JPH028137U - - Google Patents
Info
- Publication number
- JPH028137U JPH028137U JP8565288U JP8565288U JPH028137U JP H028137 U JPH028137 U JP H028137U JP 8565288 U JP8565288 U JP 8565288U JP 8565288 U JP8565288 U JP 8565288U JP H028137 U JPH028137 U JP H028137U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- wiring
- parallel conductor
- parallel
- conductor portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8565288U JPH028137U (ru) | 1988-06-28 | 1988-06-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8565288U JPH028137U (ru) | 1988-06-28 | 1988-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH028137U true JPH028137U (ru) | 1990-01-19 |
Family
ID=31310305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8565288U Pending JPH028137U (ru) | 1988-06-28 | 1988-06-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH028137U (ru) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005024950A1 (ja) * | 2003-09-05 | 2005-03-17 | Fujitsu Limited | 半導体装置及びその製造方法 |
-
1988
- 1988-06-28 JP JP8565288U patent/JPH028137U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005024950A1 (ja) * | 2003-09-05 | 2005-03-17 | Fujitsu Limited | 半導体装置及びその製造方法 |
JPWO2005024950A1 (ja) * | 2003-09-05 | 2006-11-16 | 富士通株式会社 | 半導体装置及びその製造方法 |
CN100390999C (zh) * | 2003-09-05 | 2008-05-28 | 富士通株式会社 | 半导体装置及其制造方法 |
JP4500262B2 (ja) * | 2003-09-05 | 2010-07-14 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |