JP4593518B2 - ヒューズ付半導体装置 - Google Patents
ヒューズ付半導体装置 Download PDFInfo
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- JP4593518B2 JP4593518B2 JP2006147465A JP2006147465A JP4593518B2 JP 4593518 B2 JP4593518 B2 JP 4593518B2 JP 2006147465 A JP2006147465 A JP 2006147465A JP 2006147465 A JP2006147465 A JP 2006147465A JP 4593518 B2 JP4593518 B2 JP 4593518B2
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
半導体装置が実装された回路基板に前記半導体装置に隣接して形成された導体のパターンと、
前記パターンの上面に形成された溝と、前記パターンの上面かつ前記溝の一側端周縁部を含む領域に低融点金属部材で形成された電極とからなるヒューズ機構と、
一端が前記半導体装置の電極に接続され他端が前記ヒューズ機構の電極に接続されてこれらを電気的に接続するワイヤとを備え、
前記パターンに過電流が流れたときに前記ヒューズ機構の電極が溶けて前記溝に流れ込み前記ワイヤの他端と切断されて前記半導体装置と前記パターンとが電気的に遮断されるヒューズ付半導体装置であって、
前記ヒューズ機構の溝は、複数の細い溝からなり、当該複数の細い溝が、前記ヒューズ機構の電極が過電流により溶けたときにこの溶けた電極部材が毛細管現象により前記各溝内に流入することで当該電極部材とワイヤとの接続を遮断して前記半導体装置と前記パターンとを電気的に遮断することができる間隔になるように並んで形成されていることを特徴としている。
前記ヒューズ機構の溝は、両端が閉塞され前記パターンの上面に密着されたフィルムにより覆われ、かつ前記電極が形成されている一側端部が、溶融した電極部材を前記溝内に引き込むことができる大きさに開口していることを特徴としている。
半導体装置が実装された回路基板に前記半導体装置に隣接して形成された導体のパターンと、
前記パターンの前記半導体装置側の上面に密着して装着され、前記上面と密着する下面に一端が前記半導体装置側に開口し他端が閉塞された溝が形成された薄膜と、前記溝の開口端周縁部を含む領域に低融点金属部材で形成された電極とからなるヒューズ機構と、
一端が前記半導体装置の電極に接続され他端が前記ヒューズ機構の電極に接続されてこれらを電気的に接続するワイヤとを備え、
前記パターンに過電流が流れたときに前記ヒューズ機構の電極が溶けて前記溝に流れ込み前記ワイヤの他端と切断されて前記半導体装置と前記パターンとが電気的に遮断されることを特徴としている。
2 半導体装置(半導体チップ)
3 電極
4 ワイヤ
4a 一端部
4b 他端部
5 パターン
5a 端部
5b 上面
5c 縁部
6 ヒューズ機構
7 溝
7a 一端部
7b 他端部
8 フィルム
9 電極
10 溶けた電極部材
11 封止部材
12 ヒューズ付半導体装置
16 ヒューズ機構
17 フィルム
18 溝
18a 一端部
18b 他端部
Claims (5)
- 半導体装置が実装された回路基板に前記半導体装置に隣接して形成された導体のパターンと、
前記パターンの上面に形成された溝と、前記パターンの上面かつ前記溝の一側端周縁部を含む領域に低融点金属部材で形成された電極とからなるヒューズ機構と、
一端が前記半導体装置の電極に接続され他端が前記ヒューズ機構の電極に接続されてこれらを電気的に接続するワイヤとを備え、
前記パターンに過電流が流れたときに前記ヒューズ機構の電極が溶けて前記溝に流れ込み前記ワイヤの他端と切断されて前記半導体装置と前記パターンとが電気的に遮断されるヒューズ付半導体装置であって、
前記ヒューズ機構の溝は、複数の細い溝からなり、当該複数の細い溝が、前記ヒューズ機構の電極が過電流により溶けたときにこの溶けた電極部材が毛細管現象により前記各溝内に流入することで当該電極部材とワイヤとの接続を遮断して前記半導体装置と前記パターンとを電気的に遮断することができる間隔になるように並んで形成されていることを特徴とするヒューズ付半導体装置。 - 前記ヒューズ機構の溝は、両端が閉塞され前記パターンの上面に密着されたフィルムにより覆われ、かつ前記電極が形成されている一側端部が、溶融した電極部材を前記溝内に引き込むことができる大きさに開口していることを特徴とする、請求項1に記載のヒューズ付半導体装置。
- 半導体装置が実装された回路基板に前記半導体装置に隣接して形成された導体のパターンと、
前記パターンの前記半導体装置側の上面に密着して装着され、前記上面と密着する下面に一端が前記半導体装置側に開口し他端が閉塞された溝が形成された薄膜と、前記溝の開口端周縁部を含む領域に低融点金属部材で形成された電極とからなるヒューズ機構と、
一端が前記半導体装置の電極に接続され他端が前記ヒューズ機構の電極に接続されてこれらを電気的に接続するワイヤとを備え、
前記パターンに過電流が流れたときに前記ヒューズ機構の電極が溶けて前記溝に流れ込み前記ワイヤの他端と切断されて前記半導体装置と前記パターンとが電気的に遮断されることを特徴とするヒューズ付半導体装置。 - 前記ヒューズ機構の溝は、複数の細い溝からなり、当該複数の細い溝が、前記ヒューズ機構の電極が過電流により溶けたときにこの溶けた電極部材が毛細管現象により前記各溝内に流入することで当該電極部材とワイヤとの接続を遮断して前記半導体装置と前記パターンとを電気的に遮断することができる間隔になるように並んで形成されていることを特徴とする、請求項3に記載のヒューズ付半導体装置。
- 前記半導体装置及びヒューズ機構が形成されたパターン及びワイヤは封止部材により一体に封止されていることを特徴とする、請求項2又は請求項3に記載のヒューズ付半導体装置。
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JP2006147465A JP4593518B2 (ja) | 2006-05-26 | 2006-05-26 | ヒューズ付半導体装置 |
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JP4593518B2 true JP4593518B2 (ja) | 2010-12-08 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015029833A1 (ja) | 2013-08-30 | 2015-03-05 | 株式会社オートネットワーク技術研究所 | 半導体装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US9865537B1 (en) * | 2016-12-30 | 2018-01-09 | Texas Instruments Incorporated | Methods and apparatus for integrated circuit failsafe fuse package with arc arrest |
WO2023178528A1 (zh) * | 2022-03-22 | 2023-09-28 | 华为数字能源技术有限公司 | 半导体器件、电子装置及半导体器件的制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0286148U (ja) * | 1988-12-22 | 1990-07-09 | ||
JPH033355A (ja) * | 1989-05-31 | 1991-01-09 | Sanyo Electric Co Ltd | 混成集積回路 |
JPH0669292A (ja) * | 1992-06-17 | 1994-03-11 | Rohm Co Ltd | ワイヤーボンディング方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0286148U (ja) * | 1988-12-22 | 1990-07-09 | ||
JPH033355A (ja) * | 1989-05-31 | 1991-01-09 | Sanyo Electric Co Ltd | 混成集積回路 |
JPH0669292A (ja) * | 1992-06-17 | 1994-03-11 | Rohm Co Ltd | ワイヤーボンディング方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015029833A1 (ja) | 2013-08-30 | 2015-03-05 | 株式会社オートネットワーク技術研究所 | 半導体装置 |
US10038316B2 (en) | 2013-08-30 | 2018-07-31 | Autonetworks Technologies, Ltd. | Semiconductor device |
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