JPH0285391A - Aluminum plating solution using nonaqueous solvent - Google Patents
Aluminum plating solution using nonaqueous solventInfo
- Publication number
- JPH0285391A JPH0285391A JP23742188A JP23742188A JPH0285391A JP H0285391 A JPH0285391 A JP H0285391A JP 23742188 A JP23742188 A JP 23742188A JP 23742188 A JP23742188 A JP 23742188A JP H0285391 A JPH0285391 A JP H0285391A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- compd
- org
- contg
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 21
- 239000002904 solvent Substances 0.000 title claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 14
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 8
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 239000000470 constituent Substances 0.000 claims abstract description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 4
- 150000001298 alcohols Chemical class 0.000 claims abstract description 3
- 229910000102 alkali metal hydride Inorganic materials 0.000 claims abstract description 3
- 150000008046 alkali metal hydrides Chemical class 0.000 claims abstract description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims abstract description 3
- 150000002170 ethers Chemical class 0.000 claims abstract description 3
- 150000002240 furans Chemical class 0.000 claims abstract description 3
- 150000002596 lactones Chemical class 0.000 claims abstract description 3
- 229910052799 carbon Inorganic materials 0.000 claims abstract 3
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract 3
- -1 aluminum hydride compound Chemical class 0.000 claims description 9
- 239000003125 aqueous solvent Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 3
- 150000001728 carbonyl compounds Chemical class 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 239000012776 electronic material Substances 0.000 abstract description 7
- 229910052736 halogen Inorganic materials 0.000 abstract description 5
- 150000002367 halogens Chemical class 0.000 abstract description 5
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 abstract 2
- 150000007942 carboxylates Chemical class 0.000 abstract 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000012279 sodium borohydride Substances 0.000 abstract 1
- 229910000033 sodium borohydride Inorganic materials 0.000 abstract 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 235000017281 sodium acetate Nutrition 0.000 description 4
- 239000001632 sodium acetate Substances 0.000 description 4
- 239000003115 supporting electrolyte Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229940009827 aluminum acetate Drugs 0.000 description 3
- 239000012770 industrial material Substances 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Natural products CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- HDYRYUINDGQKMC-UHFFFAOYSA-M acetyloxyaluminum;dihydrate Chemical compound O.O.CC(=O)O[Al] HDYRYUINDGQKMC-UHFFFAOYSA-M 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N EtOH Substances CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
工業材料および電子材料に使用できる非水溶媒アルミニ
ウムめっき液に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a non-aqueous solvent aluminum plating solution that can be used for industrial materials and electronic materials.
（従来技術）
近年、電子材料の製造コストの低減を図るため電子材料
の資金属の代わりに銅、アルミニウムの使用が検討され
ている。(Prior Art) In recent years, in order to reduce the manufacturing cost of electronic materials, the use of copper and aluminum as substitutes for metals in electronic materials has been considered.
アルミニウムめっき浴としては、従来、冷延または熱延
コイルなど工業材料にめっきする電気アルミニウムめっ
き浴としてテトラヒドロフラン。Tetrahydrofuran has traditionally been used as an electrolytic aluminum plating bath for plating industrial materials such as cold-rolled or hot-rolled coils.
ベンゼンなどの有機溶媒と、無水塩化アルミニウムと水
素化アルミニウムリチウムとからなる７ｇ質とで調整さ
れたアルミニウムめっき浴が知られている。（例えば特
公昭４Ｂ−３２２６６、特公昭（発明が解決しようとす
る課題）
しかし、このような塩素を含んだ非水溶媒アルミニウム
めっき液はめっき時のまき込みにより。An aluminum plating bath prepared with an organic solvent such as benzene and a 7g substance consisting of anhydrous aluminum chloride and lithium aluminum hydride is known. (For example, Japanese Patent Publication No. 4B-32266, Japanese Patent Publication No. 4B-32266 (Problem to be Solved by the Invention)) However, such a non-aqueous solvent aluminum plating solution containing chlorine is mixed in during plating.
めっき皮膜中に塩素を含んでしまい、電子材料に使用で
きない。The plating film contains chlorine and cannot be used for electronic materials.
そこで１本発明では、塩素などハロゲン元素を官能基に
含まない物質を用いた非水溶媒アルミニラムめっき液を
提供することにある。One object of the present invention is to provide a non-aqueous aluminum plating solution using a substance that does not contain a halogen element such as chlorine in its functional group.
（課題を解決するための手段）
本発明の非水溶媒アルミニウムめっき液は、アルコール
類、エーテル類、カルボン酸類、フラン類、ラクトン類
のいずれか１種以上からなる溶媒と、カルボン酸および
カルボニル化合物からなり。(Means for Solving the Problems) The nonaqueous solvent aluminum plating solution of the present invention contains a solvent consisting of one or more of alcohols, ethers, carboxylic acids, furans, and lactones, and a carboxylic acid and a carbonyl compound. It consists of
かつＩｌ、Ｃ，Ｎ、Ｏ，Ａ ｌを官能基構成元素とする
有機アルミニウム化合物と、アルカリ金運の水素化物、
ホウ水素化物、水素化アルミニウム化合物のいずれかか
らなる還元剤からなる。and an organoaluminum compound having Il, C, N, O, Al as functional group constituent elements, and an alkali metal hydride,
The reducing agent consists of either a borohydride or an aluminum hydride compound.
（作用）
アルミニウム化合物は、有機溶媒に難溶性であるが、塩
素を末端基とする化合物は、比較的良く有機溶媒に熔解
し、電解効率が良いとされている。(Function) Aluminum compounds are poorly soluble in organic solvents, but compounds having chlorine as a terminal group are relatively well soluble in organic solvents and are said to have good electrolytic efficiency.
アルミニウム化合物の末端基と有機溶媒の末端基を同じ
または類似の基とすることにより、親和性を強め、溶解
度を大きくすることができる。このことにより、アルミ
ニウムめっき液の抵抗を小さくシ９通電を容易にし、電
解効率を向上させることができる。By making the terminal group of the aluminum compound and the terminal group of the organic solvent the same or similar, affinity can be strengthened and solubility can be increased. This makes it possible to reduce the resistance of the aluminum plating solution, facilitate energization, and improve electrolytic efficiency.
また、めっき液中にハロゲン化合物などを含まない為に
アルミニウム皮膜の電着過程において。In addition, since the plating solution does not contain halogen compounds, it is suitable for the electrodeposition process of aluminum films.
電子部品材料に含まれてはいけない不純物をまき込むこ
となく、めっき皮膜を形成させることが可能となる。It becomes possible to form a plating film without introducing impurities that should not be included in electronic component materials.
（実施例）
下記組成の非水溶媒アルミニウムめっき液を乾燥Ａｒガ
スでバブリングした後、銅板に５００ ｍＡ／ ｄｒｙ
で定電流電解をした。(Example) After bubbling a non-aqueous solvent aluminum plating solution with the following composition with dry Ar gas, a copper plate was heated at 500 mA/dry.
I did constant current electrolysis.
１゜
溶媒・・・ＴＩＩＦ＋ｒ−ＢＬ
アルミニウム化合物・・・
酢酸アルミニウム ０．１Ｍ／ｌ
支持電解質・・・
酢酸ナトリウム ０．１Ｍ／Ｊ！
還元剤・・・ＨＬ ｉＡＩ ０．ＯＩＭ／１溶媒・・
・エタノール
アルミニウム化合物・・・
アセチリアセトンアルミニウム ０．ＬＭ／１支持電解
質・・・酢酸ナトリウム ０．２Ｍ／β還元剤−・・Ｎ
ａｌ３Ｈ４０，ＬＭ／ｌ１３゜
溶媒・・・ジエチルエーテル
アルミニウム化合物・・・
アセチリアセトンアルミニウム ０．３Ｍ／１支持電解
質・・・酢酸ナトリウム ０．ＬＭ１１還元剤・・・Ｌ
ｉ１ｌ Ｏ，ＯＩＭ／６４゜
ン容媒 ・ ・ ・ 酢酸
アルミニウム化合物・・
酢酸アルミニウム ０． １Ｍ／ｉｔ
支持電解質・・・酢酸ナトリウム Ｏ，１Ｍ／１還元剤
・・・ＨＬｉＡＩ ０．００５Ｍ／１注）’ｒ［ｒｒ
；’：テトラヒドロフランｒ−Ｂ Ｌ ：ガンマーブチ
ルラクトン（発明の効果）
本発明は以上説明したように、非水溶媒アルミニウムめ
っき液中にハロゲン元素を含まないのでめっき被膜中に
ハロゲン元素を含まず、工業材料および電子材料のめっ
き液として使用できる。1゜Solvent...TIIF+r-BL Aluminum compound...Aluminum acetate 0.1M/l Supporting electrolyte...Sodium acetate 0.1M/J! Reducing agent...HL iAI 0. OIM/1 solvent...
・Ethanol aluminum compound... Aluminum acetylacetone 0. LM/1 supporting electrolyte...sodium acetate 0.2M/β reducing agent...N
al3H40, LM/l13° Solvent...diethyl ether aluminum compound...aluminum acetylacetone 0.3M/1 Supporting electrolyte...sodium acetate 0. LM11 reducing agent...L
i1l O, OIM/64° container ・ ・ ・ Aluminum acetate compound... Aluminum acetate 0. 1M/it Supporting electrolyte...Sodium acetate O, 1M/1 Reducing agent...HLiAI 0.005M/1Note)'r[rr
;': Tetrahydrofuran r-B L: Gamma butyrolactone (Effect of the invention) As explained above, the present invention does not contain a halogen element in the non-aqueous solvent aluminum plating solution, so the plating film does not contain a halogen element, Can be used as a plating solution for industrial and electronic materials.
Claims (1)
ラクトン類のいずれか１種以上からなる溶媒と、カルボ
ン酸およびカルボニル化合物からなり、かつＨ、Ｃ、Ｎ
、Ｏ、Ａｌのみを官能基構成元素とする有機アルミニウ
ム化合物と、アルカリ金属の水素化物、ホウ水素化物、
水素化アルミニウム化合物いずれかからなる還元剤から
なることを特徴とする非水溶媒アルミニウムめっき液。Alcohols, ethers, carboxylic acids, furans,
A solvent consisting of any one or more of lactones, a carboxylic acid and a carbonyl compound, and H, C, N
, O, an organoaluminum compound having only Al as a functional group constituent element, an alkali metal hydride, a borohydride,
A non-aqueous solvent aluminum plating solution comprising a reducing agent consisting of an aluminum hydride compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23742188A JPH0285391A (en) | 1988-09-21 | 1988-09-21 | Aluminum plating solution using nonaqueous solvent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23742188A JPH0285391A (en) | 1988-09-21 | 1988-09-21 | Aluminum plating solution using nonaqueous solvent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0285391A true JPH0285391A (en) | 1990-03-26 |
| JPH0321634B2 JPH0321634B2 (en) | 1991-03-25 |
Family
ID=17015109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23742188A Granted JPH0285391A (en) | 1988-09-21 | 1988-09-21 | Aluminum plating solution using nonaqueous solvent |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0285391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012188756A (en) * | 2008-01-04 | 2012-10-04 | Sungkyunkwan Univ Foundation For Corporate Collaboration | METHOD FOR EFFICIENTLY FORMING Al-C COVALENT BONDING BETWEEN ALUMINUM AND CARBON MATERIAL |
-
1988
- 1988-09-21 JP JP23742188A patent/JPH0285391A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012188756A (en) * | 2008-01-04 | 2012-10-04 | Sungkyunkwan Univ Foundation For Corporate Collaboration | METHOD FOR EFFICIENTLY FORMING Al-C COVALENT BONDING BETWEEN ALUMINUM AND CARBON MATERIAL |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0321634B2 (en) | 1991-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Hurley et al. | Electrodeposition of metals from fused quaternary ammonium salts | |
| CN110205659B (en) | Electrotinning additive and preparation method thereof | |
| US2818374A (en) | Method for electrodepositing cadmiumindium alloys | |
| JPH0613758B2 (en) | Electro aluminum plating method | |
| JPH0285391A (en) | Aluminum plating solution using nonaqueous solvent | |
| US6500327B1 (en) | Sn-Bi alloy plating bath and method of plating using the same | |
| JPH08321439A (en) | Electrolytic solution and electrochemical element using the same | |
| CN107858703A (en) | A kind of electrolysis additive formula and application method for improving solution of zinc sulfate electrolytic zinc quality and production environment | |
| US4586990A (en) | Chelating metals | |
| JPH041993B2 (en) | ||
| JP2824267B2 (en) | Aluminum plating method for metal materials | |
| JP2002275678A (en) | Whisker-free tin and tin alloy plating solution, printing film and plating object | |
| JPS6389695A (en) | Neutral ph electrolytic bath for electroplating | |
| EP0750549B1 (en) | Bismuth coating protection for copper | |
| CN111118559B (en) | Composition for surface treatment of copper flexible connection | |
| SU779454A1 (en) | Solution for electrochemical polishing of nickel-based alloys | |
| JPH05311484A (en) | Reflow tin or tin alloy plating bath | |
| KR830002514B1 (en) | Aluminum Alloy for Oilfield Anode | |
| JPS63259096A (en) | Production of permanent magnet having superior oxidation resistance | |
| SU1181337A1 (en) | Electrolyte for deposition of niobium coatings | |
| SU1581782A1 (en) | Electrolyte for depositing tin-nickel alloy coatings | |
| CN118048666A (en) | Methylsulfonate type pure tin electroplating solution additive and electroplating solution containing same | |
| JPH0569122A (en) | Soldering method by hydrogencharg system | |
| CN118600500A (en) | Electrotinning bismuth alloy plating solution and preparation method and application thereof | |
| Khairy et al. | Contribution to the electrochemical behaviour of zinc electrode in pyridine media |