JPH02146847U - - Google Patents
Info
- Publication number
- JPH02146847U JPH02146847U JP5495289U JP5495289U JPH02146847U JP H02146847 U JPH02146847 U JP H02146847U JP 5495289 U JP5495289 U JP 5495289U JP 5495289 U JP5495289 U JP 5495289U JP H02146847 U JPH02146847 U JP H02146847U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- attached
- lead
- area
- connects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5495289U JPH0720925Y2 (ja) | 1989-05-12 | 1989-05-12 | リードフレーム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5495289U JPH0720925Y2 (ja) | 1989-05-12 | 1989-05-12 | リードフレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02146847U true JPH02146847U (ko) | 1990-12-13 |
JPH0720925Y2 JPH0720925Y2 (ja) | 1995-05-15 |
Family
ID=31577473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5495289U Expired - Lifetime JPH0720925Y2 (ja) | 1989-05-12 | 1989-05-12 | リードフレーム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0720925Y2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008545278A (ja) * | 2005-06-30 | 2008-12-11 | サンディスク コーポレイション | 非対称なリードフレームコネクションを有するダイパッケージ |
-
1989
- 1989-05-12 JP JP5495289U patent/JPH0720925Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008545278A (ja) * | 2005-06-30 | 2008-12-11 | サンディスク コーポレイション | 非対称なリードフレームコネクションを有するダイパッケージ |
Also Published As
Publication number | Publication date |
---|---|
JPH0720925Y2 (ja) | 1995-05-15 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |