JPH0282037U - - Google Patents

Info

Publication number
JPH0282037U
JPH0282037U JP1988161926U JP16192688U JPH0282037U JP H0282037 U JPH0282037 U JP H0282037U JP 1988161926 U JP1988161926 U JP 1988161926U JP 16192688 U JP16192688 U JP 16192688U JP H0282037 U JPH0282037 U JP H0282037U
Authority
JP
Japan
Prior art keywords
frame
suspender
device hole
hole
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988161926U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988161926U priority Critical patent/JPH0282037U/ja
Publication of JPH0282037U publication Critical patent/JPH0282037U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1988161926U 1988-12-13 1988-12-13 Pending JPH0282037U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988161926U JPH0282037U (ko) 1988-12-13 1988-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988161926U JPH0282037U (ko) 1988-12-13 1988-12-13

Publications (1)

Publication Number Publication Date
JPH0282037U true JPH0282037U (ko) 1990-06-25

Family

ID=31445291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988161926U Pending JPH0282037U (ko) 1988-12-13 1988-12-13

Country Status (1)

Country Link
JP (1) JPH0282037U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330354A (ja) * 1995-06-05 1996-12-13 Nec Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330354A (ja) * 1995-06-05 1996-12-13 Nec Corp 半導体装置

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