JPH0282597A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0282597A JPH0282597A JP23391488A JP23391488A JPH0282597A JP H0282597 A JPH0282597 A JP H0282597A JP 23391488 A JP23391488 A JP 23391488A JP 23391488 A JP23391488 A JP 23391488A JP H0282597 A JPH0282597 A JP H0282597A
- Authority
- JP
- Japan
- Prior art keywords
- jumper
- conductive paste
- metal foil
- wiring board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 14
- 239000010949 copper Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 5
- 238000007650 screen-printing Methods 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000000839 emulsion Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 241000209761 Avena Species 0.000 description 1
- 235000007319 Avena orientalis Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ラジオ、テレビ、録音機などを量産する際に
使用可能な、プリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed wiring board that can be used in the mass production of radios, televisions, recorders, and the like.
従来の技術
従来、この種のプリント配線板は、第２図に示すような
構成であった。第２図において、１はフェノール樹脂か
らなる絶縁基体であり、２は銅などからなる金属箔であ
り、３は接続を必要としない銅などからなる金属箔２を
被覆したソルダレジストである。このソルダレジスト３
の上に、絶縁性確保の目的で、アンダーコート４を所定
の位置に形成する。2. Description of the Related Art Conventionally, this type of printed wiring board has had a structure as shown in FIG. In FIG. 2, 1 is an insulating substrate made of phenol resin, 2 is a metal foil made of copper or the like, and 3 is a solder resist covering the metal foil 2 made of copper or the like that does not require connection. This solder resist 3
On top of this, an undercoat 4 is formed at a predetermined position for the purpose of ensuring insulation.
そして、導電ペーストを用いたジャンパー６で、アンダ
ーコート４の上を通るように、回路を形成した後、オー
バーコート６を施したものであった。Then, a circuit was formed using a jumper 6 using conductive paste so as to pass over the undercoat 4, and then an overcoat 6 was applied.
発明が解決しようとする課題
しかし、このような従来の構成では、導電ペーストを用
いたジャンパー６部分の総厚みは、銅などからなる金属
箔２．ソルダレジスト３．アンダーコート４およびオー
バーコート６を含め、約１００ミクロンの厚みをもって
いる。したがって、銅などからなる金属箔２．ソルダレ
ジスト３のみの面と導電ペーストを用いたジャンパー６
を含む面とでは絶縁基体１からの高さが異なることにな
る。Problems to be Solved by the Invention However, in such a conventional configuration, the total thickness of the jumper 6 portion using conductive paste is the same as that of the metal foil 2. made of copper or the like. Solder resist 3. It has a thickness of about 100 microns, including undercoat 4 and overcoat 6. Therefore, metal foil made of copper or the like 2. Jumper 6 using only solder resist 3 and conductive paste
The height from the insulating substrate 1 differs from the surface including the surface.
このような同一のプリント配線板内で高さが異な、）だ
状態においては、スクリーン印刷法によりプリント配線
板の銅などからなる金属箔２の近くのン／Ｌ’ダレシス
ト３の面に、チップ部品仮止め用接着剤をのせていく場
合、導電ペーストを用いたジャンパー６の近くのソルダ
レジスト３にのるチップ“部品仮止め用接着剤の量と、
導電ペーストを用いたジャンパー６から離れた場所にあ
るソルダレジスト３にのるチップ“部品仮止め用接着剤
の量とが異なり、同一１リント配線板内でチッソ“部品
仮止め用接着剤の量が異なることによるチップ部品の仮
止め不良が多数発生し、結果的に手修正の工数が増加す
るという問題を有していた。すなわち、チップ部品仮止
め用接着剤の厚みは、従来、スクリーン印刷での版の乳
剤厚で決定されており、約２００ミクロンが経験上、最
も良いとされているが、導電ペーストを用いたジャンパ
ー６の近くにあるソルダレジスト３の上にはスクリーン
版の乳剤厚とアンダーコート４、導電ペーストを用いた
ジャンパー６、オーバーコート６の厚みとの加算された
チップ部品仮止め用接着剤の量が置かれ、方導電ペース
トを用いたジャンパー６から離れた個所のソルダレジス
ト３の上にはスクリーン版の乳剤厚のチップ部品仮止め
用接着剤の量が置かれ、その結果、１００：：クロン程
度のチッソ”部品仮止め用接着剤の高さでのバラツキが
生じることと、このようなバラツキはチッフ゛部品の装
着の安定化に大きな問題を生じるものであった。In such a situation where the heights are different within the same printed wiring board, the chip is printed on the surface of the N/L' dale resist 3 near the metal foil 2 made of copper or the like on the printed wiring board using the screen printing method. When applying adhesive for temporarily fixing components, the amount of adhesive for temporarily fixing components,
The amount of adhesive for temporarily fixing chip components on the solder resist 3 located far from the jumper 6 using conductive paste is different, and the amount of adhesive for temporarily fixing Chisso components on the same 1-lint wiring board is different. This has caused a problem in that many temporary fixing failures of chip parts occur due to differences in the numbers, and as a result, the number of manual correction steps increases. In other words, the thickness of adhesive for temporary bonding of chip components has conventionally been determined by the emulsion thickness of the screen printing plate, and experience has shown that approximately 200 microns is the best thickness, but jumpers using conductive paste On top of the solder resist 3 near point 6, the amount of adhesive for temporarily fixing chip parts is calculated by adding the emulsion thickness of the screen plate and the thickness of undercoat 4, jumper 6 using conductive paste, and overcoat 6. An amount of adhesive for temporary fixing of chip components with the emulsion thickness of the screen plate is placed on the solder resist 3 at a location away from the jumper 6 using conductive paste, and as a result, an amount of adhesive for temporary fixing of chip components is placed on the solder resist 3 at a location away from the jumper 6 using conductive paste. Variations in the height of the adhesive for temporary fixing of Chisso parts have occurred, and these variations have caused a big problem in stabilizing the mounting of Chip parts.
本発明はこのような問題点を解決するもので、簡単な構
成でチップ部品仮止め用接着剤の量を同一プリント配線
板内で均一化することができることを目的とするもので
ある。The present invention is intended to solve these problems, and aims to make it possible to equalize the amount of adhesive for temporarily fixing chip components within the same printed wiring board with a simple structure.
課題を解決するための手段
この課題を解決するために本発明は、チップ部品仮止め
用接着剤が印刷される金属箔ランドに接近する位置に、
他の回路と独立した導電ペーストを用いた疑似のジャン
パーを設けたものである。Means for Solving the Problem In order to solve this problem, the present invention provides an adhesive for temporary fixing of chip components at a position close to the metal foil land on which the adhesive is printed.
This is a pseudo jumper using conductive paste that is independent of other circuits.
作用
この構成により導電ペーストを用いたジャンパーの有無
に起因するソルダレジスト面にのるチップ”部品仮止め
用接着剤の量の不均一を解消して均一化することが可能
となる。Function: With this configuration, it is possible to eliminate and make uniform the amount of adhesive for temporary fixing of chip components on the solder resist surface, which is caused by the presence or absence of a jumper using conductive paste.
実施例 第１図は本発明の一実施例による構成図である。Example FIG. 1 is a configuration diagram according to an embodiment of the present invention.
第１図において７はフェノール樹脂からなる絶縁基体で
あり、８は銅などからなる金属箔であり。In FIG. 1, 7 is an insulating base made of phenol resin, and 8 is a metal foil made of copper or the like.
９は接続を必要としない銅などからなる金属箔８を被覆
したソルダレジストである。プリント配線板上のチッフ
゛部品が実装される銅などからなる金属箔ランド８ａの
近傍に２層目の導電ペーストを用いたジャンパー１０ａ
とその上下にオーバーコート１１とアンダーコート１２
が設けられている。9 is a solder resist covering a metal foil 8 made of copper or the like that does not require connection. A jumper 10a using a second layer of conductive paste is placed near a metal foil land 8a made of copper or the like on which a chip component is mounted on a printed wiring board.
and overcoat 11 and undercoat 12 above and below it.
is provided.
一方、上記導電ペーストを用いたジャンパー１０ａから
離れた個所に銅などからなる金属箔ランド８ｂが存在す
る。上記の導電ペーストを用いたジャンパー１０ａとは
別に銅などからなる金属箔ランド８ｂに接近するように
導電ペーストを用いた疑似のジャンパー１０ｂとその上
下にオーバーコート１１とアンダーコート１２を構成す
る。したがって、スクリーン印刷によるチップ部品仮止
め用接着剤の量は導電ペーストを用いたジャンパー１０
！Ｌと導電ペーストを用いた疑似のジャンパー１０ｂの
周辺においてほぼ一定にすることができる。なお、この
導電ペーストを用いた疑似のジャンパー１０１）は、本
来の目的に使用する導電ペーストを用いたジャンパー１
０１Ｌと全く同じ工法で同時に構成することのできるも
のであり、プリント配線板の作成工程になんらの影響を
与えるものではない。On the other hand, a metal foil land 8b made of copper or the like is present at a location away from the jumper 10a using the conductive paste. In addition to the jumper 10a using the conductive paste described above, a pseudo jumper 10b using the conductive paste is constructed so as to be close to the metal foil land 8b made of copper or the like, and an overcoat 11 and an undercoat 12 are formed above and below the jumper 10b. Therefore, the amount of adhesive for temporarily fixing chip parts by screen printing is 100% for jumpers using conductive paste.
! It can be made almost constant around the pseudo jumper 10b using L and conductive paste. Note that this pseudo jumper 101) using conductive paste is different from the jumper 1 using conductive paste used for its original purpose.
It can be constructed at the same time using exactly the same method as 01L, and does not affect the printed wiring board manufacturing process in any way.
発明の効果
以上のように本発明によれば、２層以上の構造により構
成されるプリント配線板上の導電ペーストを用いたジャ
ンパーをチッソ”部品仮止め用接着剤が置かれる近傍に
配置することにより、従来のスクリーン印刷におけるチ
ップ部品仮止め用接着剤の厚み幅量のバラツキを大幅に
少なくすることのできるものであり、しかも導電ペース
トを用いたジャンパーの作成工程に何らの変化を与える
ことなく安価な方法でチップ部品の装着の品質良化をも
たらすという効果が得られる。Effects of the Invention As described above, according to the present invention, a jumper using a conductive paste on a printed wiring board having a structure of two or more layers is placed in the vicinity of where the adhesive for temporary fixing of parts is placed. As a result, it is possible to significantly reduce variations in the thickness and width of adhesives for temporarily fixing chip components in conventional screen printing, and without making any changes to the process of creating jumpers using conductive paste. The effect of improving the quality of chip component mounting can be obtained using an inexpensive method.
第１図は本発明の一実施例の導電ペーストを用いたジャ
ンパーを有したプリント配線板の要部拡大断面図、第２
図は従来の導電ペーストを用いたジャンパーを有したプ
リント配線板の要部拡大断面図である。
７・・・・・・フェノール樹脂からなる絶縁基体、８ａ
。
８ｂ・・・・・・銅などからなる金属箔ランド、９・・
・・・・ソルダレジスト、１０ａ、１０ｂ・・・・・・
導電ペーストを用いたジャンパー、１１・・・・・・オ
ーツ（−コート、１２・・・・・・アンダーコート。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名−５
；FIG. 1 is an enlarged cross-sectional view of a main part of a printed wiring board having a jumper using a conductive paste according to an embodiment of the present invention, and FIG.
The figure is an enlarged sectional view of a main part of a printed wiring board having a jumper using a conventional conductive paste. 7...Insulating base made of phenolic resin, 8a
. 8b...Metal foil land made of copper etc., 9...
...Solder resist, 10a, 10b...
Jumper using conductive paste, 11... Oats (-coat, 12... Undercoat. Name of agent: Patent attorney Shigetaka Awano and 1 other person -5
;
Claims (1)
ンを形成する金属箔と絶縁され、他の金属箔と電気的に
接続される導電ペーストを用いたジャンパーを配置する
とともに、チップ部品仮止め用接着剤が印刷される金属
箔ランドに接近する位置に、他の回路と独立した導電ペ
ーストを用いた疑似のジャンパーを設けたプリント配線
板。On the insulating substrate on which a conductive pattern is formed, a jumper using conductive paste is placed, which is insulated from the metal foil forming a certain conductive pattern and electrically connected to other metal foil, and an adhesive for temporarily fixing the chip components is placed. A printed wiring board that has a pseudo jumper made of conductive paste that is independent of other circuits in a position close to the metal foil land where the agent is printed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23391488A JPH0282597A (en) | 1988-09-19 | 1988-09-19 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23391488A JPH0282597A (en) | 1988-09-19 | 1988-09-19 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282597A true JPH0282597A (en) | 1990-03-23 |
Family
ID=16962572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23391488A Pending JPH0282597A (en) | 1988-09-19 | 1988-09-19 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282597A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0461850U (en) * | 1990-10-03 | 1992-05-27 |
-
1988
- 1988-09-19 JP JP23391488A patent/JPH0282597A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0461850U (en) * | 1990-10-03 | 1992-05-27 |
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