JPH01156043U - - Google Patents
Info
- Publication number
- JPH01156043U JPH01156043U JP1988048022U JP4802288U JPH01156043U JP H01156043 U JPH01156043 U JP H01156043U JP 1988048022 U JP1988048022 U JP 1988048022U JP 4802288 U JP4802288 U JP 4802288U JP H01156043 U JPH01156043 U JP H01156043U
- Authority
- JP
- Japan
- Prior art keywords
- heat generating
- common electrode
- resistor
- board
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
第1図は一実施例を示す平面図、第2図は第1
図のA―A線位置での断面図、第3図は従来の端
面型サーマルヘツドを示す断面図である。 10……発熱基板、11……配線基板、12…
…支持板、10a……一端辺、13……発熱抵抗
体、14……個別電極、15,17……共通電極
、19,20……ワイヤ、18……駆動用ICチ
ツプ。
図のA―A線位置での断面図、第3図は従来の端
面型サーマルヘツドを示す断面図である。 10……発熱基板、11……配線基板、12…
…支持板、10a……一端辺、13……発熱抵抗
体、14……個別電極、15,17……共通電極
、19,20……ワイヤ、18……駆動用ICチ
ツプ。
Claims (1)
- 発熱抵抗体が形成された発熱基板と駆動回路用
半導体集積回路装置が実装された配線基板とが隣
接して支持板上に固定されており、前記発熱基板
上では発熱抵抗体が一端辺に沿つて配列され、そ
の端辺と反対方向に折り曲げられた形状に形成さ
れ、各発熱抵抗体の一端は個別電極を経て前記駆
動回路用半導体集積回路装置に接続され、各発熱
抵抗体の他端は前記端辺と反対側の端辺に沿つた
共通電極につながつており、前記配線基板には電
源供給用共通電極が形成され、この共通電極と前
記発熱基板の共通電極とが接続されており、前記
発熱基板の発熱抵抗体が形成されている側の端面
に沿つて被記録体が摺動して印字が行なわれる端
面型サーマルヘツド。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988048022U JPH01156043U (ja) | 1988-04-08 | 1988-04-08 | |
US07/332,620 US4982201A (en) | 1988-04-08 | 1989-04-03 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988048022U JPH01156043U (ja) | 1988-04-08 | 1988-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01156043U true JPH01156043U (ja) | 1989-10-26 |
Family
ID=12791687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988048022U Pending JPH01156043U (ja) | 1988-04-08 | 1988-04-08 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4982201A (ja) |
JP (1) | JPH01156043U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016068270A (ja) * | 2014-09-26 | 2016-05-09 | 東芝ホクト電子株式会社 | サーマルヘッド |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2519553B2 (ja) * | 1990-01-09 | 1996-07-31 | セイコー電子工業株式会社 | サ―マルヘッド |
JPH03266653A (ja) * | 1990-03-16 | 1991-11-27 | Hitachi Ltd | 厚膜感熱記録ヘッド |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5970590A (ja) * | 1982-10-15 | 1984-04-21 | Nec Corp | 積層セラミックサ−マルヘッドの製造方法 |
JPS60122173A (ja) * | 1983-12-05 | 1985-06-29 | Konishiroku Photo Ind Co Ltd | 感熱記録ヘッド |
JPS6295250A (ja) * | 1985-10-22 | 1987-05-01 | Rohm Co Ltd | サ−マルプリントヘツド装置 |
JPS6349453A (ja) * | 1986-08-19 | 1988-03-02 | Matsushita Electric Ind Co Ltd | サ−マルヘツド |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3730619A1 (de) * | 1986-09-12 | 1988-03-17 | Sony Corp | Thermodruckkopf |
US4810852A (en) * | 1988-04-01 | 1989-03-07 | Dynamics Research Corporation | High-resolution thermal printhead and method of fabrication |
-
1988
- 1988-04-08 JP JP1988048022U patent/JPH01156043U/ja active Pending
-
1989
- 1989-04-03 US US07/332,620 patent/US4982201A/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5970590A (ja) * | 1982-10-15 | 1984-04-21 | Nec Corp | 積層セラミックサ−マルヘッドの製造方法 |
JPS60122173A (ja) * | 1983-12-05 | 1985-06-29 | Konishiroku Photo Ind Co Ltd | 感熱記録ヘッド |
JPS6295250A (ja) * | 1985-10-22 | 1987-05-01 | Rohm Co Ltd | サ−マルプリントヘツド装置 |
JPS6349453A (ja) * | 1986-08-19 | 1988-03-02 | Matsushita Electric Ind Co Ltd | サ−マルヘツド |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016068270A (ja) * | 2014-09-26 | 2016-05-09 | 東芝ホクト電子株式会社 | サーマルヘッド |
Also Published As
Publication number | Publication date |
---|---|
US4982201A (en) | 1991-01-01 |