JP 305589U JP H0295246 U JPH0295246 U JP H0295246U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor chip
- insulating container
- semiconductor
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP305589U JPH0295246U (US07655688-20100202-C00086.png) | 1989-01-13 | 1989-01-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP305589U JPH0295246U (US07655688-20100202-C00086.png) | 1989-01-13 | 1989-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0295246U true JPH0295246U (US07655688-20100202-C00086.png) | 1990-07-30 |
Family
ID=31204353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP305589U Pending JPH0295246U (US07655688-20100202-C00086.png) | 1989-01-13 | 1989-01-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0295246U (US07655688-20100202-C00086.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998049726A1 (fr) * | 1997-04-30 | 1998-11-05 | Hitachi Chemical Company, Ltd. | Plaquette pour monter un element a semi-conducteur, procede permettant de la produire et dispositif a semi-conducteur |
US6617193B1 (en) | 1997-04-30 | 2003-09-09 | Hitachi Chemical Company, Ltd. | Semiconductor device, semiconductor device substrate, and methods of fabricating the same |
JP2017059757A (ja) * | 2015-09-18 | 2017-03-23 | 日本電気株式会社 | 半導体装置および半導体装置の製造方法 |
-
1989
- 1989-01-13 JP JP305589U patent/JPH0295246U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998049726A1 (fr) * | 1997-04-30 | 1998-11-05 | Hitachi Chemical Company, Ltd. | Plaquette pour monter un element a semi-conducteur, procede permettant de la produire et dispositif a semi-conducteur |
US6268648B1 (en) | 1997-04-30 | 2001-07-31 | Hitachi Chemical Co., Ltd. | Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
US6617193B1 (en) | 1997-04-30 | 2003-09-09 | Hitachi Chemical Company, Ltd. | Semiconductor device, semiconductor device substrate, and methods of fabricating the same |
CN100370602C (zh) * | 1997-04-30 | 2008-02-20 | 日立化成工业株式会社 | 半导体元件装配用基板及其制造方法和半导体器件 |
JP2017059757A (ja) * | 2015-09-18 | 2017-03-23 | 日本電気株式会社 | 半導体装置および半導体装置の製造方法 |