JPH0555422A - Integrated circuit device - Google Patents
Integrated circuit deviceInfo
- Publication number
- JPH0555422A JPH0555422A JP3210899A JP21089991A JPH0555422A JP H0555422 A JPH0555422 A JP H0555422A JP 3210899 A JP3210899 A JP 3210899A JP 21089991 A JP21089991 A JP 21089991A JP H0555422 A JPH0555422 A JP H0555422A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- integrated circuit
- circuit device
- adhesive resin
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、回路基板の表面に発
熱素子をろう材を用いて接着し、前記回路基板の裏側に
放熱板を接着樹脂によって接着してなる集積回路装置に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device in which a heating element is bonded to the surface of a circuit board using a brazing material and a heat dissipation plate is bonded to the back side of the circuit board with an adhesive resin. ..
【０００２】[0002]
【従来の技術】図３は例えば従来の混成集積回路装置の
一例を示す断面図であり、回路基板１の表面の略中央部
には発熱素子２がろう材であるはんだ３によって接着さ
れ、また、回路基板１の裏側には放熱板４が接着樹脂５
によって接着されている。2. Description of the Related Art FIG. 3 is a sectional view showing an example of a conventional hybrid integrated circuit device. A heating element 2 is bonded to a substantially central portion of the surface of a circuit board 1 by a solder 3 which is a brazing material. On the back side of the circuit board 1, the heat dissipation plate 4 is provided with the adhesive resin 5.
Are glued by.
【０００３】従来の混成集積回路装置は、上記のように
構成され、発熱素子２より発生した熱は、はんだ３、回
路基板１および接着樹脂５を通って放熱板４に伝えら
れ、この放熱板４から外部に放熱される。かかる場合の
放熱板４の放熱作用は、接着樹脂５の塗り厚に大きく左
右され、塗り厚が薄いほど、放熱性は良くなる。The conventional hybrid integrated circuit device is constructed as described above, and the heat generated from the heat generating element 2 is transmitted to the heat radiating plate 4 through the solder 3, the circuit board 1 and the adhesive resin 5, and this heat radiating plate is used. Heat is radiated from the outside to the outside. The heat dissipation effect of the heat dissipation plate 4 in this case largely depends on the coating thickness of the adhesive resin 5, and the thinner the coating thickness, the better the heat dissipation.
【０００４】[0004]
【発明が解決しようとする課題】従来の集積回路装置に
おいては、放熱板４は回路基板１の裏側に接着樹脂５に
よって単に接着されているため、接着樹脂５の塗り厚が
一定しないことが多く、接着樹脂５の塗り厚が厚すぎる
と、回路基板１から放熱板４への熱の伝わりが悪くなっ
て放熱板４の放熱性が著しく低下し、その結果としては
んだ３にクラックが発生し易くなって電気特性不良を起
こすなどの課題があった。逆に、薄すぎると、回路基板
１と放熱板４との接着不良を起こすなどの課題があっ
た。In the conventional integrated circuit device, since the heat dissipation plate 4 is simply bonded to the back side of the circuit board 1 by the adhesive resin 5, the coating thickness of the adhesive resin 5 is often not constant. If the coating thickness of the adhesive resin 5 is too thick, the heat transfer from the circuit board 1 to the heat dissipation plate 4 is deteriorated, and the heat dissipation performance of the heat dissipation plate 4 is significantly reduced. As a result, cracks are likely to occur in the solder 3. Then, there was a problem such as causing electrical characteristics failure. On the other hand, if it is too thin, there is a problem such as defective adhesion between the circuit board 1 and the heat dissipation plate 4.
【０００５】この発明は、このような課題を解決するた
めになされたもので、回路基板と放熱板との間の接着樹
脂の塗り厚を常に一定に確保できて、放熱性が均一化し
品質が安定した集積回路装置を提供することを目的とす
る。The present invention has been made in order to solve the above problems, and the coating thickness of the adhesive resin between the circuit board and the heat dissipation plate can be always kept constant, resulting in uniform heat dissipation and high quality. An object is to provide a stable integrated circuit device.
【０００６】[0006]
【課題を解決するための手段】この発明にかかる集積回
路装置においては、回路基板と放熱板との間に突起部を
設けたものである。In the integrated circuit device according to the present invention, a protrusion is provided between the circuit board and the heat sink.
【０００７】[0007]
【作用】この発明にかかる集積回路装置においては、突
起部によって接着樹脂の塗り厚が常に一定に保持され
る。In the integrated circuit device according to the present invention, the coating thickness of the adhesive resin is always kept constant by the protrusion.
【０００８】[0008]
【実施例】実施例１．図１は、この発明にかかる集積回
路装置を示したものであり、図において、回路基板１、
発熱素子２、はんだ３、放熱板４および接着樹脂５の構
成は、前記従来例と略同じであるため、符号のみを付
し、その説明を省略する。回路基板１の裏面には、半球
状で熱伝導性のよい材料からなる突起部６が形成されて
いる。この突起部６は、放熱板４が傾いたり、がたつい
たりしないで略平行に回路基板１に密着するように、回
路基板１の縁端部近くに複数個突設されている。EXAMPLES Example 1. FIG. 1 shows an integrated circuit device according to the present invention. In FIG.
The configurations of the heat generating element 2, the solder 3, the heat dissipation plate 4, and the adhesive resin 5 are substantially the same as those in the conventional example, and thus only the reference numerals are given and the description thereof is omitted. On the back surface of the circuit board 1, a protrusion 6 made of a material having a hemispherical shape and good thermal conductivity is formed. A plurality of the protrusions 6 are provided near the edge portion of the circuit board 1 so that the heat dissipation plate 4 does not tilt or rattle and adheres to the circuit board 1 substantially in parallel.
【０００９】このような構成において、発熱素子２より
発生した熱は、従来の装置と同様にはんだ３、回路基板
１および接着樹脂５を通って放熱板４に伝えられ、この
放熱板４から外部に放熱されるが、突起部６によって接
着樹脂５の塗り厚が一定厚に確保されているため、放熱
板４の放熱は一定となる。In such a structure, the heat generated from the heat generating element 2 is transferred to the heat radiating plate 4 through the solder 3, the circuit board 1 and the adhesive resin 5 as in the conventional device, and the heat radiating plate 4 is externally connected. However, since the coating thickness of the adhesive resin 5 is ensured by the protrusion 6 to be constant, the heat dissipation of the heat dissipation plate 4 is constant.
【００１０】実施例２．なお、実施例においては、突起
部６を回路基板１に突設した場合について説明したが、
放熱板４側に突起部を突設しても同様の効果が得られ
る。Embodiment 2. In addition, in the embodiment, the case where the protrusion 6 is provided on the circuit board 1 has been described.
The same effect can be obtained by providing a protrusion on the heat sink 4 side.
【００１１】[0011]
【発明の効果】以上説明したように、この発明の集積回
路装置によれば、回路基板と放熱板との間に、接着樹脂
の塗り厚を一定に保持するための突起部を設けたことに
より、回路基板と放熱板との間の熱伝達が一定に保た
れ、したがって発熱素子からの熱は放熱板より外部にス
ムースに放出され、品質が安定するという効果がある。As described above, according to the integrated circuit device of the present invention, the protrusion for keeping the coating thickness of the adhesive resin constant is provided between the circuit board and the heat sink. The heat transfer between the circuit board and the heat dissipation plate is kept constant, so that the heat from the heating element is smoothly radiated to the outside from the heat dissipation plate, and the quality is stabilized.
【図１】この発明の一実施例を示す集積回路装置の縦断
面図である。FIG. 1 is a vertical sectional view of an integrated circuit device showing an embodiment of the present invention.
【図２】放熱板に回路基板を接着する前の集積回路装置
の縦断面図である。FIG. 2 is a vertical cross-sectional view of an integrated circuit device before a circuit board is bonded to a heat sink.
【図３】従来の集積回路装置の一例を示す縦断面図であ
る。FIG. 3 is a vertical cross-sectional view showing an example of a conventional integrated circuit device.
１ 回路基板 ２ 発熱素子 ４ 放熱板 ５ 接着樹脂 ６ 突起部 1 circuit board 2 heating element 4 heat sink 5 adhesive resin 6 protrusion
Claims (1)
いて接着し、前記回路基板の裏側に放熱板を接着樹脂に
よって接着してなる集積回路装置において、前記回路基
板と前記放熱板との間に前記接着樹脂の塗り厚を一定に
保持するための突起部を設けたことを特徴とする集積回
路装置。1. An integrated circuit device in which a heating element is bonded to the surface of a circuit board by using a brazing material, and a heat dissipation plate is bonded to the back side of the circuit board with an adhesive resin. An integrated circuit device, characterized in that a protrusion for maintaining a constant coating thickness of the adhesive resin is provided between the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3210899A JPH0555422A (en) | 1991-08-22 | 1991-08-22 | Integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3210899A JPH0555422A (en) | 1991-08-22 | 1991-08-22 | Integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0555422A true JPH0555422A (en) | 1993-03-05 |
Family
ID=16596921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3210899A Pending JPH0555422A (en) | 1991-08-22 | 1991-08-22 | Integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0555422A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009031388A1 (en) | 2008-11-20 | 2010-06-02 | Mitsubishi Electric Corp. | Electronic carrier device |
| WO2019016922A1 (en) * | 2017-07-20 | 2019-01-24 | 三菱電機株式会社 | Electronic device and manufacturing method for electronic device |
-
1991
- 1991-08-22 JP JP3210899A patent/JPH0555422A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009031388A1 (en) | 2008-11-20 | 2010-06-02 | Mitsubishi Electric Corp. | Electronic carrier device |
| US8014152B2 (en) | 2008-11-20 | 2011-09-06 | Mitsubishi Electric Corporation | Electronic substrate device |
| US8284556B2 (en) | 2008-11-20 | 2012-10-09 | Mitsubishi Electric Corporation | Electronic substrate device |
| WO2019016922A1 (en) * | 2017-07-20 | 2019-01-24 | 三菱電機株式会社 | Electronic device and manufacturing method for electronic device |
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