JPH0277870U - - Google Patents
Info
- Publication number
- JPH0277870U JPH0277870U JP15791788U JP15791788U JPH0277870U JP H0277870 U JPH0277870 U JP H0277870U JP 15791788 U JP15791788 U JP 15791788U JP 15791788 U JP15791788 U JP 15791788U JP H0277870 U JPH0277870 U JP H0277870U
- Authority
- JP
- Japan
- Prior art keywords
- bent
- semiconductor device
- right angles
- electrode
- central
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図はこの考案の一実施例による電極の斜視
図、第２図ａ〜ｃは第１図の電極の配線パターン
との接合部の正面図、側面図および平面図、第３
図は第２図の展開図、第４図は従来の複数の回路
構成部品よりなる半導体装置の断面図、第５図は
従来の電極の斜視図である。図中、３は配線パタ
ーン、６は電極、６ａ〜６ｃは電極６の折り曲げ
部を示す。なお、図中、同一符号は同一、または
相当部分を示す。
FIG. 1 is a perspective view of an electrode according to an embodiment of the invention, FIGS.
The figure is a developed view of FIG. 2, FIG. 4 is a sectional view of a conventional semiconductor device comprising a plurality of circuit components, and FIG. 5 is a perspective view of a conventional electrode. In the figure, 3 indicates a wiring pattern, 6 indicates an electrode, and 6a to 6c indicate a bent portion of the electrode 6. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
り機器の電圧・電流制御に用いられる半導体装置
において、その構成部品の１つである電極を配線
パターンに接合する下端部で３つの折り曲げ部分
を設け、中央の部分は従来通り直角に折り曲げる
が、両側の２つの部分は中央部の折り曲げた部分
の側面側に来るように、中央部の折り曲げ部より
上側で互いに向かい合うように直角に折り曲げた
部分を設けたことを特徴とする半導体装置。 In a semiconductor device that consists of multiple circuit components mounted on a substrate and is used to control the voltage and current of equipment, three bent portions are formed at the lower end where an electrode, one of the components, is joined to the wiring pattern. The central part is bent at right angles as before, but the two parts on both sides are bent at right angles so that they face each other above the central folded part. A semiconductor device characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15791788U JPH0277870U (en) | 1988-12-02 | 1988-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15791788U JPH0277870U (en) | 1988-12-02 | 1988-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0277870U true JPH0277870U (en) | 1990-06-14 |
Family
ID=31437776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15791788U Pending JPH0277870U (en) | 1988-12-02 | 1988-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0277870U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022208603A1 (en) * | 2021-03-29 | 2022-10-06 | 三菱電機株式会社 | Semiconductor device |
-
1988
- 1988-12-02 JP JP15791788U patent/JPH0277870U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022208603A1 (en) * | 2021-03-29 | 2022-10-06 | 三菱電機株式会社 | Semiconductor device |