JPH0275791U - - Google Patents

Info

Publication number
JPH0275791U
JPH0275791U JP1988154603U JP15460388U JPH0275791U JP H0275791 U JPH0275791 U JP H0275791U JP 1988154603 U JP1988154603 U JP 1988154603U JP 15460388 U JP15460388 U JP 15460388U JP H0275791 U JPH0275791 U JP H0275791U
Authority
JP
Japan
Prior art keywords
heat sink
circuit board
circuit device
elongated
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988154603U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988154603U priority Critical patent/JPH0275791U/ja
Priority to EP89312288A priority patent/EP0371727B1/en
Priority to US07/441,288 priority patent/US5051866A/en
Priority to DE68913014T priority patent/DE68913014T2/de
Publication of JPH0275791U publication Critical patent/JPH0275791U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electrophotography Configuration And Component (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Or Security For Electrophotography (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の一実施例に係る電源回路
装置２０の斜視図であり、装置のベースに取付る
時の様子が示されている。第２図は、複写機１０
内におけるこの考案に係る電源回路装置２０の占
めるスペースを図解的に示す図である。第３図は
、従来の電源回路装置の例を示す斜視図である。
第４図は、複写機の機体６に設けられた従来の電
源回路装置設置スペースを示す図解図である。 図において、１０……複写機の機体、２０……
電源回路装置、２１……プリント基板、２２……
放熱板、２３……入力コネクタ、２４……出力コ
ネクタ、２５，２６，２７，２８，２９，３０，
３１……発熱素子、を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 入力部、出力部および放熱板を必要とする複
    数個の発熱素子が回路基板に備えられており、前
    記複数個の発熱素子は放熱板に取付けられている
    電源回路装置において、 前記放熱板は、前記複数個の発熱素子を、それ
    ぞれ、必要な間隔を開けて１列配置で取付けるこ
    とができるように、十分に長細い形状にされてお
    り、 前記回路基板は、前記放熱板の長さに対応した
    長細い形状にされており、 前記入力部は、前記長細い回路基板の長手方向
    の一端に備えられ、前記出力部は、前記長細い回
    路基板の長手方向の他端に備えられており、入力
    部と出力部とは十分に離されていることを特徴と
    する、電源回路装置。 ２ 請求項第１項記載の電源回路装置において、 前記放熱板は、取付板を兼用されていることを
    特徴とする。
JP1988154603U 1988-11-28 1988-11-28 Pending JPH0275791U (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1988154603U JPH0275791U (ja) 1988-11-28 1988-11-28
EP89312288A EP0371727B1 (en) 1988-11-28 1989-11-27 Power circuit device
US07/441,288 US5051866A (en) 1988-11-28 1989-11-27 Power circuit device for an image-forming apparatus
DE68913014T DE68913014T2 (de) 1988-11-28 1989-11-27 Leistungsschaltungsvorrichtung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988154603U JPH0275791U (ja) 1988-11-28 1988-11-28

Publications (1)

Publication Number Publication Date
JPH0275791U true JPH0275791U (ja) 1990-06-11

Family

ID=15587794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988154603U Pending JPH0275791U (ja) 1988-11-28 1988-11-28

Country Status (4)

Country Link
US (1) US5051866A (ja)
EP (1) EP0371727B1 (ja)
JP (1) JPH0275791U (ja)
DE (1) DE68913014T2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006209025A (ja) * 2005-01-31 2006-08-10 Kyocera Mita Corp 冷却構造およびこの冷却構造を備えた画像形成装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02122759A (ja) * 1988-10-31 1990-05-10 Fuji Xerox Co Ltd 画像記録装置の放熱装置
US5136329A (en) * 1989-12-21 1992-08-04 Canon Kabushiki Kaisha Image forming apparatus capable of utilizing excess heat
JP3548183B2 (ja) * 1991-07-09 2004-07-28 キヤノン株式会社 画像形成装置
US5243493A (en) * 1992-04-29 1993-09-07 Industrial Technology Research Institute Fanless convection cooling design for personal computers
US5748446A (en) * 1996-12-11 1998-05-05 Intel Corporation Heat sink support
US7266321B2 (en) * 2002-09-30 2007-09-04 Samsung Electronics Co., Ltd. Apparatus for supplying voltage to developing device
US8411451B2 (en) * 2008-07-30 2013-04-02 Panasonic Corporation Power line communication apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS585392B2 (ja) * 1973-12-10 1983-01-31 セイコーエプソン株式会社 コガタゴウリカスイシヨウドケイ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2552682A1 (de) * 1975-11-24 1977-06-02 Gas Ges Fuer Antriebs U Steuer Gehaeuse- und kuehlkoerpersystem fuer elektronische schaltungen
JPS60256262A (ja) * 1984-06-01 1985-12-17 Toshiba Corp 画像形成装置
FR2578710B1 (fr) * 1985-03-07 1988-03-04 Bendix Electronics Sa Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance
DE3545253A1 (de) * 1985-12-20 1987-06-25 Philips Patentverwaltung Einrichtung und verfahren zur montage von waermeerzeugenden bauelementen in einem gehaeuse
US4905123A (en) * 1987-10-08 1990-02-27 Navistar International Transportation Corp. Heat sink bus assembly
GB8724263D0 (en) * 1987-10-15 1987-11-18 Bicc Plc Electronic enclosure cooling system
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS585392B2 (ja) * 1973-12-10 1983-01-31 セイコーエプソン株式会社 コガタゴウリカスイシヨウドケイ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006209025A (ja) * 2005-01-31 2006-08-10 Kyocera Mita Corp 冷却構造およびこの冷却構造を備えた画像形成装置
JP4647323B2 (ja) * 2005-01-31 2011-03-09 京セラミタ株式会社 冷却構造およびこの冷却構造を備えた画像形成装置

Also Published As

Publication number Publication date
DE68913014T2 (de) 1994-06-16
DE68913014D1 (de) 1994-03-24
EP0371727A1 (en) 1990-06-06
EP0371727B1 (en) 1994-02-09
US5051866A (en) 1991-09-24

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