JPH0286743U - - Google Patents
Info
- Publication number
- JPH0286743U JPH0286743U JP16640688U JP16640688U JPH0286743U JP H0286743 U JPH0286743 U JP H0286743U JP 16640688 U JP16640688 U JP 16640688U JP 16640688 U JP16640688 U JP 16640688U JP H0286743 U JPH0286743 U JP H0286743U
- Authority
- JP
- Japan
- Prior art keywords
- module wiring
- wiring board
- print head
- heat sink
- led print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第1図及び第2図は本考案の第1及び第2の実
施例を示す断面図、第3図は従来のLEDプリン
トヘツドの第1の例を示す斜視図、第4図は隣接
するLEDアレイチツプ相互間の関係を示す模式
斜視図、第5図及び第6図は従来のLEDプリン
トヘツドの第2の例を示す斜視図及びA―A′線
断面図である。 1,1a……モジユール配線基板、2……LE
Dアレイチツプ、3……駆動IC、4……回路基
板、5……ヒートシンク、6……絶縁性樹脂、7
……ボンデイング線、8……ナイフの刃、9……
テーパ、L……記録幅、g……ギヤツプ、x……
テーパ高さ。
施例を示す断面図、第3図は従来のLEDプリン
トヘツドの第1の例を示す斜視図、第4図は隣接
するLEDアレイチツプ相互間の関係を示す模式
斜視図、第5図及び第6図は従来のLEDプリン
トヘツドの第2の例を示す斜視図及びA―A′線
断面図である。 1,1a……モジユール配線基板、2……LE
Dアレイチツプ、3……駆動IC、4……回路基
板、5……ヒートシンク、6……絶縁性樹脂、7
……ボンデイング線、8……ナイフの刃、9……
テーパ、L……記録幅、g……ギヤツプ、x……
テーパ高さ。
Claims (1)
- LEDアレイチツプを複数個配列して搭載した
モジユール配線基板と、表面に前記モジユール配
線基板を複数個配列して設けたヒートシンクとを
有するLEDプリントヘツドにおいて、前記モジ
ユール配線基板が前記ヒートシンクと接する側の
面の周縁部に設けたテーパを有することを特徴と
するLEDプリントヘツド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16640688U JPH0286743U (ja) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16640688U JPH0286743U (ja) | 1988-12-22 | 1988-12-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0286743U true JPH0286743U (ja) | 1990-07-10 |
Family
ID=31453757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16640688U Pending JPH0286743U (ja) | 1988-12-22 | 1988-12-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0286743U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241729A (ja) * | 2003-02-07 | 2004-08-26 | Matsushita Electric Ind Co Ltd | 発光光源、照明装置、表示装置及び発光光源の製造方法 |
JP2011061139A (ja) * | 2009-09-14 | 2011-03-24 | Kansai Electric Power Co Inc:The | 半導体装置 |
-
1988
- 1988-12-22 JP JP16640688U patent/JPH0286743U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241729A (ja) * | 2003-02-07 | 2004-08-26 | Matsushita Electric Ind Co Ltd | 発光光源、照明装置、表示装置及び発光光源の製造方法 |
JP2011061139A (ja) * | 2009-09-14 | 2011-03-24 | Kansai Electric Power Co Inc:The | 半導体装置 |