JPH0286197A - Device for mounting electronic component - Google Patents

Abstract

PURPOSE:To enable alternative selective use or simultaneous use with smaller space and by a simpler method, by providing an elevating device to supplying units, and securing a working area and refuge area differently in height from each other, one on the upper step and the other on the lower step. CONSTITUTION:When one supplying unit 14 supplies an electronic component to a substrate 5, this supplying unit 14 is landed on a rotator 13 and positioned in a working area P on the side of a pickup position (a). While, the other supplying unit 15 is moved to an area opposite to the pickup position (a), and this supplying unit 15 is put aside in the refuge area Q on the upper step by projecting the rod 25a of an elevating device 25. After the other supplying unit 15 is put aside upward to take refuge, only the supplying unit 14 is horizontally rotated around a rotating axis 12 being the center; a desired tape unit 18 is moved to the pickup position (a); and an electronic component is picked up with a nozzle 7, transferred, and mounted onto the substrate 5 through an intermittent rotation of a rotary head 2.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus, and particularly to the structure of an electronic component supply apparatus.

(Prior Art) As a device for mounting electronic components on a board, there is a known device in which electronic components mounted on a tape unit are pinked up using a transfer head, and then transferred and mounted on a board positioned by a positioning device. . Multiple tape units of this type are arranged side by side to form a supply unit for electronic components.
This supply unit is set on a moving device, and by sliding it back and forth in the horizontal direction on the moving device using a drive means such as a motor or feed screw, the electronic components of each tape unit are moved to the pick-up position in the order in which they are mounted. It is picked up by a transfer head and transferred and mounted on the board.

However, in the past, only one supply unit was installed in a mobile device, so if an electronic component of one of the tape units in the supply unit ran out and needed to be replaced, the operation of the device had to be stopped. However, there was a problem in that the implementation efficiency did not increase accordingly.

In order to solve this problem, it has been proposed to divide the supply unit into two and use the two supply units alternately (Japanese Patent Laid-Open No. 140499/1983).
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(Problem to be Solved by the Invention) However, in the above-mentioned conventional device, two supply units are arranged horizontally, and when one supply unit is in a work area that reciprocates in the horizontal direction and supplies electronic components to the board. teeth,
The other supply unit was supposed to wait in the evacuation area on the side, so if the supply unit became long due to the large variety and quantity of electronic components, the moving device would become extremely long and require a large installation space. There was a problem. Furthermore, since each supply unit requires a drive means such as a feed screw or a motor, there is a problem in that the apparatus becomes large in size.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component mounting apparatus that allows a plurality of supply units to be used alternately or simultaneously with a smaller space and simpler driving means.

(Means for Solving the Problems) To this end, the present invention provides an electronic component mounting apparatus of this type, which includes an electronic component supply device including a plurality of supply units equipped with tape units equipped with electronic components in a fan shape; It is composed of a drive device that horizontally rotates a supply unit about a rotation axis to move a desired tape unit to a pick-up position by a transfer head, and a lifting device that raises and lowers the supply unit.

(Function) In the above configuration, when one supply unit is in the work area and supplies electronic components to the board while rotating horizontally around the rotation axis, the other supply unit retreats to the retreat area. ing. Further, when there are many types of electronic components to be mounted on the board, both supply units are located within the work area and both supply the electronic components to the board while rotating horizontally. By providing the elevating device for the supply unit in this manner, the work area and the retreat area are set at different heights, and one is secured at the upper level and the other at the lower level.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of the electronic component mounting apparatus, and FIG. 2 is a plan view, in which ▪ indicates a main body box, and 2 indicates a rotary head disposed at the bottom thereof.

A large number of transfer heads 3 are mounted on the lower surface of the rotary head 2 along the circumferential direction, and the rotary head 2 rotates intermittently in the N direction.

Reference numeral 4 denotes a positioning device for the substrate 5 provided at the lower part of the rotary head 2, which is composed of XY child tables a and 4b, and moves the substrate 5 in the XY directions. A conveyor 6 carries the substrate 5 into the positioning device 4 and carries it out from there.

Reference numeral 10 denotes an electronic component supply device provided on the opposite side of the positioning device 4. Next, the details thereof will be explained with reference to FIGS. 1 to 3.

Reference numeral 11 denotes a drive unit box, and a rotating shaft 12 is erected in this box 11. 13 is a disc-shaped rotating body attached to the lower part of this rotating shaft 12, and two supply units 14 and 15 are placed on this rotating body 13. This supply unit 1-14.15 has a semicircular plate 16.17 equipped with a plurality of tape units 1-18, 18, .

Reference numeral 19 denotes a pin-shaped positioning member erected on the rotating body 13, and by inserting the hole 20 of the plate 16.17 into the positioning member 19, the supply unit 1-14.15
is positioned on the rotating body 13.

In FIG. 3, reference numeral 21 denotes a drive device disposed in the box-11, which includes a motor 22. It consists of gears 23 and 24 and drives the rotating shaft 12 to horizontally rotate the supply unit 14° 15 placed on the rotating body 13. Reference numeral 25 denotes a cylinder as an elevating device, and by protruding and retracting the rod 25a, the supply units 14 and 15 are raised and lowered. In FIG. 2, a indicates the pick-up position of the electronic component, and at this position, the nozzle 7 of the transfer head 3 (see FIG. 3) moves up and down to pink up the electronic component of the tape unit 18. The lifting device 25 is located in an area opposite to the pick-up position a with respect to the rotation axis 12, and raises and lowers the supply unit 14, 15 in this position. The supply units 14 and 15 are driven by the drive device 21 to rotate horizontally while landing on the rotating body 13, and supply electronic components to the substrate 5.

In addition, while being pushed upward by the lifting device 25,
It is to be evacuated so as not to obstruct the horizontal rotation of the supply unit in the lower tier, and therefore the lower tier is the work area P and the upper tier is the evacuation area Q.

This device has the above-mentioned configuration, and its operation will be explained next.

When supplying electronic components from one supply unit 14 to the board 5, the supply unit 14 is landed on the rotating body 13 and positioned in the work area P on the pickup position a side. The other supply unit 15 is moved to the area opposite to the pink-up position a, the rod 25a of the lifting device 25 is made to protrude, and this supply unit 15 is retreated to the upper evacuation area Q (third (See the dashed line in the figure). In this state, the load of the supply unit 15 is not applied to the rotating body 13, and only the load of the other supply unit 14 is applied to the drive device 2.
1 load. After retracting the other supply unit 15 upward in this way, only one supply unit 14 is horizontally rotated around the rotating shaft 12, the desired tape unit 18 is moved to the big amplifier position a, and the nozzle 7
picks up the electronic components and rotates them to the rotary head 2.
It is transferred and mounted on the substrate 5 by intermittent rotation. in this case,
Since the other supply unit 15 is evacuated to the upper evacuation area Q, it does not become an obstacle to the horizontal rotation of the supply unit 14, and the supply unit 14 rotates around the entire circumference of the rotation shaft 12 (360
°) is used as a work area and the electronic components are supplied onto the board 5 while freely rotating horizontally.

When the electronic components in one of the tape units 18 of the supply units 14 are exhausted, the other supply unit 15 is lowered onto the rotating body 13, this supply unit 15 is moved to the pink-up position a side, and the other one is removed. The supply unit 14 is moved to the opposite side, and the elevating device 25 is driven to raise the supply unit 14 and evacuate it to the evacuation area Q. Next, the supply unit 15 is horizontally rotated in the same manner as described above, and the mounting work is continued while supplying electronic components from the supply unit 15 to the board 5. In the meantime, the tape unit 18 of the supply unit 14 that has been evacuated to the evacuation area Q is replaced.

The above mounting mode is advantageous when the types and quantities of electronic components to be mounted on the board 5 are relatively small, but when the types and quantities of electronic components are large, the two supply units 14 and 15 are rotated together. Land on the work area on body 13 and rotate body 1.
Electronic components are supplied from the two supply units 14 and 15 to the board 5 while reciprocating the electronic parts 3 by 360''.

In this way, this supply device 10 can
You can freely change the driving method.

Although the above embodiment has been explained using a rotary head type electronic component mounting apparatus as an example, the present invention can also be applied to a non-rotary head type electronic component mounting apparatus, and the upper stage can be used as a work area and the lower stage as a retreat area. can.

(Effects of the Invention) As described above, the present invention provides an electronic component mounting apparatus of this type, which includes a plurality of supply units equipped with tape units equipped with electronic components in a fan shape, and a supply unit. It consists of a drive device that horizontally rotates the tape unit around its rotation axis to move the desired tape unit to the pick-up position by the transfer head, and a lifting device that raises and lowers the supply unit. can be set at different heights, one on the upper level and the other on the lower level, so the installation space for the supply device can be reduced, and each supply unit can share the drive device and lifting device. Therefore, the supply device can be configured compactly.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a plan view, and FIG. 3 is a side view of a supply device. 3... Transfer head 4... Positioning device 5... Substrate 10... Supply device 12... Rotation shaft 14.15... Supply unit 18... Tape unit 21... Drive device 25 ... Lifting device a ... Pick-up position

Claims (1)

[Claims] An electronic component mounting apparatus comprising an electronic component supply device, a board positioning device, and a transfer head that picks up electronic components from the supply device and transfers and mounts the electronic components on the board positioned by the positioning device. , a plurality of supply units equipped with tape units equipped with electronic components in a fan shape, and a drive device that horizontally rotates the supply units around a rotation axis to move a desired tape unit to a pick-up position by the transfer head; An electronic component mounting apparatus comprising an elevating device for elevating and lowering the supply unit.