JPH0284335U - - Google Patents

Info

Publication number
JPH0284335U
JPH0284335U JP1988165403U JP16540388U JPH0284335U JP H0284335 U JPH0284335 U JP H0284335U JP 1988165403 U JP1988165403 U JP 1988165403U JP 16540388 U JP16540388 U JP 16540388U JP H0284335 U JPH0284335 U JP H0284335U
Authority
JP
Japan
Prior art keywords
surface mount
package
accommodating
mount package
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988165403U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988165403U priority Critical patent/JPH0284335U/ja
Publication of JPH0284335U publication Critical patent/JPH0284335U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/754

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1988165403U 1988-12-20 1988-12-20 Pending JPH0284335U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988165403U JPH0284335U (cg-RX-API-DMAC10.html) 1988-12-20 1988-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988165403U JPH0284335U (cg-RX-API-DMAC10.html) 1988-12-20 1988-12-20

Publications (1)

Publication Number Publication Date
JPH0284335U true JPH0284335U (cg-RX-API-DMAC10.html) 1990-06-29

Family

ID=31451858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988165403U Pending JPH0284335U (cg-RX-API-DMAC10.html) 1988-12-20 1988-12-20

Country Status (1)

Country Link
JP (1) JPH0284335U (cg-RX-API-DMAC10.html)

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