JPH029487Y2 - - Google Patents
Info
- Publication number
- JPH029487Y2 JPH029487Y2 JP19169883U JP19169883U JPH029487Y2 JP H029487 Y2 JPH029487 Y2 JP H029487Y2 JP 19169883 U JP19169883 U JP 19169883U JP 19169883 U JP19169883 U JP 19169883U JP H029487 Y2 JPH029487 Y2 JP H029487Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- contact
- conductive film
- recess
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000000630 rising effect Effects 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 17
- 229910052742 iron Inorganic materials 0.000 description 6
- 230000007257 malfunction Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Relay Circuits (AREA)
- Electromagnets (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19169883U JPS6098245U (ja) | 1983-12-12 | 1983-12-12 | 電磁継電器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19169883U JPS6098245U (ja) | 1983-12-12 | 1983-12-12 | 電磁継電器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6098245U JPS6098245U (ja) | 1985-07-04 |
| JPH029487Y2 true JPH029487Y2 (cs) | 1990-03-08 |
Family
ID=30412737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19169883U Granted JPS6098245U (ja) | 1983-12-12 | 1983-12-12 | 電磁継電器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6098245U (cs) |
-
1983
- 1983-12-12 JP JP19169883U patent/JPS6098245U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6098245U (ja) | 1985-07-04 |
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