JPH0613758B2 - Electro aluminum plating method - Google Patents
Electro aluminum plating methodInfo
- Publication number
- JPH0613758B2 JPH0613758B2 JP60208144A JP20814485A JPH0613758B2 JP H0613758 B2 JPH0613758 B2 JP H0613758B2 JP 60208144 A JP60208144 A JP 60208144A JP 20814485 A JP20814485 A JP 20814485A JP H0613758 B2 JPH0613758 B2 JP H0613758B2
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- Prior art keywords
- plating
- aluminum
- bath
- halogen compound
- mol
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Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は浴寿命が長く、危険性も小さく、しかも安価で
電流効率も高い電気アルミニウムめっき方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electrolytic aluminum plating method having a long bath life, a low risk, a low cost, and a high current efficiency.
（従来技術） アルミニウムの電気めっきは、アルミニウムの酸素に対
する親和力が大きく、電位が水素より卑であるので、水
溶液系のめっき浴で行なうことは困難である。このため
従来よりアルミニウムの電気めっきは非水溶液系のめっ
き浴、特に有機溶媒系のめっき浴で行なわれている。(Prior Art) Since electroplating of aluminum has a high affinity for oxygen with respect to oxygen and its electric potential is baser than hydrogen, it is difficult to perform electroplating with an aqueous solution plating bath. Therefore, aluminum electroplating has hitherto been carried out in a non-aqueous plating bath, particularly in an organic solvent plating bath.
この有機溶媒系のめっき浴としては、AlCl3とLiAlH4ま
たはLiHとをエーテルに溶解したものやAlCl3とLiAlH4と
をTHF（テトラヒドロフラン）に溶解したものが代表的
なもので、これらのめっき浴によれば、純度、加工性お
よび外観の優れたアルミニウムめっきを行なうことがで
きる。Typical organic solvent-based plating baths are those in which AlCl 3 and LiAlH 4 or LiH are dissolved in ether, and those in which AlCl 3 and LiAlH 4 are dissolved in THF (tetrahydrofuran). The bath can perform aluminum plating excellent in purity, workability, and appearance.
（発明が解決しようとする問題点） しかしこれらのめっき浴はいずれも浴中に非常に活性な
LiAlH4やLiHを含んでいるため、酸素や水分が存在する
と、それらと反応して分解し、電流効率が低下し、浴寿
命も短くなってしまうものであった。このためめっきに
際してはめっき浴が酸素や水分と接触しないように不活
性ガスでシールしていたが、完全なシールは困難なた
め、めっき時間が長くなるにつれて電流効率の低下、浴
寿命の短縮化は避けられないものであった。(Problems to be solved by the invention) However, all of these plating baths are very active in the bath.
Since it contains LiAlH 4 and LiH, when oxygen or water is present, it reacts with them and decomposes, current efficiency decreases, and bath life shortens. For this reason, during plating, the plating bath was sealed with an inert gas so that it would not come into contact with oxygen and moisture, but complete sealing is difficult, so current efficiency decreases and bath life shortens as the plating time increases. Was inevitable.
またLiAlH4やLiHは酸素や水分を激しく反応するため、
誤って酸素や水分が多量に混入すると、爆発の危険性も
あった。Also, LiAlH 4 and LiH react violently with oxygen and water,
There was also a danger of explosion if a large amount of oxygen or water was accidentally mixed.
さらにLiAlH4やLiHは高価なため、めっき費が高くな
り、価格的に用途が制限されていた。Furthermore, since LiAlH 4 and LiH are expensive, the plating cost is high and the applications are limited in price.
（問題点を解決するための手段） 本発明は、従来の非水溶液系電気アルミニウムめっき浴
には上記のような問題があった点に鑑み、それらを解決
しためっき浴によるめっき方法を提供するものである。(Means for Solving Problems) The present invention provides a plating method using a plating bath that solves the above problems in the conventional non-aqueous solution type aluminum electroplating bath. Is.
本発明者らは上記のような問題のないめっき浴を開発す
べく、種々研究した結果、アルミニウムハロゲン化合物
とアルキルピリジニウムハロゲン化合物とからなる溶融
塩浴を開発したのである。そしてこの溶融塩浴により効
率よく外観良好な高純度のアルミニウムめっきを行なう
には特定の電解条件で行なうことが必要であることを知
見した。The present inventors have conducted various studies in order to develop a plating bath free from the above problems, and as a result, have developed a molten salt bath composed of an aluminum halogen compound and an alkylpyridinium halogen compound. Then, it was found that it is necessary to carry out under the specific electrolysis conditions in order to efficiently perform high-purity aluminum plating having a good appearance with this molten salt bath.
すなわち本発明者らはアルミニウムハロゲン化合物（Al
X3、但しＸはCl,Br,I）４０〜８０モル％とアルキルピ
リジニウムハロゲン化合物（C5H5N-R-X、但しＲは炭素
数１〜５のアルキル基、Ｘはハロゲン原子）２０〜６０
モル％とを溶融してなる電気アルミニウムめっき浴を用
い、乾燥無酸素雰囲気中で直流電流またはパルス電流に
より浴温０〜４０℃、電流密度０．１〜１０A/dm2の電
解条件でめっきすることを特徴とする電気アルミニウム
めっき方法を開発したのである。That is, the present inventors
X 3 , where X is Cl, Br, I) 40 to 80 mol% and an alkylpyridinium halogen compound (C 5 H 5 NRX, where R is an alkyl group having 1 to 5 carbon atoms and X is a halogen atom) 20 to 60
Using an aluminum electroplating bath prepared by melting mol%, plating is carried out in a dry oxygen-free atmosphere under direct current or pulsed current at a bath temperature of 0 to 40 ° C. and a current density of 0.1 to 10 A / dm 2. We have developed an aluminum electroplating method that is characterized by this.
本発明のめっき浴はアルミニウムハロゲン化合物とアル
キルピリジニウムハロゲン化合物との濃度が上記範囲に
あると、常温付近で液体となり、イオン解離するので、
アルミニウムの電気めっきがウムとブチルピリジニウム
クロリドとからなる溶融塩のめっき浴は次のようにイオ
ン解離する。When the concentration of the aluminum halogen compound and the alkylpyridinium halogen compound is in the above range, the plating bath of the present invention becomes liquid at around room temperature and ion dissociates.
A molten salt plating bath in which aluminum electroplating is composed of um and butylpyridinium chloride undergoes ionic dissociation as follows.
またこのめっき浴は不燃性で、安定しているため、酸素
や水分と接触しても爆発などの心配がない。 In addition, since this plating bath is nonflammable and stable, there is no risk of explosion even if it comes into contact with oxygen or moisture.
本発明のめっき浴の場合も従来のめっき浴と同様アルミ
ニウムめっきはアルミニウムハロゲン化合物により行な
うのであるが、本発明の場合アルミニウムハロゲン化合
物はAlCl3に限定されず、AlBr3、AlI3も使用可能であ
る。しかしAlCl3は安価であるほか、刺激性も少ないこ
とから、安全面からも好ましい。In the case of the plating bath of the present invention, aluminum plating is performed with an aluminum halogen compound as in the conventional plating bath, but in the present invention, the aluminum halogen compound is not limited to AlCl 3 , and AlBr 3 and AlI 3 can also be used. is there. However, AlCl 3 is preferable in terms of safety because it is inexpensive and has low irritation.
アルキルピリジニウムハロゲン化合物としては、アルキ
ル基の炭素数が１〜５のものを使用するのが好ましい。
これはアルキル基の炭素数が６以上になると、アルミニ
ウムハロゲン化合物と混合した場合、常温で液体になり
にくくなるためである。As the alkylpyridinium halogen compound, it is preferable to use one having an alkyl group having 1 to 5 carbon atoms.
This is because when the alkyl group has 6 or more carbon atoms, it becomes difficult to become a liquid at room temperature when mixed with an aluminum halogen compound.
浴中のアルミニウムハロゲン化合物の濃度は４０〜８０
モル％にするのが好ましい。これはアルミニウムハロゲ
ン化合物が４０モル％未満であると、前記イオン解離よ
り明らかなようにアルキルピリジニウムカチオン濃度が
高くなり、アルミニウム電析の際アルキルピリジニウム
カチオン還元反応が同時に進行し、浴の劣化、電流効率
の低下およびめっき層の表面外観不良を招くからであ
る。また８０モル％を越えると、浴の導電率が低くな
り、蒸気圧も高くなる。The concentration of the aluminum halogen compound in the bath is 40-80
It is preferably set to mol%. This is because when the content of the aluminum halogen compound is less than 40 mol%, the concentration of the alkylpyridinium cation becomes high as is clear from the above-mentioned ion dissociation, and the alkylpyridinium cation reduction reaction simultaneously progresses during the electrodeposition of aluminum, which deteriorates the bath and the current. This is because it causes a decrease in efficiency and a poor surface appearance of the plating layer. On the other hand, if it exceeds 80 mol%, the conductivity of the bath will be low and the vapor pressure will be high.
アルミニウムハロゲン化合物の濃度をこのようにした場
合、アルキルピリジニウムハロゲン化合物はその残部で
あるので、濃度は２０〜６０モル％となる。When the concentration of the aluminum halogen compound is set to this range, the concentration is 20 to 60 mol% because the alkylpyridinium halogen compound is the rest.
めっき浴は酸素や水分に触れても安全であるが、アルミ
ニウム錯イオンの酸化を防止するため、めっきは乾燥無
酸素雰囲気中（たとえば乾燥N2やAr中）で行なうのが好
ましい。また電解条件は浴温０〜４０℃で、直流または
パルス電流を用いて、0.1〜１０A/dm2にすると効率よく
高純度で、均一なめっきを行なうことができる。浴温が
０℃より低いと、高電流密度でめっきすることが困難に
なり、逆に浴温を４０℃より高くして電流密度を１０A/
dm2より高くすると、めっき層は灰色になるとともに、
結晶も粗いデンドライト結晶となり、外観、加工性が劣
ってしまう。電流は直流よりパルス電流の方が結晶が微
細になり、加工性が良好になる。The plating bath is safe even if it is exposed to oxygen and moisture, but it is preferable to carry out plating in a dry oxygen-free atmosphere (for example, in dry N 2 or Ar) in order to prevent oxidation of aluminum complex ions. Further, the electrolysis conditions are a bath temperature of 0 to 40 ° C. and a direct current or a pulsed current of 0.1 to 10 A / dm 2, which enables efficient and high-purity and uniform plating. If the bath temperature is lower than 0 ° C, it will be difficult to plate with high current density. Conversely, if the bath temperature is higher than 40 ° C, the current density will be 10A /
When it is higher than dm 2 , the plating layer becomes gray and
The crystals also become coarse dendrite crystals, resulting in poor appearance and processability. As for the electric current, the pulse current makes the crystal finer and the workability becomes better than the direct current.
一般に連続めっきで均一なめっきを施すには、めっき浴
にAlイオンを補給して、浴中のAlイオンを一定に管理す
る必要がるが、この場合本発明のめっき浴では陽極をア
ルミニウム製可溶性陽極にすると、通電量に応じてAlイ
オンが自動的に補給されるので、好都合である。たとえ
ばAlCl3-BPC（ブチルピリジニウムクロリド）系めっき
浴でアルミニウム製陽極を使用してめっきすると、Alイ
オンは陽極より次のようにして自動的に補給される。Generally, in order to perform uniform plating by continuous plating, it is necessary to replenish the plating bath with Al ions and to control the Al ions in the bath to a constant level. When the anode is used, Al ions are automatically replenished according to the amount of electricity passed, which is convenient. For example, when plating with an aluminum anode in an AlCl 3 -BPC (butylpyridinium chloride) -based plating bath, Al ions are automatically replenished from the anode as follows.
Al＋４Cl-→AlCl4 -＋３ｅ− Al＋７AlCl4 -→４Al2Cl7 -＋３ｅ− 添付図面は陽極にアルミニウム板を使用して、浴温２０
±２℃、電流密度１A/dm2で鋼帯に連続めっきを施した
場合の浴中Alイオン濃度変化を示したものであるが、長
時間めっきを続けてもAlイオン濃度はほぼ一定に保たれ
る。Al + 4Cl − → AlCl 4 − + 3e − Al + 7AlCl 4 − → 4Al 2 Cl 7 − + 3e − The attached drawing uses an aluminum plate for the anode, and the bath temperature is 20
The figure shows the change in Al ion concentration in the bath when the steel strip is continuously plated at ± 2 ° C and a current density of 1 A / dm 2 , but the Al ion concentration remains almost constant even when plating is continued for a long time. Be drunk
陽極にTi-Pt系などの不溶性陽極を使用して連続めっき
する場合のAlイオンの補給は、AlCl3、AlBr3、AlI3などの
ハロゲン化合物を補給すればよい。しかし不溶性陽極使
用による連続めっきの場合、電解時に陽極界面でハロゲ
ンガス発生反応が起こって、浴中のハロゲン成分が減少
する。このため浴組成が変動し、浴の寿命が短くなる。When continuously plating using an insoluble anode such as a Ti-Pt system as the anode, the Al ions may be supplemented with a halogen compound such as AlCl 3 , AlBr 3 , and AlI 3 . However, in the case of continuous plating using an insoluble anode, a halogen gas generation reaction occurs at the anode interface during electrolysis, and the halogen component in the bath decreases. As a result, the bath composition changes and the life of the bath is shortened.
以下実施例により本発明を説明する。The present invention will be described below with reference to examples.
（実施例） 実施例１ 冷延鋼板（板厚0.5mm）に常法により溶剤蒸気洗浄、ア
ルカリ脱脂および酸洗などのめっき前処理を施した後、
乾燥して、直ちにあらかじめN2雰囲気に保っておいたAl
Cl3６０モル％とブチルピリジニウムクロリド４０モル
％からなる溶融塩めっき浴（浴温２０℃）に浸漬し、ア
ルミニウムめっきを行なった。めっきは冷延鋼板を陰
極、アルミニウム板（純度99.993wt％、板厚５mm）を陽
極として、直流により電流密度１A/dm2で１５分間行な
った。(Example) Example 1 After cold-rolled steel sheet (sheet thickness 0.5 mm) was subjected to plating pretreatment such as solvent vapor cleaning, alkali degreasing and pickling by a conventional method,
Al that had been dried and immediately kept in N 2 atmosphere beforehand
It was immersed in a molten salt plating bath (bath temperature 20 ° C.) consisting of 60 mol% of Cl 3 and 40 mol% of butylpyridinium chloride for aluminum plating. The plating was carried out by using a cold-rolled steel plate as a cathode and an aluminum plate (purity 99.993 wt%, plate thickness 5 mm) as an anode, and direct current at a current density of 1 A / dm 2 for 15 minutes.
得られたアルミニウムめっき鋼板のめっき層は厚みが均
一で、白色を呈し、結晶は緻密であった。また鋼板に繰
り返し折り曲げを施してもクラックや剥離は発生せず、
加工、密着性とも良好であった。The plating layer of the obtained aluminum-plated steel sheet had a uniform thickness, white color, and dense crystals. Even if the steel sheet is repeatedly bent, cracks and peeling do not occur,
Both processing and adhesion were good.
電流効率は通電量、めっき付着量より計算してみると、
１００％であった。The current efficiency is calculated from the energization amount and the plating adhesion amount,
It was 100%.
実施例２ 板厚0.5mmの冷延鋼板に実施例１と同要領でアルミニウ
ムめっきを行なった。めっきはN2雰囲気に保った浴温３
０℃のAlCl3６０モル％とメチルピリジニウムクロリド
４０モル％からなる溶融塩めっき浴に冷延鋼板を浸漬し
て、該鋼板を陰極、アルミニウム板（実施例１と同じ）
を陽極として、直流により電流密度２A/dm2で１０分間
行なった。Example 2 A cold-rolled steel sheet having a thickness of 0.5 mm was plated with aluminum in the same manner as in Example 1. Bath temperature 3 kept in N 2 atmosphere
A cold-rolled steel sheet was immersed in a molten salt plating bath consisting of 60 mol% AlCl 3 and 40 mol% methylpyridinium chloride at 0 ° C. to make the steel plate a cathode and an aluminum plate (same as in Example 1).
Was used as an anode, and the current density was 2 A / dm 2 for 10 minutes with direct current.
得られたアルミニウムめっき鋼板のめっき層品質は実施
例１と同様厚みが均一で、白色を呈し、結晶は緻密であ
った。また鋼板に繰り返し折り曲げを施してもクラック
や剥離は発生せず、加工、密着性とも良好であった。さ
らに電流効率も１００％であった。The quality of the plating layer of the obtained aluminum-plated steel sheet was uniform as in Example 1, white was exhibited, and the crystals were dense. Further, even if the steel sheet was repeatedly bent, cracks and peeling did not occur, and the processing and adhesion were good. Further, the current efficiency was 100%.
実施例３ 板厚0.5mmの冷延鋼板に実施例１と同要領でアルミニウ
ムめっきを行なった。めっきはAr雰囲気に保った浴温２
０℃のAlBr3６０モル％とプロピルピリジニウムクロリ
ド４０モル％からなる溶融塩めっき浴に冷延鋼板を浸漬
して、該鋼板を陰極、アルミニウム板（実施例１と同
じ）を陽極として、直流により電流密度１A/dm2で１５
分間行なった。Example 3 A cold-rolled steel sheet having a plate thickness of 0.5 mm was plated with aluminum in the same manner as in Example 1. Bath temperature 2 kept in Ar atmosphere
A cold-rolled steel sheet was immersed in a molten salt plating bath consisting of 60 mol% of AlBr 3 and 40 mol% of propylpyridinium chloride at 0 ° C., and the steel sheet was used as a cathode and an aluminum plate (the same as in Example 1) was used as an anode. 15 at a current density of 1 A / dm 2
It was done for a minute.
得られたアルミニウムめっき鋼板のめっき層品質は実施
例１と同様厚みが均一で、白色を呈し、結晶は緻密であ
った。また鋼板に繰り返し折り曲げを施してもクラック
や剥離は発生せず、加工、密着性とも良好であった。さ
らに電流効率も９８％であった。The quality of the plating layer of the obtained aluminum-plated steel sheet was uniform as in Example 1, white was exhibited, and the crystals were dense. Further, even if the steel sheet was repeatedly bent, cracks and peeling did not occur, and the processing and adhesion were good. Further, the current efficiency was 98%.
実施例４ 板厚0.5mmの冷延鋼板に実施例１と同様にめっき前処
理、乾燥を施して、実施例１〜３の各めっき浴でパルス
電流によりアルミニウムめっきを行なった。パルス電流
によるめっきはいずれのめっき浴の場合もデューティー
比１／１０〜１／１００、平均電流密度0.1〜１０A/dm2
で行なったが、めっき層の厚みは均一で、外観、加工
性、密着性とも直流によりめっきした場合と同一であっ
た。Example 4 A cold-rolled steel sheet having a plate thickness of 0.5 mm was subjected to plating pretreatment and drying in the same manner as in Example 1, and aluminum plating was performed by pulse current in each plating bath of Examples 1 to 3. For the plating by pulse current, the duty ratio is 1/10 to 1/100 and the average current density is 0.1 to 10 A / dm 2 in any plating bath.
The thickness of the plated layer was uniform, and the appearance, workability, and adhesion were the same as when plated with direct current.
またCu合金、Ni合金へも上記同様にめっきしてみたが、
優れたAlめっきが可能であった。I also tried plating on Cu alloy and Ni alloy in the same way as above,
Excellent Al plating was possible.
（効果） 以上の本発明で使用するめっき浴は酸素や水分と激しく
反応するような成分を含んでいないので、浴寿命が長
く、危険性が小さい。またアルキルピリジニウムハロゲ
ン化合物はLiAlH4やLiHより安価で、電流効率も高いの
で、浴寿命の長いことと相俟ってめっき費を著しく低減
させることができる。(Effect) Since the plating bath used in the present invention does not contain a component that reacts violently with oxygen and moisture, the bath life is long and the risk is low. Moreover, since the alkylpyridinium halogen compound is cheaper than LiAlH 4 and LiH and has high current efficiency, the plating cost can be significantly reduced in combination with the long bath life.
従って本発明のめっき法によれば、耐熱性、耐酸化性、
耐食性などの点から電気アルミニウムめっき素材や製品
を必要とする家電部品、ICリードフレーム等の電子部
品、自動車部品、航空部品などの分野にそれらを安価に
供給することができる。Therefore, according to the plating method of the present invention, heat resistance, oxidation resistance,
From the viewpoint of corrosion resistance, etc., they can be supplied at low cost to the fields of electric aluminum plating materials and home appliances that require products and products, electronic parts such as IC lead frames, automobile parts, and aviation parts.
添付図面は本発明のめっき浴で連続めっきする際、陽極
として、アルミニウム製陽極を用いて、長時間めっきし
た場合の浴中Alイオン濃度変化を示すグラフである。The accompanying drawings are graphs showing changes in the Al ion concentration in the bath when an aluminum anode is used as the anode for long-term plating during continuous plating with the plating bath of the present invention.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭56−103873（ＪＰ，Ａ) ─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-56-103873 (JP, A)
Claims (2)
ＸはCl,Br,I）４０〜８０モル％とアルキルピリジニウ
ムハロゲン化合物（C5H5N-R-X、但しＲは炭素数１〜５
のアルキル基、Ｘはハロゲン原子）２０〜６０モル％と
を溶融してなる電気アルミニウムめっき浴を用い、乾燥
無酸素雰囲気中で直流電流またはパルス電流により浴温
０〜４０℃、電流密度０．１〜１０A/dm2の電解条件で
めっきすることを特徴とする電気アルミニウムめっき方
法。1. An aluminum halogen compound (AlX 3 , wherein X is Cl, Br, I) 40 to 80 mol% and an alkylpyridinium halogen compound (C 5 H 5 NRX, wherein R is 1 to 5 carbon atoms).
Alkyl group, X is a halogen atom) and an electric aluminum plating bath prepared by melting 20 to 60 mol% is used, and the bath temperature is 0 to 40 ° C. and the current density is 0. A method for electroplating aluminum, which comprises plating under electrolysis conditions of 1 to 10 A / dm 2 .
ることを特徴とする特許請求の範囲第１項に記載の電気
アルミニウムめっき方法。2. The method for electroplating aluminum according to claim 1, wherein the anode is made of aluminum and plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60208144A JPH0613758B2 (en) | 1985-09-20 | 1985-09-20 | Electro aluminum plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60208144A JPH0613758B2 (en) | 1985-09-20 | 1985-09-20 | Electro aluminum plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6270592A JPS6270592A (en) | 1987-04-01 |
| JPH0613758B2 true JPH0613758B2 (en) | 1994-02-23 |
Family
ID=16551362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60208144A Expired - Lifetime JPH0613758B2 (en) | 1985-09-20 | 1985-09-20 | Electro aluminum plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0613758B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989000616A1 (en) * | 1987-07-13 | 1989-01-26 | Nisshin Steel Co., Ltd. | Process for electroplating metal plate with aluminum |
| JP2540110B2 (en) * | 1987-07-13 | 1996-10-02 | 日新製鋼株式会社 | Electro aluminum plating method |
| JPS6479394A (en) * | 1987-09-22 | 1989-03-24 | Nisshin Steel Co Ltd | Aluminum electroplating method |
| JP2623482B2 (en) * | 1987-10-15 | 1997-06-25 | 日新製鋼株式会社 | Building equipment for non-aqueous solution electric aluminum plating bath |
| JP2662635B2 (en) * | 1988-04-26 | 1997-10-15 | 日新製鋼株式会社 | Electric aluminum plating bath and plating method using the bath |
| JP2623485B2 (en) * | 1988-09-05 | 1997-06-25 | 日新製鋼株式会社 | Electro-aluminum plating method to make plane orientation of plating film uniform |
| JP2771607B2 (en) * | 1989-06-22 | 1998-07-02 | 三菱化学株式会社 | Method for producing room temperature molten salt |
| JP5270846B2 (en) | 2007-02-09 | 2013-08-21 | ディップソール株式会社 | Electric Al-Zr alloy plating bath using room temperature molten salt bath and plating method using the same |
| US8821707B2 (en) | 2010-08-04 | 2014-09-02 | Dipsol Chemicals Co., Ltd. | Electric Al or Al alloy plating bath using room temperature molten salt bath and plating method using the same |
| WO2012043129A1 (en) | 2010-09-30 | 2012-04-05 | 株式会社日立製作所 | Aluminum electroplating solution |
| KR20130132498A (en) | 2011-01-05 | 2013-12-04 | 딥솔 가부시키가이샤 | Electrical aluminium or aluminium alloy fused salt plating bath having good throwing power, and electroplating method and pretreatment method using same |
| JP2014077188A (en) * | 2012-10-12 | 2014-05-01 | Sumitomo Electric Ind Ltd | Method and apparatus for producing aluminum powder, and aluminum powder |
| DE102015108420A1 (en) * | 2015-05-28 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Method for producing a carrier element, carrier element and electronic component with a carrier element |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103873A (en) * | 1980-01-24 | 1981-08-19 | Nobuyuki Koura | A /fes2 secondary battery having an organic electrolyte |
-
1985
- 1985-09-20 JP JP60208144A patent/JPH0613758B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6270592A (en) | 1987-04-01 |
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