JPH028445B2 - - Google Patents

Info

Publication number

JPH028445B2

JPH028445B2 JP56058072A JP5807281A JPH028445B2 JP H028445 B2 JPH028445 B2 JP H028445B2 JP 56058072 A JP56058072 A JP 56058072A JP 5807281 A JP5807281 A JP 5807281A JP H028445 B2 JPH028445 B2 JP H028445B2

Authority

JP

Japan

Prior art keywords

dielectric ceramic

ceramic layer

electrode

electrodes

sheet

Prior art date

1981-04-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• 239000000919 ceramic Substances 0.000 claims description 65
• 239000003990 capacitor Substances 0.000 claims description 40
• 239000002131 composite material Substances 0.000 claims description 28
• 229910052573 porcelain Inorganic materials 0.000 claims description 19
• 238000000034 method Methods 0.000 claims description 13
• 238000004519 manufacturing process Methods 0.000 claims description 12
• 238000007639 printing Methods 0.000 claims description 9
• 238000010304 firing Methods 0.000 claims description 7
• 238000010030 laminating Methods 0.000 claims description 3
• 239000000758 substrate Substances 0.000 description 11
• 238000007650 screen-printing Methods 0.000 description 4
• 238000007606 doctor blade method Methods 0.000 description 3
• KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
• 239000000956 alloy Substances 0.000 description 2
• 229910045601 alloy Inorganic materials 0.000 description 2
• 238000000576 coating method Methods 0.000 description 2
• 230000007423 decrease Effects 0.000 description 2
• 238000010586 diagram Methods 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 238000004806 packaging method and process Methods 0.000 description 2
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 238000005452 bending Methods 0.000 description 1
• 238000001035 drying Methods 0.000 description 1
• 239000007772 electrode material Substances 0.000 description 1
• 238000003475 lamination Methods 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 229910052763 palladium Inorganic materials 0.000 description 1
• 229910052697 platinum Inorganic materials 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 230000002265 prevention Effects 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 230000035939 shock Effects 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 238000009751 slip forming Methods 0.000 description 1

Cited By (1)