JPH0286148U - - Google Patents
Info
- Publication number
- JPH0286148U JPH0286148U JP16613788U JP16613788U JPH0286148U JP H0286148 U JPH0286148 U JP H0286148U JP 16613788 U JP16613788 U JP 16613788U JP 16613788 U JP16613788 U JP 16613788U JP H0286148 U JPH0286148 U JP H0286148U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- fuse
- blowing
- protect
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims 1
Landscapes
- Fuses (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16613788U JPH0286148U (el) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16613788U JPH0286148U (el) | 1988-12-22 | 1988-12-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0286148U true JPH0286148U (el) | 1990-07-09 |
Family
ID=31453255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16613788U Pending JPH0286148U (el) | 1988-12-22 | 1988-12-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0286148U (el) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007317970A (ja) * | 2006-05-26 | 2007-12-06 | Furukawa Electric Co Ltd:The | ヒューズ付半導体装置 |
JP2008198661A (ja) * | 2007-02-08 | 2008-08-28 | Mitsubishi Electric Corp | 半導体装置 |
-
1988
- 1988-12-22 JP JP16613788U patent/JPH0286148U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007317970A (ja) * | 2006-05-26 | 2007-12-06 | Furukawa Electric Co Ltd:The | ヒューズ付半導体装置 |
JP4593518B2 (ja) * | 2006-05-26 | 2010-12-08 | 古河電気工業株式会社 | ヒューズ付半導体装置 |
JP2008198661A (ja) * | 2007-02-08 | 2008-08-28 | Mitsubishi Electric Corp | 半導体装置 |
JP4579259B2 (ja) * | 2007-02-08 | 2010-11-10 | 三菱電機株式会社 | 半導体装置 |