JPH0292955U - - Google Patents
Info
- Publication number
- JPH0292955U JPH0292955U JP1989001018U JP101889U JPH0292955U JP H0292955 U JPH0292955 U JP H0292955U JP 1989001018 U JP1989001018 U JP 1989001018U JP 101889 U JP101889 U JP 101889U JP H0292955 U JPH0292955 U JP H0292955U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- led chip
- reflector
- display element
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001018U JPH0525257Y2 (https=) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001018U JPH0525257Y2 (https=) | 1989-01-09 | 1989-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0292955U true JPH0292955U (https=) | 1990-07-24 |
| JPH0525257Y2 JPH0525257Y2 (https=) | 1993-06-25 |
Family
ID=31200539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001018U Expired - Lifetime JPH0525257Y2 (https=) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525257Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101662A (ja) * | 2004-12-24 | 2005-04-14 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
| JP2005101661A (ja) * | 2004-12-24 | 2005-04-14 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
-
1989
- 1989-01-09 JP JP1989001018U patent/JPH0525257Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101662A (ja) * | 2004-12-24 | 2005-04-14 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
| JP2005101661A (ja) * | 2004-12-24 | 2005-04-14 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525257Y2 (https=) | 1993-06-25 |