JPH0280974A - Package inspection apparatus - Google Patents

Abstract

PURPOSE:To easily adjust the volume mounted on a package to be tested if necessary by inputting a signal from both surfaces of the package to be tested loaded with a dip type IC and a flat type IC and easily observing an output signal by an oscilloscope. CONSTITUTION:The package mount plate 10 of a package inspection apparatus is equipped with a plurality of solder surface input probe pins 12 and solder surface output probe pins 11 called the bed-of-nails in contact with the solder surface of a package 4 to be tested. Further, a package press plate 15 is equipped with a plurality of part surface probe pins 14, 13 and these pins can be brought into contact with the terminal of a flat type IC. Furthermore, a plurality of volume holes are provided on the package press plate 15 at the positions corresponding to the volumes 5 mounted on the package 4 and the package mount plate 10 is connected in a freely openable and closable manner by the rotary shaft 16 provided to a fixed stand 18 and, when the package 4 is tested, the package 4 is mounted on the package mount plate 10.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is used to relay between the package under test and a package testing machine when testing a package in which necessary electronic components are mounted on a printed wiring board. The present invention relates to a package inspection device.

[Conventional technology]

Conventional package inspection means for testing a package under test in which a plurality of adjustment volumes are mounted, as illustrated in FIG. is input to the connector 33 of the package under test 4 via a flat cable 32 equipped in the package tester 31. The output signal of the package under test 4 is output to the check terminal or output connector mounted on the package under test 4, so contact the oscilloscope probe to the check terminal or output connector to check the output. While observing the signal waveform, turn the volume 5.
Make adjustments. Further, when the circuit in the package under test 5 forms a closed loop, a specific signal line is set to high impedance, and an input signal is inputted from a check terminal provided for input signals. However, with the conventional package inspection means described above, as packages become smaller, check terminals for input/output mounted on the package have been removed, so it is difficult to adjust the volume and test the package alone. It is becoming difficult to do so.

[Problem to be solved by the invention]

The problem to be solved by the present invention is to solve the problems of the conventional package inspection means as described above. Therefore, the purpose of the present invention is to When investigating or inspecting a package under test that has been
An object of the present invention is to provide a package inspection device that can easily perform a function test including volume adjustment on a single package.

[Means to solve the problem]

The package inspection apparatus of the present invention includes a plurality of solder side input probe pins that carry a package under test and contact terminals on the solder side of the package under test to transmit input signals output from the package tester; A package mounting plate having a plurality of solder surface output probe pins for extracting output signals from the package and the package under test mounted on the package mounting plate are pressed and fixed to contact terminals on the component side of the package under test. and a plurality of component surface input probe pins for transmitting input signals from the package testing machine and a plurality of component surface output probe pins for extracting output signals from the package under test. Equipped with a package holding plate with volume holes at corresponding positions,
The package mounting plate is configured to be fixed and held in a horizontal position and a vertical position.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a front view showing an embodiment of the present invention, showing the state when the package under test 4 is being tested, and FIG. 2 is a front view showing the state when the package under test 4 is being tested in the embodiment of FIG. FIG.

The package mounting plate 10 of the package inspection apparatus shown in FIG. It is equipped with a surface input probe pin 12 and a solder surface output probe pin 11. The package holding plate 15 is also equipped with a plurality of component surface input probe pins 14 and component surface output probe pins, which can contact the terminals of the flat IC. In addition, the package holding plate 15 includes
A plurality of volume holes 17 are provided at positions corresponding to the volumes 5 mounted on the package under test 4.

The package mounting plate 10 is connected to the fixing base 18 by a rotating shaft 16 provided on the upper part thereof so as to be openable and closable.

Next, a method of testing the package under test 4 using the package testing apparatus configured as described above will be described with reference to FIGS. 1 and 2.

As shown in FIG. 2, place the package under test 4 on the package mounting plate 10 with the package mounting plate 10 in a horizontal position, attach the package holding plate 14 from above, and press the package 4 under test to fix it. do. At this time, the solder side input probe pin 11 and the solder side output probe pin 12 provided on the package mounting board 10 connect the terminals of the individual electronic components of the package under test 4 to the solder side (
(the surface opposite to the surface on which the component is mounted) makes contact. In addition, the component surface input probe pin 13 and component surface output probe pin 14 provided on the package holding plate 15 are connected to a flat type IC mounted on the component surface of the package under test 4.
or other terminals.

Next, as shown in FIG. 1, the package mounting plate 10 is placed in a vertical state, and the fixed shaft stop 21 provided at the bottom of the fixing base 18 and the rotation stop 22 provided at the tip of the extension of the package mounting plate The package mounting plate 10 is fixed in a vertical position by engaging with the package mounting plate 10. Solder side output probe pin 11 installed on package mounting plate 10 fixed in vertical position
and the component surface output probe pin 13 equipped on the package holding plate 15, and insert the adjustment screwdriver through the volume hole 17 of the package holding plate 15, and adjust the volume 5 while observing the waveform. Adjust.

〔Effect of the invention〕

As explained above, by using the package inspection device of the present invention, input signals can be input from both sides of the package under test on which dip-type or flat-type ICs are mounted, and output signals can be easily detected using an oscilloscope or the like. This has the advantage that it can be observed, and the volume installed in the package under test can be easily adjusted if necessary. Another advantage is that the above-described test can be performed without mounting a check terminal for checking input/output signals on the package under test.

[Brief explanation of the drawing]

FIG. 1 is a front view showing one embodiment of the present invention, and FIG. 2 is a front view showing one embodiment of the present invention.
FIG. 3 is a front view showing a state in which a package under test is being attached and detached in the illustrated embodiment, and FIG. 3 is a perspective view showing an example of a conventional package inspection apparatus. 2...Package testing machine, 10...Package mounting plate, 11...Solder surface input probe pin, 12...
Solder side output probe pin, 13... Component side input probe pin, 14... Component side output probe pin, 15.
...Package holding plate, 16... Rotating shaft, 17...
volume hole.

Claims (1)

[Claims] A plurality of solder side input probe pins that carry a package under test and contact terminals on the solder side of the package under test to transmit input signals input from the package tester, and a plurality of probe pins that take out output signals of the package under test. A package mounting plate having a solder side output probe pin and the package under test mounted on the package mounting plate are pressed and fixed, and input from the package testing machine is made by contacting the terminals on the component side of the package under test. It has a plurality of component surface input probe pins for transmitting signals and a plurality of component surface output probe pins for taking out output signals of the package under test, and has a volume hole at a position corresponding to the volume mounted on the package under test. 1. A package inspection device comprising: a package holding plate, and configured to be able to fix and hold the package mounting plate in a horizontal position and a vertical position.