JPH0294441A - Apparatus for forming solder bump - Google Patents
Apparatus for forming solder bumpInfo
- Publication number
- JPH0294441A JPH0294441A JP24407888A JP24407888A JPH0294441A JP H0294441 A JPH0294441 A JP H0294441A JP 24407888 A JP24407888 A JP 24407888A JP 24407888 A JP24407888 A JP 24407888A JP H0294441 A JPH0294441 A JP H0294441A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tool head
- bump
- semiconductor element
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造方法において、バンプ電極を
形成する装置及びバンプ形成用ツールヘッドに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for forming bump electrodes and a tool head for forming bumps in a method of manufacturing a semiconductor device.
従来、ＴＡＢ実装に用いられる半導体装置の導出端子部
分（ＡＩパッド）には、特開昭６１−２２５８３９号「
バンプ電極の形成方法」及び特開昭６１−２８９６５０
号［半導体装置の半田バンプ形成方法］等の公報に記載
のようにめつぎ法あるいはスパッタ法等により、Ａ！パ
ッド上に導電性金属を被着しその上にバンプを形成して
いる。Conventionally, the lead-out terminal portion (AI pad) of a semiconductor device used for TAB mounting is
"Method for Forming Bump Electrodes" and JP-A-61-289650
As described in publications such as No. 2003 [Method of forming solder bumps for semiconductor devices], A! A conductive metal is deposited on the pad, and a bump is formed on it.
（発明が解決しようとする課題）
上記従来技術は、現在では一般的な半導体菰首製造にお
いて、はぼ完成品といってよい前工程終了後、あらたに
めっき法あるいはスパッタ法を用いて、半導体基板上に
設けられたアルミパッド電極の上に導電性金属を被着し
たのら、余分な被着金属を写真食刻法で除去し、しかる
後に直接半田に浸漬したり、半田めっきでバンプを形成
している。このため、複雑で厄介なめつき工程おるいは
スバツタ工程が増え、コストが高くなる問題がある。(Problems to be Solved by the Invention) The above-mentioned conventional technology is a technique that is used to manufacture a semiconductor head, which is common at present. After a conductive metal is deposited on the aluminum pad electrode provided on the substrate, the excess deposited metal is removed by photolithography, and then bumps are removed by dipping it directly into solder or by solder plating. is forming. For this reason, there is a problem in that the number of complicated and troublesome plating processes or sputtering processes increases, resulting in higher costs.
本発明の目的は、これらの問題点を解消さけ、半田バン
プを廉価に形成する装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve these problems and provide an apparatus for forming solder bumps at low cost.
上記目的は、吸引装置で半導体素子表面のへ１パツド電
極上には／νだを供給し、次いで、該ツールヘッドに超
音波を印加させながら加熱して、はんだを溶融されるこ
とにより達成される。The above object is achieved by supplying /v onto the pad electrode on the surface of the semiconductor element using a suction device, and then heating the tool head while applying ultrasonic waves to melt the solder. Ru.
本発明は直接、Ａ１パッド電極の上に、所定量のはんだ
を吸引装置で供給した後、超音波振動子に超音波を印加
しつつ、はんだを加熱溶融させ、Ａはんだ接合を行わせ
、バンプを形成するものである。そうすれば、複雑なめ
っき工程、写真食刻工程あるいはスバツタ工程が必要な
く、バンプ形成工程か簡略され、低コストＴＡＢが可能
となる。In the present invention, a predetermined amount of solder is directly supplied onto the A1 pad electrode using a suction device, and then the solder is heated and melted while applying ultrasonic waves to an ultrasonic vibrator to perform A solder bonding. It forms the This eliminates the need for a complicated plating process, photolithography process, or sputtering process, simplifies the bump formation process, and enables low-cost TAB.
以下本発明を図面を用いて説明する。第１図は本発明に
よるはんだバンプ形成装置を説明する実施例の説明図で
あり、第２図は実施例の補足説明図である。第１図にお
いて、１は供給用はんだ８を吸引する先端部に焼結ダイ
ヤモンドがロウ付けされた吸引部２と供給はんた８を溶
融させるためのヒータ４と溶融したはんだ８に超音波を
印加させるための超音波振動子３が一体化された、バン
プ形成用ツールヘッドである。半導体素子１０は、各軸
用ステージ１４上に供給用はんだ８を貯留しておるはん
だ貯留箱９と並行して設置されている。The present invention will be explained below using the drawings. FIG. 1 is an explanatory diagram of an embodiment of the solder bump forming apparatus according to the present invention, and FIG. 2 is a supplementary explanatory diagram of the embodiment. In FIG. 1, reference numeral 1 denotes a suction unit 2 whose tip is brazed with sintered diamond to suck supply solder 8, a heater 4 for melting supply solder 8, and an ultrasonic wave applied to the molten solder 8. This is a bump forming tool head in which an ultrasonic vibrator 3 for applying voltage is integrated. The semiconductor element 10 is installed in parallel with a solder storage box 9 storing supply solder 8 on the stage 14 for each axis.
ステージ１４は、Ｙ軸駆動用エアシリンダ１５及びステ
ージ１２と、Ｘ軸駆動用エアシリンダ１６及びステート
Ｂとで駆動ができる。このように構成されたバンプ形成
用ツールヘッド及びＸ、Ｙ、７１４１ステージを用いて
、まず、ステージ１４の上に、半導体素子１０をエアチ
ャックで移動設置する。そしてエアシリンダ１７を駆動
させ、供給用はんだ貯留箱９にバンプ形成用ツールヘッ
ド１を接近させ、脹ら装置５を稼動させ、ツールヘッド
先端にはんだを吸引させる。その後、吸引されたはんだ
か、半導体素子表面のＡ１電極部１９と対向するように
、Ｘ、Ｙｌｌｌのステージ１２．１３を駆動移動させる
。この状態でざらにステージ１４をエアシリンダ１７で
駆動し、所定のＡ１電極部１９にツールヘッド１に吸引
されているはんだを接着させ後、吸引部２の先端部に用
けられている加熱用ヒータ４に加熱装置７から電流を印
加し、はんだ８を溶融させるとともに超音波振動子３に
超音波発生装置６から超音波電力を所定時間印加する。The stage 14 can be driven by the Y-axis drive air cylinder 15 and the stage 12, and the X-axis drive air cylinder 16 and state B. Using the thus configured bump forming tool head and the X, Y, 7141 stage, the semiconductor element 10 is first moved and placed on the stage 14 using an air chuck. Then, the air cylinder 17 is driven to bring the bump forming tool head 1 close to the supply solder storage box 9, and the swelling device 5 is operated to suck the solder to the tip of the tool head. Thereafter, the X and Yll stages 12 and 13 are driven and moved so as to face the sucked solder and the A1 electrode portion 19 on the surface of the semiconductor element. In this state, the stage 14 is roughly driven by the air cylinder 17, and after adhering the solder sucked by the tool head 1 to the predetermined A1 electrode part 19, A current is applied from the heating device 7 to the heater 4 to melt the solder 8, and at the same time, ultrasonic power is applied from the ultrasonic generator 6 to the ultrasonic vibrator 3 for a predetermined period of time.
これにより、溶融はんだ中にキャビテーションが発生し
、すみやかにはんだとＡ１電極との接合か行われ第２図
に示すようにＡ１電（本部にはんだバンプが形成される
。As a result, cavitation occurs in the molten solder, and the solder is quickly joined to the A1 electrode, forming a solder bump at the A1 electrode (headquarters) as shown in FIG.
以上述べた如く、本発明によれば、半導体素子表面のＡ
Ｉ電極部にバンプ形成用の特別な金属をめっきあるいは
スパッタ法を用いて作る必要かなく、バンプ形成が簡単
にでき、ＴＡＢ用半導体素子のコス］・低減がはかられ
る。これにより低コストＴＡＢが可能になる。As described above, according to the present invention, A
There is no need to use a special metal plating or sputtering method for forming bumps on the I electrode portion, and bumps can be easily formed, thereby reducing the cost of semiconductor elements for TAB. This allows for low cost TAB.
第１図は本発明の一実施例のはんだバンプ形成装置の構
成図、第２図は本装置の効果を説明する補足説明図であ
る。
・・・超音波（辰勤子、４・・・加熱用ヒータ、５・・
・吸引装置、６・・・超音波発生装置、７・・・ヒータ
電源、８・・・供給はんだ、９・・・供給用はんだ貯留
箱、１０・・・半導体素子、１２．１３．１４・・・ス
テージ、１５．１６．１７・・・ステージ駆動用エアシ
リンダ装置、１９・・・Ａ１電）へ部、２０・・・保護
膜、２１・・・はんだバンプ。
１・・・バンプ形成用ツールヘッド、２・・・吸引部、
３図面の浄書（内容に変更なしン
第 １ 図
第２
閉
手
続
補
正
書
（方式）
％式％
半田バンプの形成装置
補正をする者
１１件との関係FIG. 1 is a block diagram of a solder bump forming apparatus according to an embodiment of the present invention, and FIG. 2 is a supplementary explanatory diagram illustrating the effects of this apparatus. ...Ultrasonic wave (Tatsuko, 4...Heating heater, 5...
- Suction device, 6... Ultrasonic generator, 7... Heater power source, 8... Supply solder, 9... Supply solder storage box, 10... Semiconductor element, 12.13.14. ... Stage, 15.16.17 ... Air cylinder device for driving stage, 19 ... A1 electric) part, 20 ... Protective film, 21 ... Solder bump. 1... tool head for bump formation, 2... suction part,
3. Engraving of drawings (no changes in content) Figure 1 Figure 2 Closed Procedure Amendment (Method) % Formula % Relationship with 11 cases of persons correcting solder bump forming equipment
Claims (1)
おいて、供給用はんだを吸引する吸引手段とはんだを溶
解するための加熱手段とはんだに超音波を印加するため
の超音波振動子とを一体化したバンプ形成用のツールヘ
ッドと、前記ツールヘッドに半導体素子を接触させるた
めのＸ、Ｙ、Ｚ軸駆動手段とで装置を構成し、はんだに
超音波を印加させながら溶融させ、Ａｌパッドに直接は
んだバンプを形成することを特徴とするはんだパンプの
形成装置。1. In an apparatus for forming connection bumps on the surface of a semiconductor element, a suction means for sucking supplied solder, a heating means for melting the solder, and an ultrasonic vibrator for applying ultrasonic waves to the solder are integrated. The device consists of a tool head for forming bumps, and X, Y, and Z axis drive means for bringing the semiconductor element into contact with the tool head, and the solder is melted while applying ultrasonic waves to the Al pad. A solder pump forming device that directly forms solder bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24407888A JPH0294441A (en) | 1988-09-30 | 1988-09-30 | Apparatus for forming solder bump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24407888A JPH0294441A (en) | 1988-09-30 | 1988-09-30 | Apparatus for forming solder bump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0294441A true JPH0294441A (en) | 1990-04-05 |
Family
ID=17113410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24407888A Pending JPH0294441A (en) | 1988-09-30 | 1988-09-30 | Apparatus for forming solder bump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0294441A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0697721A3 (en) * | 1994-08-10 | 1996-07-10 | Ibm | Selective addition of a solder ball to an array of solder balls |
-
1988
- 1988-09-30 JP JP24407888A patent/JPH0294441A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0697721A3 (en) * | 1994-08-10 | 1996-07-10 | Ibm | Selective addition of a solder ball to an array of solder balls |
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