JPH0290692A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH0290692A JPH0290692A JP24359288A JP24359288A JPH0290692A JP H0290692 A JPH0290692 A JP H0290692A JP 24359288 A JP24359288 A JP 24359288A JP 24359288 A JP24359288 A JP 24359288A JP H0290692 A JPH0290692 A JP H0290692A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- fluororesin
- rigid
- underside
- rigid plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 18
- 239000011889 copper foil Substances 0.000 abstract description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 8
- 229920000647 polyepoxide Polymers 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 2
- 229920002313 fluoropolymer Polymers 0.000 abstract 3
- 239000007767 bonding agent Substances 0.000 abstract 2
- 230000004927 fusion Effects 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野１ 本発明は、回路基板に関する。[Detailed description of the invention] [Industrial application field 1 The present invention relates to a circuit board.
［従来の技術１
フッ素樹脂板の一方の面に銅箔（導電箔）を取り付けて
なる回路基板は公知である。フッ素樹脂板は表面抵抗が
非常に高く銅箔を経路とする信号伝送を良好に行なえる
。[Prior Art 1] A circuit board formed by attaching a copper foil (conductive foil) to one side of a fluororesin board is known. Fluororesin plates have extremely high surface resistance and can perform signal transmission well using copper foil as a route.
通常、銅箔の一方の面がマット面となっていて、この面
がフッ素樹脂板の一方の面に熱溶着されている。また、
フッ素樹脂板は形状維持のために、ある程度の剛性を持
つ厚さになっている。Usually, one surface of the copper foil is a matte surface, and this surface is thermally welded to one surface of the fluororesin plate. Also,
The fluororesin plate is thick enough to have a certain degree of rigidity in order to maintain its shape.
［発明が解決しようとする課題１
上記回路基板に対して、様々な機能の付加が要求される
。例えば、回路基板に半導体を取り付ける場合には、半
導体で生じる熱を逃がすために、良好な放熱性が要求さ
れる。また、回路基板全体を透明にする要求もある。[Problem to be Solved by the Invention 1] Various functions are required to be added to the above-mentioned circuit board. For example, when attaching a semiconductor to a circuit board, good heat dissipation is required to dissipate heat generated in the semiconductor. There is also a demand for making the entire circuit board transparent.
良好な放熱性を得るためには、熱伝導性の悪いフッ素樹
脂板を薄くし、フッ素樹脂板の銅箔とは反対側の面にア
ルミニウム板（剛性板）を取り付け、このアルミニウム
板に放熱と剛性の機能を受は持たせることが考えられる
。In order to obtain good heat dissipation, the fluororesin plate with poor thermal conductivity is made thinner, an aluminum plate (rigid plate) is attached to the opposite side of the fluororesin plate from the copper foil, and this aluminum plate is used for heat dissipation. It is conceivable that the uke has the function of rigidity.
上記透明性を得るためには、フッ素樹脂板を藩くして透
明にし、フッ素樹脂板の銅箔とは反対側の面に透明なプ
ラス板（剛性板）を取り付けることが考えられる。これ
により、回路基板全体を透明にしガラス板に剛性を受は
持たせることが考えられる。In order to obtain the above-mentioned transparency, it is conceivable to make the fluororesin plate transparent and attach a transparent plastic plate (rigid plate) to the surface of the fluororesin plate opposite to the copper foil. By doing this, it is possible to make the entire circuit board transparent and provide rigidity to the glass plate.
しかし、現在のところ、フッ素樹脂板と剛性板との接合
が良好に行なえないため、上記のような要求に答えられ
ない状況にある。詳述すると、フッ素樹脂板に上記アル
ミニウム板やガラス板等の剛性板を熱溶着で取り付けよ
うとしても、剛性板と銅箔の線膨張率の相異により、熱
溶着後の冷却の過程で銅箔にしわが形成される等の不都
合が生じるからである。特に、ガラス板の場合には、熱
溶着に伴なう加圧により破壊されてしまうことが多い
また、接着剤によりフッ素樹脂板と剛性板とを接合しよ
うとしても、フッ素樹脂板と接着剤との接着性が良くな
いので、接合は不可能である。However, at present, the above requirements cannot be met because the fluororesin plate and the rigid plate cannot be bonded well. To be more specific, even if you try to attach a rigid plate such as the aluminum plate or glass plate mentioned above to a fluororesin plate by heat welding, due to the difference in linear expansion coefficient between the rigid plate and the copper foil, the copper will melt during the cooling process after heat welding. This is because inconveniences such as the formation of wrinkles on the foil occur. In particular, in the case of glass plates, they are often destroyed by the pressure that accompanies heat welding.Also, even if you try to join a fluororesin plate and a rigid plate with an adhesive, the fluororesin plate and the adhesive Bonding is not possible due to poor adhesion.
［課題を解決するための手段１
本発明は上記課題を解決するためになされたもので、そ
の要旨は、熱溶融性フッ素樹脂板の一方の面に導電箔を
取り付けてなる回路基板において、フッ素樹脂板の他方
の面がマット面に形成され、この他方の面に接着剤を介
して剛性板が取り付けられていることを特徴とする回路
基板にある。[Means for Solving the Problems 1] The present invention has been made to solve the above problems, and its gist is that in a circuit board formed by attaching a conductive foil to one surface of a heat-fusible fluororesin plate, fluorine-containing The circuit board is characterized in that the other surface of the resin plate is formed into a matte surface, and a rigid plate is attached to this other surface via an adhesive.
［作用１
フッ素樹脂板の導電箔側とは反対の面をマット面にした
ので、接着剤とフッ素樹脂板との間の接着性が良好とな
り、剛性板とフッ素樹脂とを接着剤により強固に接着す
ることができる。[Effect 1: Since the surface of the fluororesin board opposite to the conductive foil side is made matte, the adhesion between the adhesive and the fluororesin board is good, and the rigid board and fluororesin are strengthened by the adhesive. Can be glued.
［実施例１
以下、本発明の一実施例を図面に基づいて説明する０図
中１は熱溶融性のフッ素樹脂板である。[Example 1] Hereinafter, an example of the present invention will be described based on the drawings. Reference numeral 1 in the drawings indicates a heat-fusible fluororesin plate.
フッ素樹脂板１の材料としてはＦＥＰ、ＰＦＡ、ＥＴＦ
Ｅ等がある。フッ素樹脂板１は、厚さ０．２ｍｌ１１〜
０．４ ｍｍ程度であり、透明性を有しているが、それ
自体剛性を有さずフレキシブルである。Materials for the fluororesin board 1 include FEP, PFA, and ETF.
There are E etc. The fluororesin plate 1 has a thickness of 0.2ml11~
Although it is approximately 0.4 mm and has transparency, it does not have rigidity and is flexible.
このフッ素樹脂板１の上面には、厚さ３５５ミクロン程
の銅箔２（導電箔）が接合されている。すなわち、銅箔
２の下面はマット面（つや消し面）となっていて、例え
ば５ミクロン程度の微細な凹凸が形成されている。そし
て、フッ素樹脂板１と銅Ｎ２が熱溶着により接合されて
いる。フッ素樹脂１の上面には、上記熱溶着に上り銅箔
２の下面の＠細な凹凸にかみ合う凹凸が形成されている
ため、両者の接合は強固である。A copper foil 2 (conductive foil) having a thickness of about 355 microns is bonded to the upper surface of this fluororesin plate 1. That is, the lower surface of the copper foil 2 is a matte surface, and has minute irregularities of, for example, about 5 microns formed thereon. Then, the fluororesin plate 1 and the copper N2 are joined by thermal welding. Since the upper surface of the fluororesin 1 has projections and depressions that are formed by the heat welding and engage with the fine projections and depressions on the lower surface of the copper foil 2, the bonding between the two is strong.
また、フッ素樹脂板１の下面は、上面と同様のマット面
となっており、厚さ２００ミクロン程のエポキシ樹脂３
（接着剤）を介して厚さ０．５〜０゜８１１１１程度の
剛性板４が取り付けられている。剛性板４としては、放
熱性を有するアルミニウム板や、透明なガラス板が用い
られる。フッ素樹脂板１の下面がマット面となっていて
、エポキシ樹脂３がその微細な凹部に食い込むため、両
者の接着が強固に行なえる。剛性板４がアルミニウム板
やガラス板の場合には、剛性板４は平坦な面であっても
エポキシ樹脂３と強固に接着する。したがって、フッ素
樹脂板１と剛性板４は、エポキシ樹脂３を介して互いに
強固に接着される。The lower surface of the fluororesin plate 1 has a matte surface similar to the upper surface, and is coated with epoxy resin 3 with a thickness of about 200 microns.
A rigid plate 4 having a thickness of approximately 0.5 to 0°81111 is attached via (adhesive). As the rigid plate 4, an aluminum plate having heat dissipation properties or a transparent glass plate is used. The lower surface of the fluororesin plate 1 is a matte surface, and since the epoxy resin 3 bites into the minute recesses, the two can be firmly bonded. When the rigid plate 4 is an aluminum plate or a glass plate, the rigid plate 4 is firmly adhered to the epoxy resin 3 even if it is a flat surface. Therefore, the fluororesin plate 1 and the rigid plate 4 are firmly adhered to each other via the epoxy resin 3.
上述構成において、高い表面特性を有するフッ素樹脂板
１を用いることにより、銅Ｍ２を経路とする信号の伝送
特性を良好にすることができる。In the above configuration, by using the fluororesin plate 1 having high surface characteristics, it is possible to improve the transmission characteristics of the signal using the copper M2 as a path.
また、剛性板４により回路基板の剛性を保持できるので
、フッ素樹脂板１を薄くフレキシブルにすることができ
る。Furthermore, since the rigid plate 4 can maintain the rigidity of the circuit board, the fluororesin plate 1 can be made thin and flexible.
剛性板４としてアルミニウム板を用いた場合には、放熱
性が向上する。したがって、フッ素樹脂板１の上面に発
熱性の素子例えば半導体を取り付けた場合に、半導体で
発生した熱が薄いフッ素樹脂板１を通って、剛性板４に
至り、ここで熱伝導性の良好な剛性板４の全面にわたっ
て放熱が行なわれる。When an aluminum plate is used as the rigid plate 4, heat dissipation is improved. Therefore, when a heat-generating element such as a semiconductor is attached to the upper surface of the fluororesin plate 1, the heat generated by the semiconductor passes through the thin fluororesin plate 1 and reaches the rigid plate 4, where a heat-generating element with good thermal conductivity is attached. Heat is radiated over the entire surface of the rigid plate 4.
剛性板４として゛〃ガラス板用いた場合には、フッ素樹
脂板１が薄くて透明となっており、剛性板４も透明であ
るから、銅箔２を除いて回路基板全体を透明にすること
ができる。When a glass plate is used as the rigid plate 4, the fluororesin plate 1 is thin and transparent, and the rigid plate 4 is also transparent, so the entire circuit board except the copper foil 2 can be made transparent. Can be done.
なお、回路基板は、銅箔２をフッ素樹脂板１の上面全体
に張り付けた半製品の状態でもよいし、銅？ｉ２をエツ
チングして回路を形成した最終製品の状態であってもよ
い。Note that the circuit board may be a semi-finished product in which the copper foil 2 is pasted on the entire upper surface of the fluororesin board 1, or it may be made of copper foil 2. It may be in the state of a final product in which a circuit is formed by etching i2.
［発明の効果１
以上説明したように、本発明では、フッ素樹脂に剛性板
を強固に接着することができる。したがって、フッ素樹
脂板を薄くすることができ、剛性板の材質を選択するこ
とにより、放熱性、透明性等の種々の機能を持つ回路基
板を提供することができる。[Effect of the Invention 1 As explained above, in the present invention, a rigid plate can be firmly bonded to a fluororesin. Therefore, the fluororesin plate can be made thinner, and by selecting the material of the rigid plate, it is possible to provide a circuit board having various functions such as heat dissipation and transparency.
図は、本発明の一実施例を示す拡大断面図である。
１・・・フッ素樹脂板、２・・・導電箔（銅箔）、３・
・・接着剤（エポキシ樹脂）、４・・・剛性板。The figure is an enlarged sectional view showing one embodiment of the present invention. 1... Fluororesin plate, 2... Conductive foil (copper foil), 3...
...Adhesive (epoxy resin), 4...Rigid board.
Claims (1)
なる回路基板において、フッ素樹脂板の他方の面がマッ
ト面に形成され、この他方の面に接着剤を介して剛性板
が取り付けられていることを特徴とする回路基板。In a circuit board formed by attaching a conductive foil to one side of a heat-melting fluororesin plate, the other side of the fluororesin plate is formed into a matte surface, and a rigid plate is attached to this other side via an adhesive. A circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24359288A JPH0290692A (en) | 1988-09-28 | 1988-09-28 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24359288A JPH0290692A (en) | 1988-09-28 | 1988-09-28 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0290692A true JPH0290692A (en) | 1990-03-30 |
Family
ID=17106109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24359288A Pending JPH0290692A (en) | 1988-09-28 | 1988-09-28 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0290692A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738215A (en) * | 1993-07-23 | 1995-02-07 | Nippon Pillar Packing Co Ltd | Board for printed circuit |
| EP1339270A2 (en) * | 2002-02-25 | 2003-08-27 | SMART Electronics, Inc. | Method of manufacturing metal clad laminate for printed circuit board |
| WO2019203243A1 (en) * | 2018-04-20 | 2019-10-24 | Ａｇｃ株式会社 | Roll film, method for producing roll film, method for producing copper-clad laminate, and method for producig printed wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6170785A (en) * | 1984-09-13 | 1986-04-11 | 松下電工株式会社 | Metal base printed circuit board |
| JPS6287345A (en) * | 1985-10-14 | 1987-04-21 | 松下電工株式会社 | Metallic base laminated plate |
| JPS62268654A (en) * | 1986-05-16 | 1987-11-21 | Seiko Instr & Electronics Ltd | Recording apparatus |
-
1988
- 1988-09-28 JP JP24359288A patent/JPH0290692A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6170785A (en) * | 1984-09-13 | 1986-04-11 | 松下電工株式会社 | Metal base printed circuit board |
| JPS6287345A (en) * | 1985-10-14 | 1987-04-21 | 松下電工株式会社 | Metallic base laminated plate |
| JPS62268654A (en) * | 1986-05-16 | 1987-11-21 | Seiko Instr & Electronics Ltd | Recording apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738215A (en) * | 1993-07-23 | 1995-02-07 | Nippon Pillar Packing Co Ltd | Board for printed circuit |
| EP1339270A2 (en) * | 2002-02-25 | 2003-08-27 | SMART Electronics, Inc. | Method of manufacturing metal clad laminate for printed circuit board |
| EP1339270A3 (en) * | 2002-02-25 | 2005-06-15 | Smart R&C Co., Ltd | Method of manufacturing metal clad laminate for printed circuit board |
| WO2019203243A1 (en) * | 2018-04-20 | 2019-10-24 | Ａｇｃ株式会社 | Roll film, method for producing roll film, method for producing copper-clad laminate, and method for producig printed wiring board |
| JPWO2019203243A1 (en) * | 2018-04-20 | 2021-06-10 | Ａｇｃ株式会社 | Roll film, roll film manufacturing method, copper-clad laminate manufacturing method, and printed circuit board manufacturing method |
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