JP2005101661A - 発光ダイオードランプ - Google Patents
発光ダイオードランプ Download PDFInfo
- Publication number
- JP2005101661A JP2005101661A JP2004373134A JP2004373134A JP2005101661A JP 2005101661 A JP2005101661 A JP 2005101661A JP 2004373134 A JP2004373134 A JP 2004373134A JP 2004373134 A JP2004373134 A JP 2004373134A JP 2005101661 A JP2005101661 A JP 2005101661A
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- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- light
- lead
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】 載置部と反射部からなるカップ状部分を有する第1のリードと、前記反射部の外側に位置する第2のリードと、一方の面に陽極と陰極の両方の電極を有して前記載置部に載置される発光ダイオードとを備える発光ダイオードランプにおいて、表面に電極パターンを有する絶縁台の上に前記発光ダイオードをその両電極が下を向く様にして配置し、前記絶縁台を前記載置部に配置し、前記発光ダイオードの各電極と前記各リード間は、前記絶縁台上の導電パターンと金属細線を介して接続されていることを特徴とする。
【選択図】 図3
Description
本発明の発光ダイオードランプは、請求項3に記載の様に、前記絶縁台上の導電パターンに前記発光ダイオードの載置場所を認識するための切欠きを形成していることを特徴とする。
5、34、59 絶縁台
6、7、35、36 導電パターン
11、40、59 青色発光ダイオード
18、48 黄色発光ダイオード
32 透光性樹脂
Claims (3)
- 載置部と反射部からなるカップ状部分を有する第1のリードと、前記反射部の外側に位置する第2のリードと、一方の面に陽極と陰極の両方の電極を有して前記載置部に載置される発光ダイオードとを備える発光ダイオードランプにおいて、表面に電極パターンを有する絶縁台の上に前記発光ダイオードをその両電極が下を向く様にして配置し、前記絶縁台を前記載置部に配置し、前記発光ダイオードの各電極と前記各リード間は、前記絶縁台上の導電パターンと金属細線を介して接続されていることを特徴とする発光ダイオードランプ。
- 前記発光ダイオードと前記絶縁台を平面視したときに、前記絶縁台上の導電パターンが前記発光ダイオードの周囲を囲むことを特徴とする請求項1記載の発光ダイオードランプ。
- 前記絶縁台上の導電パターンに前記発光ダイオードの載置場所を認識するための切欠きを形成していることを特徴とする請求項1あるいは2記載の発光ダイオードランプ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373134A JP3754445B2 (ja) | 2004-12-24 | 2004-12-24 | 発光ダイオードランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373134A JP3754445B2 (ja) | 2004-12-24 | 2004-12-24 | 発光ダイオードランプ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP06188393A Division JP3649748B2 (ja) | 1993-03-22 | 1993-03-22 | 発光ダイオードランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005101661A true JP2005101661A (ja) | 2005-04-14 |
JP3754445B2 JP3754445B2 (ja) | 2006-03-15 |
Family
ID=34464578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004373134A Expired - Fee Related JP3754445B2 (ja) | 2004-12-24 | 2004-12-24 | 発光ダイオードランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3754445B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61224470A (ja) * | 1985-03-29 | 1986-10-06 | Toshiba Corp | 半導体発光装置 |
JPH01137655A (ja) * | 1987-11-25 | 1989-05-30 | Hitachi Ltd | 光デバイス |
JPH01268074A (ja) * | 1988-04-20 | 1989-10-25 | Hitachi Ltd | 光電子装置 |
JPH0292955U (ja) * | 1989-01-09 | 1990-07-24 |
-
2004
- 2004-12-24 JP JP2004373134A patent/JP3754445B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61224470A (ja) * | 1985-03-29 | 1986-10-06 | Toshiba Corp | 半導体発光装置 |
JPH01137655A (ja) * | 1987-11-25 | 1989-05-30 | Hitachi Ltd | 光デバイス |
JPH01268074A (ja) * | 1988-04-20 | 1989-10-25 | Hitachi Ltd | 光電子装置 |
JPH0292955U (ja) * | 1989-01-09 | 1990-07-24 |
Also Published As
Publication number | Publication date |
---|---|
JP3754445B2 (ja) | 2006-03-15 |
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