JPH0291366U - - Google Patents

Info

Publication number
JPH0291366U
JPH0291366U JP1989000194U JP19489U JPH0291366U JP H0291366 U JPH0291366 U JP H0291366U JP 1989000194 U JP1989000194 U JP 1989000194U JP 19489 U JP19489 U JP 19489U JP H0291366 U JPH0291366 U JP H0291366U
Authority
JP
Japan
Prior art keywords
component
conductive foil
conductive
land
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989000194U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989000194U priority Critical patent/JPH0291366U/ja
Publication of JPH0291366U publication Critical patent/JPH0291366U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1989000194U 1989-01-05 1989-01-05 Pending JPH0291366U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989000194U JPH0291366U (enExample) 1989-01-05 1989-01-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989000194U JPH0291366U (enExample) 1989-01-05 1989-01-05

Publications (1)

Publication Number Publication Date
JPH0291366U true JPH0291366U (enExample) 1990-07-19

Family

ID=31199004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989000194U Pending JPH0291366U (enExample) 1989-01-05 1989-01-05

Country Status (1)

Country Link
JP (1) JPH0291366U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012038925A (ja) * 2010-08-06 2012-02-23 Jtekt Corp 素子実装基板の組み立て方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012038925A (ja) * 2010-08-06 2012-02-23 Jtekt Corp 素子実装基板の組み立て方法

Similar Documents

Publication Publication Date Title
JPS6221016Y2 (enExample)
JPH0291366U (enExample)
JP3249865B2 (ja) 半導体集積回路装置の製造方法
JPS6231888Y2 (enExample)
JPS5822144Y2 (ja) プロ−ブカ−ド
JPS6225877U (enExample)
JPH0432616Y2 (enExample)
JPH0270441U (enExample)
JPS60185263U (ja) 回路基板等の検査装置におけるコンタクトプロ−ブ
JPH0726863Y2 (ja) 混成集積回路
JPS6333513Y2 (enExample)
JPS59762Y2 (ja) プロ−ブカ−ド
JPH04109372U (ja) 接続ピンプローブ治具
JPH09129330A (ja) 電子部品用ソケット
JPH02106858U (enExample)
JPS61190867U (enExample)
JPS62163764U (enExample)
JPH0442733U (enExample)
JPS58194349A (ja) 半導体検査装置
JPS61203364U (enExample)
JPH03224259A (ja) 半導体集積回路装置
JPH0339164U (enExample)
JPS63285962A (ja) 表面実装電子部品の電極
JPS6464287A (en) Hybrid integrated circuit
JPS63188577U (enExample)