JPH02827A - Production of transparent substrate having transparent conductive pattern separated by light shieldable insulating film and surface colored body - Google Patents

Abstract

PURPOSE:To obtain high-accuracy and dense light shieldable insulating films by selectively curing a curable resin by exposing of a transparent substrate from the rear surface thereof with light shieldable inorg. film patterns as a mask, removing the uncured part of the curable resin, forming the light shieldable insulating film and stripping the light shieldable inorg. film patterns on transparent conductive patterns. CONSTITUTION:After the pigment-contg. photosetting resin coated film 4 is precured, said film is irradiated with UV rays 5 from the rear surface of the substrate 1. Since the light shieldable inorg. film patterns 3a exist on the transparent conductive patterns 2a, the parts of the photosetting resin coated film 4 thereon are not exposed and remain uncured so that only the parts of the coated film 4 in the spacings between the patterns 2a are sharply exposed. The entire part of the substrate after the exposing is subjected to a cleansing treatment (baking) and the light shieldable insulating film 4a is formed thereon. The entire part of the substrate is then immersed in concd. nitric acid to strip the patterns 3a and thereafter, the substrate is cleaned. The light shieldable inorg. film films 4a having good accuracy are formed in the spacings between the patterns 2a on the substrate 1 in this way.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing a transparent substrate having transparent conductive patterns separated by a light-shielding insulating film, and a method for manufacturing a colored surface body using this method. It is.

[Prior art and its problems] As a conventional method for manufacturing surface colored bodies used for color filters of display elements and solid-state image pickup devices, a method using a polymer electrodeposition method is disclosed in JP-A-59-115886. has been done. In this conventional method, after forming a transparent conductive pattern on a transparent substrate, the substrate having the obtained transparent conductive pattern is immersed in a dye-containing polymer electrodeposition bath, and the transparent conductive pattern is used as an electrode and a counter electrode. A colored layer is formed on a transparent conductive pattern by applying a voltage between the two electrodes.The electrodeposition conditions can be varied over a wide range, making it extremely versatile and convenient. .

By the way, in color filters that require high resolution, the areas of the blue, green, and red colored layers are extremely small, so the light that passes through the vicinity of the boundaries between the colored layers may partially overlap, reducing the color resolution. There is also a surface colored body described in the above-mentioned Japanese Patent Application Laid-Open No. 59-115886,
No means have been taken to prevent this decrease in color resolution, and when applied to color filters, the decrease in color resolution is unavoidable.

Therefore, the spaces between the colored layers constituting the surface colored body are filled with a light-shielding insulating film that blocks unnecessary light. Possible methods for forming such a light-shielding insulating film include printing methods such as silk screen method or offset method, and photolithography method. The gap can only be formed with rough precision of about 100 μm, and it cannot be applied to the formation of a light-shielding insulating film in a high-resolution color filter.

Further, as a method using photolithography, for example, there is a method described in Japanese Patent Application Laid-Open No. 62-247331. This method involves forming three colored layers of blue, green, and red on a transparent conductive pattern by polymer electrodeposition, applying a pigment-containing photocurable resin, and then applying the colored layer to a light-shielding layer. Functioning as a film, only the gap between the transparent conductive patterns is exposed to light from the back side of the transparent substrate, and after the photocurable resin in this gap is cured, it is not exposed to light by the light-shielding film,
The uncured photocurable resin portion is removed to form a light-shielding insulating film made of a pigment-containing cured resin in the gap between the transparent conductive patterns.

However, in the method described in JP-A-62-2473315, the colored layer on the transparent conductive pattern, which functions as a color filter in the final product, also has the function of a light-shielding film; If the amount of UV irradiation during back exposure of the transparent substrate is strong, such as 75 J/-, the photocurable resin portion on the colored layer will cause an undesirable photocuring reaction, which can be prevented. If the amount of ultraviolet irradiation is reduced to 50 J/-, for example, the photocurable resin portion on the colored layer will not be photocured, but the photocurable resin portion in the gap between the transparent conductive patterns, which is the target, will not be photocured. There is a drawback that the curing of the insulating film becomes insufficient and a dense light-shielding insulating film cannot be obtained between the pattern gaps, and the exposure conditions must be strictly controlled in order to form the desired dense light-shielding insulating film. Ta.

Therefore, the first object of the present invention is to provide a transparent substrate with a transparent conductive pattern, which has excellent accuracy in shape, size, etc., and has a dense light-shielding insulating film, for separating a predetermined pattern of the transparent substrate with a transparent conductive pattern. The purpose is to provide a method for manufacturing.

A second object of the present invention is to have a transparent conductive patterned transparent substrate having a dense light-shielding insulating film with excellent precision in shape, size, etc., for separating a predetermined pattern of the transparent conductive patterned transparent substrate; The object of the present invention is to provide a method for manufacturing a surface colored body having a dense colored layer with excellent accuracy in shape, size, etc., on a pattern.

[Means for Solving the Problems] The first object of the present invention is to provide a method for manufacturing a transparent substrate having transparent conductive patterns separated by a light-shielding insulating film, (I) having a light-shielding insulating film thereon; Step of forming a transparent conductive pattern having an inorganic film pattern on a transparent substrate, (II)
a step of applying a curable resin containing pigment and/or dye on the transparent substrate; (III) a step of exposing the transparent substrate to light from the back side and selectively curing the curable resin using the light-shielding inorganic film pattern as a mask; , (IV) a step of removing the uncured portion of the curable resin to form a light-shielding insulating film made of a colored curable resin, (V
) The step of peeling off the light-shielding inorganic film pattern on the transparent conductive pattern was achieved by a method characterized by sequentially performing the following steps.

Further, the second object of the present invention described above is the steps (I) to (
This was achieved by a method for manufacturing a colored surface body, characterized in that after carrying out step (V) in sequence, (VI) a step of forming a colored layer on the transparent conductive pattern is carried out.

First, a method for manufacturing a transparent substrate having transparent conductive patterns separated by a light-shielding insulating film, which includes steps (I) to (V), will be described.

Step (I) is a step of forming a transparent conductive pattern having a light-shielding inorganic film pattern on a transparent substrate.

Examples of the transparent substrate used in the present invention include glass substrates such as aluminoborosilicate glass, aluminosilicate glass, borosilicate glass, soda lime glass, and quartz glass, and plastic substrates such as acrylic resin and polycarbonate. Other materials such as ceramics and sapphire may also be used. Examples of the transparent substrate include those in which a transparent thin film of silicon dioxide or the like is formed on the surface of a glass substrate or the like.

For example, the transparent conductive pattern with a light-shielding inorganic film pattern can be formed on the transparent substrate using the following methods (^) and (B).
etc.

A step (a1) of forming a transparent conductive pattern on a transparent substrate by a predetermined pattern forming means (for example, photolithography method, etc.); and on the transparent conductive pattern formed in step (a1), A step (a2) of forming a light-shielding inorganic film pattern by a predetermined film forming method (for example, electroplating method, electroless plating method, etc.).

After forming a transparent conductive film on a transparent substrate, a light-shielding inorganic film that is resistant to etching means for the transparent conductive film is formed on the transparent conductive film, and then the light-shielding inorganic film is a step (b1) of forming a resist film on the organic inorganic film; and after selectively exposing and developing the resist film formed in step (b1) to form a resist pattern, the resist pattern is used as a mask to provide the light-shielding property. A step of etching the inorganic film using the etching means to form a light-shielding inorganic film pattern, and then using the light-shielding inorganic film pattern as a mask, etching the transparent conductive film using the etching means to form a transparent conductive pattern. (b2) and (b2).

First, the formation of a transparent conductive pattern with a light-shielding inorganic film pattern on a transparent substrate by method (A) will be described.

According to this method (A), first, in step (a1), a transparent conductive pattern made of, for example, an ITO film (indium tin oxide film) or a NESA film (tin oxide film doped with antimony if necessary) is It is formed on a transparent substrate using a pattern forming means, such as photolithography, but since this step (a1) is well known to those skilled in the art, a detailed description thereof will be omitted here.

Next, step (a2) will be explained. As the material of the light-shielding inorganic film pattern provided on the transparent conductive pattern, any kind of metal may be used as long as it has light-shielding properties, such as nickel, Examples include silver, gold, copper, chromium, cobalt, and platinum. The thickness of the light-shielding inorganic film pattern may be any thickness sufficient to function as a light-shielding film, and is, for example, 500 to 10,000 μm. These light-shielding inorganic film patterns are formed by a predetermined film forming method such as an electroplating method or an electroless plating method.

After this light-shielding inorganic film pattern has fulfilled its purpose,
It is preferable to use a material that can be easily peeled off in step (V) described below. A particularly preferred light-shielding inorganic film pattern is a nickel plating film pattern formed by electroless plating. The formation of the nickel plating film pattern by this electroless plating method will be described in more detail below. That is, after coating the entire surface of a transparent substrate with a transparent conductive pattern with photoresist, the resist only on the upper part of the transparent conductive pattern is removed by photolithography, and then the exposed surface of the transparent conductive pattern is activated. After pretreatment such as catalyst addition and catalyst activation, electroless nickel plating is performed using a conventional method, and the nickel deposited on the remaining resist is peeled off along with the resist, and nickel is deposited only on the transparent conductive pattern. A nickel plating film pattern is formed on the plating film. Further, the formation of this nickel plating film pattern may be performed by a normal electroless plating method, omitting the photolithography method including the photoresist coating step described above.

In addition, to form a light-shielding inorganic film pattern on the transparent conductive pattern, as described above, the resist only on the upper part of the transparent conductive pattern is peeled off using the photolithography method.
Next, after forming a light-shielding inorganic film such as chromium on the entire surface by sputtering method, vacuum evaporation method, etc., the light-shielding inorganic film remaining on the resist may be peeled off together with the resist film.

The obtained light-shielding inorganic film pattern such as a nickel plating film has superior light-shielding properties compared to colored films containing pigments and dyes that have been conventionally used as light-shielding films, so it is used in step (II) described below. Step of applying curable resin (III)
In the exposure process, it suppresses the transmission of light such as ultraviolet rays,
It has the advantage of significantly preventing the curing of the curable resin present thereon.

Next, the formation of a transparent conductive pattern with a light-shielding inorganic film pattern on a transparent substrate by method (8) will be described.

According to this method (8), first in step (b1),
After forming a transparent conductive film made of, for example, an ITO film or a NESA film on a transparent substrate, a light-shielding inorganic film that is resistant to etching means for the transparent conductive film is formed on the transparent conductive film. After that, a resist film is formed on the light-shielding inorganic film.

The light-shielding inorganic film formed on the transparent conductive film may include metals such as titanium, chromium, tantalum, tungsten, and molybdenum, semimetals such as silicon and boron, nonmetals such as carbon, or nitrides thereof. , oxides, carbides, borides, silicides, etc., or a mixture thereof. Furthermore, a thin film made of ceramics may be used. That is, as the composition of the light-shielding inorganic film, any composition can be used as long as it is resistant to etching means for transparent conductive films. Here, "having resistance to the etching means of the transparent conductive film" means not only that the light-shielding inorganic film is not etched by the etching means of the transparent conductive film, but also that the light-shielding inorganic film is more resistant than the transparent conductive film. It also means that it is difficult to be etched.

Further, as the light-shielding inorganic film, it is preferable to use one that has good adhesion to the transparent conductive film and good adhesion to the resist film. As a method for forming the light-shielding inorganic film, a sputtering method, a CVD method, an ion blating method, a vacuum evaporation method, etc. can be adopted. In this case, the thickness of the light-shielding inorganic film is desired to be thick enough to uniformly cover the transparent conductive film and to have light-shielding properties during back exposure in step (III) described below. Recommended film thickness.

The light-shielding inorganic film may be a multilayer film of two or more layers, and in this case, it is sufficient that only the side adjacent to the transparent conductive film has good adhesion to the transparent conductive film, and the resist film has good adhesion to the transparent conductive film. The adjacent side preferably has good adhesion to the resist film.

As the resist film formed on the light-shielding inorganic film, a positive photoresist film 1, a negative photoresist film, and positive and negative electron beam resist films may be used. As a method for forming the resist film, a spin code method, a spray coating method, a roll coating method, etc. can be adopted. In addition,
In the case of an electron beam resist film, an electron beam exposure method may be employed to form a resist pattern.

According to method (B), in step (b2), the resist film is selectively exposed and developed to form a resist pattern, and then the light-shielding inorganic film is etched using the resist pattern as a mask. A light-shielding inorganic film pattern is formed by etching, and then, using the light-shielding inorganic film pattern as a mask, the transparent conductive film is etched by the etching means to form a transparent conductive pattern.

In this step (b2), the etching of the light-shielding inorganic film using the resist pattern as a mask and the etching of the transparent conductive film using the light-shielding inorganic film pattern obtained by this etching as a mask are performed using a wet etching method using an etching solution. Alternatively, dry etching methods such as plasma etching, sputter etching, and reactive ion etching may be used.

Furthermore, when etching the light-shielding inorganic film and etching the transparent conductive film in two steps using the wet method or dry method described above, the transparent conductive film may be partially etched in the first etching step of the light-shielding inorganic film. I don't mind.

Furthermore, after forming a light-shielding inorganic film pattern using the resist pattern as a mask, a transparent conductive film pattern may be formed using the light-shielding inorganic film pattern as a mask, and then the resist pattern may be peeled off. After forming the film pattern, the resist pattern may be peeled off and a transparent conductive film pattern may be formed using only the light-shielding inorganic film pattern as a mask.

According to this method (8), in step (bl>), the light-shielding inorganic film provided between the transparent conductive film and the resist film has resistance to the etching means of the transparent conductive film, so that In step (b2), when forming a transparent conductive pattern by etching the transparent conductive film using the etching means using the light-shielding inorganic film pattern formed using the resist pattern as a mask, the light-shielding inorganic film is The pattern has superior adhesion to the transparent conductive film compared to a resist pattern made of organic matter, and protects the underlying transparent conductive film that should not be etched from the etching means.Therefore, the transparent conductive pattern This method has the advantage that it is possible to obtain a transparent conductive pattern having a light-shielding inorganic film pattern that is prevented from being etched and has excellent dimensional accuracy.

The transparent conductive pattern includes a stripe pattern in which a plurality of pattern elements are arranged in a stripe pattern, as well as a pixel pattern and a lead pattern, and the pixel pattern is arranged in a triangle shape or a mosaic shape through the lead pattern. There is a triangular pattern or a mosaic pattern.

In this triangle pattern or mosaic pattern, a colored layer is formed only on the pixel pattern, and a light-shielding insulating film is formed on the region other than the pixel pattern, including the lead pattern, so in step (I), the light-shielding layer is formed only on the pixel pattern. It is necessary to form an organic inorganic film pattern, and this can be done, for example, by the following methods (c) and (D).

The method includes a step (c1) of forming a transparent conductive pattern consisting of a pixel pattern and a lead pattern on a transparent substrate by a predetermined pattern forming means (for example, photolithography method, etc.); After forming a resist film on a transparent substrate with a transparent conductive pattern, the resist film is selectively exposed and developed to form a resist pattern in an area including a lead pattern other than the pixel pattern (c
2) and a predetermined film forming method (for example, method (A)) on the pixel pattern in the gap between the resist patterns formed in step (c2).
Step (c) of forming a light-shielding inorganic film pattern using the electroplating method or electroless plating method used in step (a2)
3) and .

After forming a transparent conductive film on a transparent substrate, a light-shielding inorganic film that is resistant to etching means for the transparent conductive film is formed on the transparent conductive film, and then Step (d1) of forming a resist film on the light-shielding inorganic film; After selectively exposing and developing the resist film formed in step (d1) to form a resist pattern, using the resist pattern as a mask, the light-shielding etching the transparent conductive film using the etching means to form a light-shielding inorganic film pattern; then using the light-shielding inorganic film pattern as a mask, etching the transparent conductive film using the etching means;
A step (d2) of forming a transparent conductive pattern consisting of a pixel pattern and a lead pattern, and a resist on the transparent substrate with the transparent conductive pattern formed in step (d2) and having a light-shielding inorganic film pattern thereon. After forming the film, the resist film is selectively exposed and developed to form a resist pattern on the portion other than the lead pattern having the light-shielding inorganic film pattern, and then the exposed light-shielding on the lead pattern is The method includes a step (d3) of sequentially removing the inorganic film pattern and the resist pattern.

Note that the shape of the light-shielding inorganic film pattern formed on the transparent conductive pattern ((a) stripe pattern, (b) triangle pattern, or pixel pattern in a mosaic pattern) must be the same as the shape of the transparent conductive pattern. It may also be smaller than the shape of the transparent conductive pattern. In the latter case, steps (II) to (V
), a light-shielding insulating film in which colored cured resin is partially present also on the transparent conductive pattern is formed, and further, in step (VI) described later, a colored layer smaller than the shape of the transparent conductive pattern is formed. .

Further, the light-shielding inorganic film pattern formed on the transparent conductive pattern, for example, the stripe pattern, may be arranged in a predetermined shape (for example, rectangular shape) at a predetermined interval on the stripe pattern. In this case, a light-shielding insulating film is also formed on the stripe pattern in the steps (TI) to (V) described later, and a light-shielding insulating film is formed on the stripe pattern in a predetermined shape (for example, rectangular shape) at a predetermined interval in the step (vr) described later. A colored layer is formed.

Next, step (II) of the present invention is a step of applying a pigment- and/or dye-containing curable resin onto a transparent substrate.

As the curable resin used in step (II), a so-called ultraviolet curable material that undergoes a curing reaction with light in the ultraviolet region is preferred because it is easy to use. The main components of such materials include acrylic, urethane, epoxy,
Synthetic rubber-based, polyvinyl alcohol-based, polyvinyl cinnamate-based resins, etc., as well as those made of a combination of reduced rubber (cisisoprene) and allyl diazide crosslinking agents,
There are gelatins, each of which can be used alone or in combination. These are commercially available as photocurable paints or negative resists, and OMR-85 manufactured by Tokyo Ohka Co., Ltd. is a typical example of a commercially available product. In order to further improve the photocurability and other physical properties of these resins, a reactive diluent, photoinitiator, photoenhancement agent, etc. can be added as appropriate.

The curable resin contains a pigment and/or dye as an essential component in order to make the thin film separating the transparent conductive patterns into a light-shielding insulating film. Examples of pigments include carbon black, iron oxide, titanium white, phthalocyanine pigments, threne pigments, aniline black, etc. Examples of dyes include azo, anthraquinone, indigoid, benzoquinone, and naphthoquinone. dyes, naphthalimide dyes, methine dyes, quinoline dyes, nitro dyes, nitroso dyes, phthalocyanine dyes, carbonium dyes, quinoimine dyes, perinone dyes, and sulfide dyes. Note that a colorless dye that produces a colored product by reaction with a color developer may be used, but when a colorless dye is used, a color developer is used in combination, and after exposure in step (III) described below, an appropriate colorant is used. It is necessary to heat the product in time to form a colored product. However, when a colorless dye is used, the curable resin mixture is colorless and has good translucency during exposure in step (III), so there is an advantage that exposure can be performed with a low amount of ultraviolet irradiation. This colorless dye is
In principle, all coloring agents used in heat-sensitive recording materials can be used, examples of which include lactone-based, triphenylmethane-based, fluoran-based, rhodamine-lactam-based, fluorene-based, and spiropyran-based compounds. Commercial products of this colorless dye include PSD-150 (Shin Nisso Kako Co., Ltd.) and TH-107 (Hodogaya Chemical Co., Ltd.).
, S-205 (Yamada Chemical Co., Ltd.), DEOC (Yamada Chemical Co., Ltd.), etc. Also, as a color developer that reacts with the above-mentioned colorless dye by heating, it is used as a color developer in heat-sensitive recording materials. In principle, you can use all of the
Examples include bisphenol A, bisphenol S, benzyl-p-hydroxybenzoate, and the like.

The pigment and/or dye-containing curable resin is applied onto the transparent substrate by a printing method such as a screen method or an offset method, a roll coating method, a dip method, a spin code method, or the like. In addition, hydrocarbons, alcohols, esters, ketones,
Applicability may be improved by adding a diluent such as ethyl cellosolve to lower the viscosity.

Further, after coating, the curable resin may be precured in order to impart a certain degree of strength to the coating film, improve adhesion to the transparent substrate, and, if a diluent is used, to volatilize the diluent. Precuring conditions are, for example, 50 to 120°C.
It takes about 10 to 60 minutes.

Note that an electron beam curable resin may be used instead of a photocurable resin.

Next, step (III) of the present invention is a step of exposing the transparent substrate from the back side, that is, the side of the substrate that does not have a transparent conductive pattern.

Through this process, a light-shielding inorganic film pattern (OD (optical density) of 1.5 or more is desirable) on a transparent conductive pattern is formed.
The curable resin present on the surface is not exposed to light and is therefore not cured, and the curable resin in other areas is exposed to light and cured. Since this light-shielding inorganic film pattern has excellent light-shielding properties, it has the advantage that the hardened portion and uncured portion of the curable resin are sharply formed by back exposure.

When a photocurable resin is used as the curable resin and colored pigments or dyes are added to it, the amount of ultraviolet irradiation is 50 to 10
Although 0 J/cd is preferable, other ultraviolet irradiation amounts may be used depending on the case. Further, when a colorless dye and a color developer are added to the same type of resin, the amount of ultraviolet irradiation may be 10 to 200 mJ/-. According to this method,
As mentioned above, since the light-shielding inorganic film pattern has excellent light-shielding properties, the curable resin on the light-shielding inorganic film pattern does not harden, and the curable resin in other areas hardens to the desired thickness. There is also the advantage that the exposure conditions can be easily controlled because it is sufficient to apply the necessary amount of ultraviolet irradiation.

Next, step (IV) of the present invention is a step of removing the uncured portion of the curable resin.

The uncured portion of the curable resin is removed by using a chemical having an appropriate dissolving power (hereinafter referred to as a developer). Various developers are selected depending on the type of curable resin applied in step (II), but usually an alkaline aqueous solution such as caustic soda or sodium carbonate, or an ester, ketone, alcohol, aromatic hydrocarbon, or aliphatic carbon. Organic solvents such as hydrogen and chlorinated hydrocarbons are appropriately selected and used. This removal treatment may be carried out for about 10 seconds to 5 minutes by immersion or showering, or may be carried out while applying ultrasonic waves. This process (IV
), the uncured portion of the curable resin is removed, and the colored cured resin remains at a predetermined thickness in the cured portion, which becomes a light-shielding insulating film.

According to this method, as described above, the cured portion and uncured portion of the curable resin are sharply formed by exposure, so that a light-shielding insulating film that clearly separates a predetermined transparent conductive pattern is formed. There is an advantage that no hardened resin is formed on the light-shielding inorganic film pattern.

After this uncured resin removal treatment, a normal cleaning treatment using water, an organic solvent, etc. is performed. Also, after this cleaning process,
A post-cure treatment (also called baking) is commonly performed. In addition, when a colorless dye is used as the dye added to the curable resin and used in combination with a color developer, the colorless dye and color developer react with each other during post-curing to produce a colored product, and at this stage light-shielding properties are obtained. will be granted. Post-curing conditions depend on the type of resin, but are usually 150 to 250°C for 30 minutes to 2 hours.

Next, step (V) of the present invention includes, after the above-mentioned step (IV),
This is the step of peeling off the light-shielding inorganic film pattern on the transparent conductive pattern, which has completed its purpose.

Usually, this peeling treatment is performed by a wet method using a chemical solution that dissolves each light-shielding inorganic film pattern. In the case of nickel films, this is done using concentrated nitric acid or a mixed solution of concentrated hydrochloric acid, concentrated nitric acid, and water (molar concentration ratio 1/1/3), and this is usually followed by an aqueous alkaline solution, water, isopropyl alcohol, CFC, etc. in this order. The cleaning process used in

The product obtained in this way has excellent precision in shape and size, and has a dense light-shielding insulating film that clearly separates the transparent conductive pattern on the transparent substrate.
It is preferably used as a transparent electrode substrate with a light-shielding film.

Next, the method for producing a surface colored body of the present invention includes steps (I) to
After sequentially carrying out (V), for the above-mentioned product obtained,
Further, as step (VI), a step of forming a colored layer on the transparent conductive pattern is performed.

Methods for forming the colored layer in this step (V1) include offset printing, silk screen printing, photolithography, and polymer electrodeposition. Electrodeposition is useful because it allows a colored layer to be faithfully and precisely formed on a transparent conductive pattern. This polymer electrodeposition method is most commonly known as electrodeposition coating, and is a well-known method. This electrodeposition coating includes anionic electrodeposition coating and cationic electrodeposition coating, and either method can be used.

Examples of materials that can be used for the colored layer include maleated oil-based, acrylic-based, polyester-based, polybutadiene-based, and polyolefin-based resin materials. These resin materials may be used alone or in combination.

When the colored layer formed in this step (vi) is a thin film that functions as a color filter, for example, red,
Three types of pigments, green and blue, are used, and polymer electrodeposition layers containing each of these three types of pigments are regularly formed in the order of red, green, and blue. As such pigments, red pigments, azo red pigments, quinacridone red pigments, perylene red pigments, phthalocyanine green pigments, phthalocyanine blue pigments, etc. can be used. In addition to forming a colored layer of three colors using three types of pigments as described above, it may be colored in a single color, or it may be colored by selecting various combinations of two or more colors.

As mentioned above, by sequentially performing steps (I) to (V), a dense light-shielding insulating film with excellent shape, dimension, etc. accuracy is formed, so step (VI) is further performed. Therefore, the gap between the light-shielding insulating films also has a shape,
This method has the advantage that it is possible to produce a surface-colored body with excellent dimensional accuracy and a dense colored layer.

[Example] The present invention will be explained in more detail with reference to Examples below.

Example 1 (1) In FIG. 1, an aluminoborosilicate glass substrate whose surface has been polished is used as the transparent substrate 1, and 100% of
A striped transparent conductive pattern 2a made of ITO with a thickness of 0.00 mm was formed.

Next, a photoresist (for example, A2 manufactured by Hoechst) is applied so that the transparent conductive pattern 2a is completely covered on the transparent substrate 1.
1350) on the entire surface and baked at 90° C. for 30 minutes, the photoresist only on the upper part of the transparent conductive pattern 2a is peeled off by a normal photolithography method, and then the surface of the transparent conductive pattern 2a is activated and a catalyst is applied. After normal pretreatment such as catalyst activation, a normal electroless nickel plating process is performed, and then the nickel deposited on the remaining photoresist is peeled off along with the resist, leaving only the transparent conductive pattern 2a. The first method was performed without forming the light-shielding inorganic film pattern 3a (film thickness: 500 mm) made of nickel.
(See figure (a)).

(2) Next, 20 parts by weight of a pigment mixture obtained by mixing 15 parts by weight of iron oxide and 5 parts by weight of a phthalocyanine pigment were added to a photocurable acrylic resin (Tokyo Ohka Co., Ltd.) as a curable resin.
80 parts by weight of OMR-85) and 5 PHR of Irgacure 181 (Ciba Geigy) as a curing initiator.
After the addition, the resulting resin mixture is applied onto the substrate 1 by screen printing to form a pigment-containing photocurable resin coating 4 having a thickness of 4 to 6 μm (see FIG. 1(b)).

(3) Next, apply a pigment-containing photocurable resin coating 4 of 50 to 1
After precuring for 30 minutes at 20°C, 50 to 10
Ultraviolet 5 was irradiated with an ultraviolet irradiation amount of 0 J/- using an ultraviolet exposure device ASE-20 manufactured by Nippon Battery Co., Ltd. (1st
(See Figure (c)) As mentioned above, since the light-shielding inorganic film pattern 3a exists on the transparent conductive pattern 2a, the photocurable resin coating 4 on it is not exposed at all and remains uncured. Only the portions of the photocurable resin coating 4 in the gaps between the transparent conductive patterns 2a were sharply exposed, forming a cured coating with a thickness of 1.6 μm (Fig. 1(c)).
, the smudging part of the coating film 4 replaces the cured coating part,
The other parts indicate uncured coating parts).

(4) After exposure, the entire substrate is immersed in a developer at 25°C (Tsurupez 100 manufactured by Esso) and developed for 2 to 3 minutes while applying 40HH2 ultrasonic waves. A cleaning treatment was carried out under the same conditions as the development treatment described above, followed by post-curing (baking) at 200° C. for 60 minutes to form a light-shielding insulating film 4a made of a black cured resin (see FIG. 1(d)). Note that transparent conductive pattern 2
No hardened portion of the resin was observed on the light-shielding inorganic film pattern 3a above a.

(5) Next, the entire substrate is immersed in concentrated nitric acid to peel off the light-shielding inorganic film pattern 3a, and then the substrate 1 is cleaned using an alkaline aqueous solution, water, isopropyl alcohol, and CFC in this order as cleaning liquids. transparent conductive pattern 2
A product having a light-shielding insulating film 4a made of a black cured resin with a thickness of 1.6 μm in the gap a was obtained (see FIG. 1(e)).
.

This light-shielding insulating film 4a not only has a light-shielding property, but also
The product obtained in this example was able to be used as a highly accurate transparent electrode substrate with a light-shielding insulating film because it had excellent precision in shape, size, etc., and was dense.

Example 2 Transparent conductive pattern 2 on substrate 1 obtained in Example 1
In the gap a, a product having a light-shielding insulating film 4a made of a black cured resin was subjected to polymer electrodeposition coating to form a colored layer on the transparent conductive pattern 2a.

The following three types of electrodeposition solutions were used.

(The following is a blank space) Formation of the colored layer involves first forming a blue colored layer 6b using an electrodeposition solution (A-1>, then forming a green colored layer 6g using an electrodeposition solution (A-2>), Finally, the electrodeposition solution (A-
3) to form a red colored layer 6r, colored layers 6b, 6g, and 6r were formed on the transparent conductive pattern 2 (see FIG. 1(f)). In each step, the applied voltage was about 40 V and the application time was 10 seconds. After each step, the sample was washed with pure water and then dried at 80° C. for 10 minutes.

As described in Example 1, since the light-shielding insulating film 4a has excellent precision in shape, dimensions, etc., this light-shielding insulating film 4a
Colored layer 6b formed in the gap.

6g and 6r also had excellent accuracy in shape, size, etc. The colored layers formed on the transparent conductive pattern 2a include a blue colored layer 6b, a green colored layer 6g, and a red colored layer 6.
Since they were regularly arranged in the order of r, they were effective as thin films for color filters.

Therefore, the product obtained in this example has a three-color colored layer with high precision on the transparent conductive pattern, and a black light-shielding insulating film with high precision between the transparent conductive patterns, so it has light-shielding properties. It could be suitably used as a color filter with an insulating film.

Example 3 (1) In FIG. 2, an aluminoborosilicate glass substrate whose surface has been precisely polished is used as the transparent substrate 1, and ITO with a thickness of 1000 mm is deposited on the surface of the transparent substrate 1.
A transparent conductive film 2 consisting of indium oxide (95x1
%) and tin oxide (5% by weight) by a vacuum evaporation method using an evaporation source. Next, a light-shielding inorganic film 3 made of chromium nitride with a film thickness of 800 mm was placed on the transparent conductive film 2 in a mixed gas atmosphere of argon and nitrogen (N2 content 20% by volume, pressure 3 x 10' Torr). It was formed by direct current magnetron sputtering using a target made of thichrome. This light-shielding inorganic film 3 made of chromium nitride has resistance to etching means for the transparent conductive film 2. Furthermore, on this light-shielding inorganic film 3, a positive photoresist (
It was formed by applying AZ-1350 manufactured by Hoechst Co., Ltd. by a spin code method (see FIG. 2(a)). Thereafter, the resist film 7 was baked for 30 minutes in an atmosphere at a temperature of 90°C.

Next, the resist film 7 is selectively exposed to ultraviolet light through a photomask on which a predetermined pattern is formed, and the AZ
-1350 exclusive developer was used to form a resist pattern 7a consisting of the unexposed portion of the resist film 7 (see FIG. 2(b)).

Next, using the resist pattern 7a as a mask, add 165 g of ceric ammonium sulfate and 42 m of perchloric acid (70%).
The light-shielding film 3 was etched for 50 seconds using an etching solution (liquid temperature: 23° C.) consisting of a solution made by adding pure water to 10100 O to form a light-shielding inorganic film pattern 3a (see Fig. 2 (c). )) Next, using an etching solution that was prepared by mixing a 1:1 ferric chloride aqueous solution and 36% by weight hydrochloric acid and heating it to 50°C, a transparent conductive film was formed using the light-shielding inorganic film pattern 3a as a mask. The film 2 was etched for 66 seconds to form a transparent conductive pattern 2a (see Figure 2(d)).
)reference).

Next, the resist pattern 7a is peeled off using a resist stripping solution consisting of a 5% by weight aqueous solution of caustic soda to obtain a transparent substrate 1 having a transparent conductive pattern 2a and a light-shielding inorganic film pattern 3a in this order (FIG. 2(e)). reference).

According to this method, when forming the transparent conductive pattern 2a, the light-shielding inorganic film pattern 3a, which is resistant to the etching means of the transparent conductive film 2, is used as a mask, so that side etching of the transparent conductive film 2 is avoided. This has the advantage that a more precise transparent conductive pattern 2a can be formed by preventing this.

(2) A transparent substrate 1 having a transparent conductive pattern 2a with a light-blocking inorganic film pattern 3a obtained in (1) above
(See FIG. 1(a)), (2) to (5) of Example 1
) (see (b) to (d) in Figure 1),
A product having a light-shielding insulating film 4a made of a black cured resin in the gap between the transparent conductive patterns 2a on the transparent substrate 1 as shown in FIG. 1(e) is obtained. In the method of this example,
As described above, when forming the transparent conductive pattern 2a, since the light-shielding inorganic film pattern 3a, which is resistant to the etching means of the transparent conductive film 2, is used as a mask, side etching of the transparent conductive film 2 is prevented. Therefore, the transparent conductive pattern 2a has a more precise shape than that of Example 1.
, there is an advantage that the light-shielding insulating film 4a made of black cured resin formed in the gap also has a highly accurate shape.

Example 4 Transparent conductive pattern 2 on substrate 1 obtained in Example 3
A product having a light-shielding insulating film 4a with good dimensional accuracy in the gap a (see Fig. 1(e)) was treated with polymer electrodeposition coating in the same manner as in Example 2, and the product shown in Fig. 1(f) was obtained. Obtain a surface colored body in which a blue colored layer 6b, a green colored layer 6g, and a red colored layer 6r are regularly arranged on a transparent conductive pattern 2a as shown.

In the method of this embodiment, the colored layers 6b, 6g, and 6r are formed in the gaps of the light-shielding insulating film 4a having highly accurate shapes, so the colored layers also have excellent shape accuracy.

That is, the product obtained in this example has a highly accurate three-color colored layer 6b on a transparent conductive pattern 2a.

6g and 6r, which also had a black light-shielding insulating film with high precision in the gap between the transparent conductive patterns, could be used very suitably as a color filter with a light-shielding insulating film.

Example 5 (1) In FIG. 3, an aluminoborosilicate glass substrate whose surface has been precisely polished is used as the transparent substrate 1, and a film made of IT○ is coated thereon with a film thickness of 1.70 mm as a transparent conductive film.
Vacuum evaporated to a thickness of 0.0 mm, and then a positive photoresist (e.g. A2 manufactured by Hoechst) on top of it as a photoresist.
1350) was coated to a thickness of 10,000 wafers by a spin-coating method, and then baked at 90° C. for 30 minutes to produce a substrate having a transparent conductive film and a photoresist.

Next, the photoresist was selectively exposed to ultraviolet light using a photomask having a predetermined pattern, and then developed with a predetermined developer (e.g., AZ exclusive developer) to form a desired resist pattern. After that, post-baking at 120° C. for 30 minutes to increase the adhesion between the transparent conductive film and the resist pattern, and then sealing the resist pattern with a mask and adding 40 degrees of ferric chloride aqueous solution and 36% hydrochloric acid. Etching solution (50℃) consisting of a 1/1 mixture of
The transparent conductive film was etched to form a transparent conductive pattern corresponding to the resist pattern. The etching time at this time was 1 minute and 52 seconds, which is twice the minimum time of 56 seconds required for etching 1,700 transparent conductive films.

Next, the resist pattern is peeled off by first ultrasonic cleaning using methyl cellosolve for 10 minutes, and then ultrasonically cleaning using isopropyl alcohol for 10 minutes,
Furthermore, by drying using isopropyl alcohol vapor, a pixel pattern 2p made of a transparent conductive film is formed.
and lead pattern 2i! A transparent substrate 1 having (
(See Figure 3(a)).

(2) Next, the same photoresist (A21350 manufactured by Hoechst Co., Ltd.) used in (1) above was applied to a thickness of 10,000 mm using the same method as used in (1) above.
After baking at 90° C. for 30 minutes to improve adhesion, the resist is selectively exposed using a mask that exposes only the upper part of the pixel pattern 2p, and then a predetermined developer (AZ Developed using special developer),
Pixel pattern 2P including lead pattern 21.

A resist pattern 7a was formed in the gap 2p (see FIG. 3(b)).

Next, the exposed transparent conductive film (pixel pattern 2p) is activated using a solution containing hydrochloric acid, and Pd is activated by a dipping method.
, applying a catalyst mainly composed of a complex salt of Sn, and activating the catalyst to precipitate the catalyst metal (Pd) from the complex salt of Pd and Sn. This is done by using a strongly acidic solution containing nickel chloride or nickel sulfate and sodium hypophosphite as the reducing agent, heated to 80°C, electroless nickel plating is applied, and phosphorus and other impurities are removed. A light-shielding inorganic film pattern 3a made of nickel containing a small amount was formed on the pixel pattern 2p (see FIG. 3(c)). The film thickness of this pattern 3a was set to 1.000 mm so that the OD (optical density) was 2 or more.

Next, using methyl cellosolve, resist pattern 7a is
The upper nickel plating layer 3b was peeled off along with the resist pattern 7a, and a light-shielding inorganic film pattern 3a made of nickel was formed only on the pixel pattern 2p (see Fig. 3(d)).
)reference). Since the resist pattern 7a is previously formed in the area other than the pixel pattern 2p, the light-shielding inorganic film pattern 3a made of nickel is formed in the area other than the pixel pattern 2p.
A nickel plating layer was formed only on the top, and no nickel plating layer was observed on other parts.

(3) Next, a transparent pigment containing carbon black and iron oxide and a photocurable acrylic resin (Tokyo Ohka Co., Ltd. OMR-
85> (pigment/resin weight ratio 20/80~
40/60, preferably 35/65, and this 35/60
In the case of No. 65, the pigment bones 35 are composed of 5 carbon black and 30 iron oxide, and when carbon black and iron oxide are in this proportion, the resistance value is about 109Ω.
and has insulating properties) is applied to the entire substrate 1 so that the thickness of the part where the pixel pattern 2p and lead pattern 21 are not present is 3 μm to form a pigment-containing photocurable resin coating 4 having insulating properties. was formed (see Figure 3(e)). After baking this at 80 to 90°C for 10 minutes, the back surface of the transparent substrate 1 (the side without the pixel pattern 2p and lead pattern 21 of the substrate 1) was exposed to ultraviolet 5 with an ultraviolet irradiation amount of 75 J/-. (See Figure 3 (f))
. In this exposure, since the pattern 3a made of nickel on the pixel pattern 2p functions as a light-shielding film, the portion of the pigment-containing photocurable resin coating 4 on this pattern 3a is not exposed to light and remains uncured. Only the gap portion of pixel pattern 29.2p (including the portion with lead pattern 2β, the smudging portion in Figure 3) transmits the ultraviolet rays and is not photocured.

Next, the uncured portion of the pigment-containing photocurable resin coating film 4 on the light-shielding inorganic film pattern 3a made of nickel was coated with the special developer for photocurable acrylic resin (Tsurupez 10 manufactured by Esso).
0: solution temperature 22°C) and then scrubbed with a cleaning solution consisting of pure water, and then baked at 200°C for 60 minutes to fill the gaps between pixel patterns 2P and 2P with black cured resin. A light-shielding insulating film pattern 4a was formed (see FIG. 3 (9)). Next, the light-shielding inorganic film pattern 3a made of nickel on the pixel pattern 2p is dissolved and removed with a mixed solution of concentrated hydrochloric acid, concentrated nitric acid, and water (molar concentration ratio 1/1/2) to fill the gap between the pixel patterns 2P and 2p. A product having a light-shielding insulating film 4a was obtained (see FIG. 3(h)). In the obtained product, during the formation process, the light-shielding insulating film 4a separates the unexposed and uncured portions of the pigment-containing photocurable resin 4 from the exposed and hardened portions due to the presence of the light-shielding inorganic film pattern 3a made of nickel. Because it is sharply formed, it has excellent precision in shape, size, etc., and is dense. Therefore, the product obtained in this example could be used as a transparent electrode substrate with a light-shielding insulating film with high precision.

Example 6 The product obtained in Example 5 and having the light-shielding insulating film 4a in the gap between the pixel patterns 2p and 2p on the transparent substrate 1 was treated by polymer electrodeposition as follows to form a product on the pixel pattern 2p. The colored layer 6a is not formed on the surface (see FIG. 3(i)).
.

The formation of a colored layer by this polymer electrodeposition method will be described in more detail below.

The same three types of electrodeposition solutions (A-1), (A-2), and (A-3) used in Example 2 were used as electrodeposition solutions.

First, it was colored blue as follows. That is, as shown in FIG. 4, a transparent substrate 1 on which a transparent conductive pattern 11, 12, 13 consisting of a pixel pattern and a lead pattern is formed is immersed in an electrodeposition solution (A-1) containing phthalocyanine blue. Transparent conductive pattern 1
1 as an anode and a voltage of about 40 V was applied for 10 seconds between it and the counter electrode to form a blue colored layer 6B only on the pixel pattern in the conductive film pattern 11. After that, the blue colored layer 6B was taken out and soaked in pure water. It was washed and then dried at 80°C for 10 minutes. Note that on the lead pattern (the conductive pattern portion other than the pixel pattern where the blue colored layer 6B is formed in FIG. 4) in the conductive pattern 11, the conductive pattern shown in FIG.
As shown in h), since the light-shielding insulating film 4a is present,
No blue colored layer is formed.

Next, it was colored green as follows. That is, the transparent substrate 1 whose dorsal pattern in the conductive pattern 11 is colored blue by the blue colored layer 6B is immersed in an electrodeposition bath liquid (A-2>) containing phthalocyanine green, and the conductive pattern 12 A voltage was applied between the anode and the counter electrode under the same conditions to form the green colored layer 6G only on the pixel pattern in the conductive pattern 12, and then washed and dried in the same manner. In this green coloring process, the conductive pattern 1 that has already been colored blue
1 is dried at high temperature and becomes an electrical insulating layer, so the 4th
By bringing a conductive rubber (silver paste may be used) into contact with the substrate at the part indicated by X in the figure, it was possible to energize only the conductive pattern 12. Further, in this green coloring process, no colored layer is formed on the lead pattern in the conductive pattern 12, as in the case of the blue coloring process described above.

Furthermore, it was colored red as follows. That is, the transparent substrate 1 whose pixel patterns of the conductive patterns 11 and 12 are colored blue and green by the blue colored layer 6B and the green colored layer 6G, respectively, is coated with an electrodeposition bath liquid containing an azo red pigment ( A-3) and conductive pattern 13
A voltage was applied between the anode and the counter electrode under the same conditions to form a red colored layer 6R only on the pixel pattern in the conductive pattern 13, and then washed and dried in the same manner. In addition, in this red coloring process, the conductive patterns 11 and 12, which have already been colored blue and green, have become electrically insulating layers due to high temperature drying.
It is not possible to energize only the conductive pattern 13 by bringing the conductive rubber into contact with the portion of the substrate. In Manako's red coloring process, no colored layer is formed on the lead pattern in the conductive □ pattern 13, as in the case of the blue coloring process and green coloring process described above.

Finally, baking was performed at 200°C for 60 minutes to cause a crosslinking reaction and harden the colored layer, as shown in Figure 4.
A blue colored layer 6B is arranged on the pixel pattern of the conductive pattern 11, a green colored layer 6G is arranged on the pixel pattern of the conductive pattern 12, and a red colored layer 6R is arranged in a triangle on the pixel pattern of the conductive pattern 13. Obtain a surface colored object.

In the obtained surface colored body, the colored layers (6a in FIG. 3(i) and 6B, 6G, 6R in FIG. 4) are as follows:
Since a light-shielding insulating film 4a made of a dense black cured resin with excellent accuracy in shape, size, etc. is formed in advance on parts other than the pixel pattern where these colored layers are formed, the shape, size, etc. It was highly accurate and detailed, and no color protrusion was observed.

Moreover, since the nickel plating layer, which is the light-shielding inorganic film pattern 3a, was completely dissolved and removed prior to forming the colored layer by electrodeposition, there was no short circuit during electrodeposition due to residual nickel plating pieces. Furthermore, even if pieces of nickel plating remain due to poor dissolution, even if pieces of the light-shielding insulating film remain in the gaps between the pixel patterns, the light-shielding insulating film has already been formed in the gaps between the pixel patterns. Short circuits cannot occur during electrodeposition.

Further, as mentioned above, since no colored layer was formed on the lead pattern, the color resolution was excellent.

Example 7 (1) In FIG. 5, an aluminoborosilicate glass substrate with a precisely polished surface is used as the transparent substrate 1, and an IT film with a thickness of 1°700 mm is placed on the surface of the transparent substrate 1.
Transparent conductive M2 made of O was formed by a vacuum evaporation method using an evaporation source made of a mixture of indium oxide (95% by weight) and tin oxide (95% by weight). Next, on this transparent conductive film 2, a light-shielding inorganic film 3 made of chromium nitride with a film thickness of 800 mm is placed in a mixed gas atmosphere of argon and nitrogen (N
2 content 20% by volume, pressure 3 x 10-5 Torr)
It is formed by direct current magnetron sputtering using a target made of chromium. This light-shielding inorganic film 3 made of chromium nitride has resistance to etching means for the transparent conductive film 2. Furthermore, a resist film 7 with a film thickness of 5,000 yen was formed on this light-shielding inorganic material [3] by applying a positive photoresist (AZ-1350 manufactured by Hoechst Co., Ltd.) by a spin-coding method (Fig. 5(a)). reference).

After that, the resist film 7 was heated for 30 minutes in an atmosphere at a temperature of 90°C.
Baked.

Next, the resist film 7 is selectively exposed to ultraviolet light through a photomask on which a predetermined pattern has been formed.
Resist patterns 7a and 7b consisting of unexposed portions of the resist film 7 were formed by developing with a 1350 exclusive developer (see FIG. 5(1)).

Next, using resist patterns 7a and 7b as masks, 165 g of ceric ammonium nitrate and perchlorine i! (70%
The light-shielding inorganic film pattern 3 was formed by etching the light-shielding inorganic film 3 for 50 seconds using an etching solution (liquid temperature: 23°C) made of a solution made by adding pure water to 10100 O
a and 3b were formed (see FIG. 5(c)).

Next, a light-shielding inorganic film pattern 3a is formed using an etching solution prepared by mixing a 40° C. ferric chloride aqueous solution and 36% by weight hydrochloric acid at a ratio of 1:1 and heating the mixture to 50° C.

3b as a mask, the transparent conductive film 2 was etched to form transparent conductive patterns 2p and 21 (FIG. 5(d)).
reference). At this time, the etching time is 112 seconds, which is twice the time required for etching the transparent conductive film 2 of the above thickness to the surface of the substrate 1 (just etching time).

Next is the resist pattern? A and 7b are removed using a resist stripping solution consisting of a 5% by weight aqueous solution of caustic soda, and transparent conductive patterns 2p and 21 having light-shielding inorganic film patterns 3a and 3b on top, respectively, are formed on the surface of the transparent substrate 1. (See Figure 5(e)).

Note that pattern 2p is a pixel pattern, and pattern 2p is a pixel pattern.
ft corresponds to the lead pattern.

According to this method, when forming the pixel pattern 2P and the lead pattern 2j2, the transparent conductive Jl! Since the light-shielding inorganic film patterns 3a and 3b, which are resistant to the etching method described in 2, are used as masks, side etching of the transparent conductive film 2 is prevented, and more accurate pixel patterns 2p and lead patterns 21 are formed. It has the advantage of being

(2) Next, a film with a thickness of 5°000 is applied to the surface of the transparent substrate 1 on which the transparent conductive patterns 2p and 212 are formed.
A human resist film 8 was formed by applying a positive photoresist (AZ-1350 manufactured by Hoechst Co., Ltd.) using a spin code method (see Fig. 5(f)). Thereafter, the resist film 8 was coated in an atmosphere at a temperature of 90° C. for 30 minutes. The resist film 8 was baked.

Next, through a photomask having a pattern that exposes only the resist film above the light-shielding inorganic film pattern 3b,
The resist film 8 was selectively exposed to ultraviolet light and then developed using the same developer as described above to form a resist pattern 8a consisting of the unexposed portion of the resist film 8 (
(See Figure 5(g)). Note that the light-shielding inorganic film pattern 3a
The resist pattern 8a may be formed only on top.

Next, using the etching solution for the light-shielding inorganic film 3 described above, the light-shielding pattern 3b not covered by the resist pattern 8a was etched for 50 seconds to remove it (see FIG. 5(h)).

After that, the resist pattern 8a is peeled off using a resist stripping solution consisting of a 5% by weight aqueous solution of caustic soda, and the vixel pattern 8a having the light-shielding inorganic film pattern 3a on the upper part is removed.
A transparent substrate 1 having a lead pattern 21 and a lead pattern 21 formed on its surface was obtained (see FIG. 5(i)).

According to this method, the resist pattern 8a with excellent precision in shape, size, etc. can be formed in the portion other than the lead pattern 21 with the light-shielding inorganic film pattern 3b by photolithography, so that the etching solution for the light-shielding inorganic film 3 can be formed. This has the advantage that only the light-shielding inorganic film pattern 3b is completely removed.

(3) Pixel pattern 2p with light-shielding inorganic film pattern 3a obtained in (2) above and lead pattern 2f
The transparent substrate 1 having the same pixel patterns 2p and 2P is processed in the same manner as in (3) of Example 5 to form a lead pattern 21 in the gap between the pixel patterns 2p and 2P as shown in FIG. 3(h).
A product was obtained which had a light-shielding insulating film 4a made of a black cured resin in a region including .

In the method of this embodiment, when forming the pixel pattern 2p as described above, the light-shielding inorganic film pattern 3a, which is resistant to the etching means of the transparent conductive @2, is used as a mask. Since side etching is prevented and the pixel pattern 2p is formed with a more precise shape than in the case of Example 5, the light-shielding insulating film 4a made of black cured resin formed in the gap also has a highly accurate shape. It has the advantage of having a shape.

Example 8 The product obtained in Example 7 and having the light-shielding inorganic film 4a in the gaps between the pixel patterns 2p and 2p on the transparent substrate 1 was treated by the polymer electrodeposition method in the same manner as in Example 6. Figure 3 (
As shown in i), a colored layer 6 is formed on the pixel pattern 2p.
A colored body with a surface was obtained. When this surface colored body is viewed from above, as shown in FIG. 4, a blue colored layer 6B is formed on the pixel pattern of the transparent conductive pattern 11.
Then, a green colored layer 6G is formed on the pixel pattern of the transparent conductive pattern 12, and a red colored layer 6G is further formed on the pixel pattern of the pixel pattern 13 of the transparent conductive pattern 13.
The R's are arranged in a triangle.

In the obtained surface-colored body, the colored layer (6a in FIG. 3(1) and 6B, 6G in FIG. 4).

6R) has a light-shielding insulating film 4a made of a dense black cured resin with excellent precision in shape and size, and is formed in advance on parts other than the pixels where these colored layers are formed. It had excellent dimensional accuracy and was dense, and no color protrusion was observed.

[Effects of the Invention] According to the method for manufacturing a transparent substrate with a transparent conductive pattern of the present invention, a transparent substrate with a transparent conductive pattern having a highly accurate and dense light-shielding insulating film can be obtained.

Further, according to the method for producing a colored surface body of the present invention, it is possible to obtain a colored surface body having a highly accurate and dense colored layer on a transparent conductive pattern and a highly accurate and dense light-shielding insulating film. can.

[Brief explanation of the drawing]

Fig. 1 is a process diagram for manufacturing a transparent substrate having a transparent conductive pattern separated by a light-shielding insulating film, and then producing a colored body on the surface. A process diagram for forming a transparent conductive pattern on a transparent substrate with Figure 4 is a plan view showing an example of the obtained surface-colored body, and Figure 5 is a diagram showing the formation of a transparent conductive pattern on a transparent substrate with a light-shielding inorganic film pattern thereon. This is another process diagram for the process. 1... Transparent substrate, 2... Transparent conductive film, 2a...
Transparent conductive pattern, 2p... Vixel pattern, 2
1... Lead pattern, 3... Light-shielding inorganic film, 3a
, 3b... Light-blocking inorganic film pattern, 4... Curable resin coating containing pigment and/or dye, 4a... Light-blocking insulating film, 5... Ultraviolet light, 6a, 6b, 6g, 6r, 6B,
6G6R...Colored layer, 7,8...Resist film, 7a
, 8b... resist pattern, 11.12.13...
・Transparent conductive pattern applicant Shinto Chemitron Hoya Co., Ltd. Agent Patent attorney Shizuka Nakamura Diagram! ! 11 to 5 Diagram of condolence tatami threatening sound tatami f + f +! 5 Figure Figure Figure 4 Figure Figure Figure Figure

Claims (8)

[Claims] (1) In a method for manufacturing a transparent substrate having a predetermined transparent conductive pattern separated by a light-shielding insulating film, (I) forming a transparent conductive pattern having a light-shielding inorganic film pattern thereon on a transparent substrate; (II) a step of applying a curable resin containing pigment and/or dye on the transparent substrate; (III) exposing the transparent substrate to light from the back side and selecting a curable resin using the light-shielding inorganic film pattern as a mask; (IV) removing an uncured portion of the curable resin to form a light-shielding insulating film made of a colored cured resin; (V) a light-shielding inorganic film pattern on the transparent conductive pattern; A method characterized by sequentially carrying out the step of peeling off. (2) The formation of a transparent conductive pattern with a light-shielding inorganic film pattern on the transparent substrate in step (I) is a step of forming a transparent conductive pattern on the transparent substrate by a predetermined pattern forming means ( a_1) and on the transparent conductive pattern formed in step (a_1),
The method according to claim (1), which is carried out by the method (A) comprising: a step (a_2) of forming a light-shielding inorganic film pattern by a predetermined film forming means. (3) Formation of a transparent conductive pattern with a light-shielding inorganic film pattern on the transparent substrate in step (I) includes forming a transparent conductive film on the transparent substrate, and then forming a transparent conductive pattern on the transparent conductive film. A step (b_1) of forming a light-shielding inorganic film that is resistant to etching means for a transparent conductive film, and then forming a resist film on the light-shielding inorganic film; After selectively exposing and developing the resist film to form a resist pattern, using the resist pattern as a mask, the light-shielding inorganic film is etched by the etching means to form a light-shielding inorganic film pattern; The method (B) according to claim (1), which is carried out by the method (B), comprising a step (b_2) of forming a transparent conductive film pattern by etching the transparent conductive film using the film pattern as a mask using the etching means. Method. (4) The transparent conductive pattern is a triangle pattern or a mosaic pattern, and in step (I),
The method according to claim 1, wherein the light-shielding inorganic film pattern is formed substantially only on the region of the pixel pattern in the transparent conductive pattern. (5) Formation of a light-shielding inorganic film pattern on the pixel pattern area in the transparent conductive pattern is performed by forming a transparent conductive pattern consisting of a pixel pattern and a lead pattern on a transparent substrate using a predetermined pattern forming means. After forming a resist film on the transparent substrate with the transparent conductive pattern obtained in step (c_1), the resist film is selectively exposed and developed to form a lead pattern other than the pixel pattern. a step (c_2) of forming a resist pattern in a region including the resist pattern; and a step (c_2) of forming a light-shielding inorganic film pattern on the pixel pattern in the gap between the resist patterns formed in step (c_2) by a predetermined film forming means. The method according to claim (4), carried out by method (c) comprising: c_3); (6) Formation of a light-shielding inorganic film pattern on the pixel pattern region in the transparent conductive pattern is performed by forming a transparent conductive film on the transparent conductive film after forming the transparent conductive film on the transparent substrate. Step (d_1) of forming a light-shielding inorganic film that is resistant to film etching means, and then forming a resist film on the light-shielding inorganic film; selecting the resist film formed in step (d_1); After exposure and development to form a resist pattern, using the resist pattern as a mask, the light-shielding inorganic film is etched by the etching means to form a light-shielding inorganic film pattern, and then the light-shielding film pattern is used as a mask. a step (d_2) of etching the transparent conductive film using the etching means to form a transparent conductive pattern consisting of a pixel pattern and a lead pattern; After forming a resist film on a transparent substrate with a transparent conductive pattern having a film pattern, selectively exposing and developing the resist film to form a resist pattern in a portion other than the lead pattern having a light-shielding inorganic film pattern, The method according to claim (4), which is carried out by the method (D), which includes a step (d_3) of sequentially removing the exposed light-shielding inorganic film pattern and resist pattern on the lead pattern. . (7) A method for producing a colored surface body having a predetermined transparent conductive pattern on a transparent substrate separated by a light-shielding insulating film, and further having a colored layer on the transparent conductive pattern, comprising: (I ) forming a transparent conductive pattern having a light-shielding inorganic film pattern thereon on a transparent substrate; (II) coating a curable resin containing pigment and/or dye on the transparent substrate; (III) a step of exposing the transparent substrate to light from the back side and selectively curing the curable resin using the light-shielding inorganic film pattern as a mask; (IV) removing the uncured portion of the curable resin to form a light-shielding resin made of a colored hardened resin; (V) peeling off the light-shielding inorganic film pattern on the transparent conductive pattern; and (VI) forming a colored layer on the transparent conductive pattern. How to characterize it. (8) The method according to claim (7), wherein the formation of the colored layer in step (VI) is performed by polymer electrodeposition.