JPH0284392U - - Google Patents

Info

Publication number
JPH0284392U
JPH0284392U JP1988164874U JP16487488U JPH0284392U JP H0284392 U JPH0284392 U JP H0284392U JP 1988164874 U JP1988164874 U JP 1988164874U JP 16487488 U JP16487488 U JP 16487488U JP H0284392 U JPH0284392 U JP H0284392U
Authority
JP
Japan
Prior art keywords
heat sink
refrigerant
flow
guide plate
cool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988164874U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0727677Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988164874U priority Critical patent/JPH0727677Y2/ja
Publication of JPH0284392U publication Critical patent/JPH0284392U/ja
Application granted granted Critical
Publication of JPH0727677Y2 publication Critical patent/JPH0727677Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988164874U 1988-12-20 1988-12-20 ヒートシンクの冷媒流案内機構 Expired - Lifetime JPH0727677Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988164874U JPH0727677Y2 (ja) 1988-12-20 1988-12-20 ヒートシンクの冷媒流案内機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988164874U JPH0727677Y2 (ja) 1988-12-20 1988-12-20 ヒートシンクの冷媒流案内機構

Publications (2)

Publication Number Publication Date
JPH0284392U true JPH0284392U (enrdf_load_stackoverflow) 1990-06-29
JPH0727677Y2 JPH0727677Y2 (ja) 1995-06-21

Family

ID=31450853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988164874U Expired - Lifetime JPH0727677Y2 (ja) 1988-12-20 1988-12-20 ヒートシンクの冷媒流案内機構

Country Status (1)

Country Link
JP (1) JPH0727677Y2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010263142A (ja) * 2009-05-11 2010-11-18 Hitachi Ltd ヒートシンク、ヒートシンクカバー、電子モジュール、電子基板および電子装置
JP2018011008A (ja) * 2016-07-15 2018-01-18 本田技研工業株式会社 電子装置用保護カバー
JP2018163915A (ja) * 2017-03-24 2018-10-18 ファナック株式会社 ヒートシンクおよびモータ駆動装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60179048U (ja) * 1984-05-10 1985-11-28 矢崎総業株式会社 送風機用スイツチング装置
JPH0252491U (enrdf_load_stackoverflow) * 1988-10-11 1990-04-16

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60179048U (ja) * 1984-05-10 1985-11-28 矢崎総業株式会社 送風機用スイツチング装置
JPH0252491U (enrdf_load_stackoverflow) * 1988-10-11 1990-04-16

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010263142A (ja) * 2009-05-11 2010-11-18 Hitachi Ltd ヒートシンク、ヒートシンクカバー、電子モジュール、電子基板および電子装置
JP2018011008A (ja) * 2016-07-15 2018-01-18 本田技研工業株式会社 電子装置用保護カバー
US10149397B2 (en) 2016-07-15 2018-12-04 Honda Motor Co., Ltd. Protecting cover and electronic device assembly
JP2018163915A (ja) * 2017-03-24 2018-10-18 ファナック株式会社 ヒートシンクおよびモータ駆動装置

Also Published As

Publication number Publication date
JPH0727677Y2 (ja) 1995-06-21

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