JPH0292954U - - Google Patents

Info

Publication number
JPH0292954U
JPH0292954U JP1989001017U JP101789U JPH0292954U JP H0292954 U JPH0292954 U JP H0292954U JP 1989001017 U JP1989001017 U JP 1989001017U JP 101789 U JP101789 U JP 101789U JP H0292954 U JPH0292954 U JP H0292954U
Authority
JP
Japan
Prior art keywords
reflector
led
lead frame
integrated
display element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989001017U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525256Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989001017U priority Critical patent/JPH0525256Y2/ja
Publication of JPH0292954U publication Critical patent/JPH0292954U/ja
Application granted granted Critical
Publication of JPH0525256Y2 publication Critical patent/JPH0525256Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1989001017U 1989-01-09 1989-01-09 Expired - Lifetime JPH0525256Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989001017U JPH0525256Y2 (https=) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989001017U JPH0525256Y2 (https=) 1989-01-09 1989-01-09

Publications (2)

Publication Number Publication Date
JPH0292954U true JPH0292954U (https=) 1990-07-24
JPH0525256Y2 JPH0525256Y2 (https=) 1993-06-25

Family

ID=31200537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989001017U Expired - Lifetime JPH0525256Y2 (https=) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0525256Y2 (https=)

Also Published As

Publication number Publication date
JPH0525256Y2 (https=) 1993-06-25

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