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Priority to JP8227087UpriorityCriticalpatent/JPH028601Y2/ja
Publication of JPS63196357UpublicationCriticalpatent/JPS63196357U/ja
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Publication of JPH028601Y2publicationCriticalpatent/JPH028601Y2/ja
Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing circuit board