JPH0292955U - - Google Patents

Info

Publication number
JPH0292955U
JPH0292955U JP1989001018U JP101889U JPH0292955U JP H0292955 U JPH0292955 U JP H0292955U JP 1989001018 U JP1989001018 U JP 1989001018U JP 101889 U JP101889 U JP 101889U JP H0292955 U JPH0292955 U JP H0292955U
Authority
JP
Japan
Prior art keywords
lead frame
led chip
reflector
display element
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989001018U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525257Y2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989001018U priority Critical patent/JPH0525257Y2/ja
Publication of JPH0292955U publication Critical patent/JPH0292955U/ja
Application granted granted Critical
Publication of JPH0525257Y2 publication Critical patent/JPH0525257Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
JP1989001018U 1989-01-09 1989-01-09 Expired - Lifetime JPH0525257Y2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989001018U JPH0525257Y2 (de) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989001018U JPH0525257Y2 (de) 1989-01-09 1989-01-09

Publications (2)

Publication Number Publication Date
JPH0292955U true JPH0292955U (de) 1990-07-24
JPH0525257Y2 JPH0525257Y2 (de) 1993-06-25

Family

ID=31200539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989001018U Expired - Lifetime JPH0525257Y2 (de) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0525257Y2 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101661A (ja) * 2004-12-24 2005-04-14 Sanyo Electric Co Ltd 発光ダイオードランプ
JP2005101662A (ja) * 2004-12-24 2005-04-14 Sanyo Electric Co Ltd 発光ダイオードランプ
JP4703903B2 (ja) * 2001-07-17 2011-06-15 ローム株式会社 半導体装置の製造方法および半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4703903B2 (ja) * 2001-07-17 2011-06-15 ローム株式会社 半導体装置の製造方法および半導体装置
JP2005101661A (ja) * 2004-12-24 2005-04-14 Sanyo Electric Co Ltd 発光ダイオードランプ
JP2005101662A (ja) * 2004-12-24 2005-04-14 Sanyo Electric Co Ltd 発光ダイオードランプ

Also Published As

Publication number Publication date
JPH0525257Y2 (de) 1993-06-25

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